JPS59195836A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS59195836A
JPS59195836A JP58070619A JP7061983A JPS59195836A JP S59195836 A JPS59195836 A JP S59195836A JP 58070619 A JP58070619 A JP 58070619A JP 7061983 A JP7061983 A JP 7061983A JP S59195836 A JPS59195836 A JP S59195836A
Authority
JP
Japan
Prior art keywords
wire
bonding
bond
carried out
bonding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58070619A
Other languages
English (en)
Inventor
Masanori Yagino
正典 八木野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP58070619A priority Critical patent/JPS59195836A/ja
Publication of JPS59195836A publication Critical patent/JPS59195836A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
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    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electronic Switches (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 産業上の利用分野 本発明はサーマルヘッドの接続等に使用して好適なワイ
ヤボンディング方法に関する。
背景技術とその問題点 従来、感熱記録用のサーマルヘッドにおいては、各発熱
体と配線パターンとの接続にワイヤがンデイングを用い
ていた。
このようなサーマルヘッドの構成例を第１図に示す。こ
の第１図において（１）は発熱体支持基体を示し、この
発熱体支持基体（１）はガラスまたはセラミックから成
９、その円筒状端面に多数の発熱体（２）が４本／叫の
ピッチで並列に配設されており、何個の発熱体（２）に
はその両側にアルミニウムの電極（３）が接続配設され
ている。この場合サーマルヘッドの印字幅が１２８ｍｍ
のときは、発熱体（２）の総数は４本／叫ピッチで５１
２本となる。また、この基体（１）の発熱体（２）と反
対側の端面には溝（４）が設けである。
（５）は放熱板を示し、この放熱板（５）はアルミニウ
ムまたは鉄から成シ、その一端に設けられた突条（６）
が発熱体支持基体（１）の溝（４）と保合接着される。
この場合、基体（１）と放熱板（５）との間の常温硬化
型接着剤は熱による歪の吸収も兼ねている。（７）は所
定の配線パターン（８）か形成されたプリント基板を示
し、このプリント基板（７）はガラスエポキシ銅張積層
板から作られ、放熱板（５）の両面にエポキシ系接着剤
を用いて接着されている。基板（７）上の配線パターン
（８）は銅の上にニッケル５ミクロン及び金２ミクロン
が鍍金されている。（９）はビンディング用ワイヤを示
し、このワイヤ（９）は例えば直径２５ミクロンの金線
であって、その第１がンド（９ａ）を電極（３）に、第
２ボンド（９ｂ）を配線パターン（８）に、サーモソニ
ックボンディング法によってそれぞれ行ない、各電極（
３）と対応する配線ノ４ターン（８）部とを接続する。
この場合、ワイヤ（９）の第１ポンド（９ａ）は、水素
焔で熔融されて球状となっているワイヤの先端を圧着す
るので、電極（３）との接合部の直径が例えば約１００
ミクロンとワイヤ径に比べてかなシ大きくなっている。
しかしながら、ワイヤ（９）の第２ボンド（９ｂ）は単
にワイヤを線径の２〜３倍程度の長さにわたって配線パ
ターン（８）に圧着するだけであるからその接合面積は
比較的小さい。また、基体（１）と放熱板（５）とを接
着している常温硬化型接着剤の耐熱性を考慮して、ボン
ディング時の電極（３）及びパターン（８）の光面温度
は１００〜１１０℃と比較的低温に設定される。このよ
うにして形成されたワイヤボンディング部は図示されな
いシリコーン樹脂で被覆封止される。
このサーマルヘッドを動作させると、上述のがンデイン
グ部は印字期間に間欠的に加熱されて〜その温度は大幅
に変化する。そして、この温度サイクルによって、ワイ
ヤの第２７］ｉンド（９ｂ）がノぐターン（８）から剥
離することがある。これは、第２．ポンド（９ｂ）のボ
ンディング部の面積が小さいこと１ボンディング時の温
度が低いこと、更には基板硬度・加圧・超音波エネルギ
ー等の許容範囲が狭いこと等によるものである。
ちなみに従来のワイヤボンディング方法によるサーマル
゛ヘッド１０ケを試料として、通電３０秒・非通電１分
のサイクルで強制劣化試験を行なったところ、１６０サ
イクルで１ヘツドについて４〜２０本のボンド剥離を生
じた。
両側で１０２４本のボンディングワイヤに１本でも剥離
（断線）が発生すればそのサーマルヘッドは不良品とな
ってしまうので、サーマルヘッドにおけるワイヤデンデ
ィングの信頼性は大きな問題になっていた。
発明の目的 本発明はこの点に鑑み、信頼性の高いワイヤボンディン
グ方法を提供することを目的とする。
発明の概要 本発明は第１及び第２の導電部を金属細線で接続するワ
イヤデンディング方法において、第１の会嘱看鴫漠母母
金属細線の第１７１？ンドを第１の導電部に行うと共に
、第１の金属細線の第２７Ｉ？ンドを第２の導電部に行
い、この第２の導電部に行なった第１の金属細線の第２
．Ｉ？ボンド重複させて第２の金属細線の第１ボンドを
行うようにしたので、ボンディング時の基板温度を高く
することなく、第１の金属細線の第２ボンドを強固にす
ることができ信頼性の高いワイヤデンディングを行なう
ことができる。
実施例 以下、第２図を参照しながら、本発明ワイヤボンディン
グ方法の一実施例について説明しよう。
第２図に本発明を実施したサーマルヘッドの要部を示す
。この第２図において、第１図に対応する部分には同一
の符号を付して重複説明を省略する。
第２図において、（９）は第１のワイヤを示し、従来ノ
ホンデイング方法と同様に、この第１のワイヤ（９）の
第１ぎンド（９ａ）を電極（３）に行ない、第１のワイ
ヤ（９）の第２ボンドを・ぐターン（８）に行なう。α
Ｑは第２のざンデイング用ワイヤを示し、このワイヤ（
１０は第１のワイヤ（９）と同じく直径２５ミクロンの
金線であって、その第１ボンドをパターン（８）上の第
１のワイヤ（９）の第２ボンドに重複させて行なイ、更
に第２のワイヤαＱの第２ボンド（１０ｂ）　ヲノｆタ
ーン（う）の適宜の場所に行なう。この場合、第２のワ
イヤαＯの第１がンド（１０ａ）も、第１のワイヤ（９
）の第１ポンド（９ａ）と同様に、ワイヤ先端の球状部
を圧着するので接合部の面積は太きい。その他の諸条件
は従来の方法による場合と同一に設定しである。
このように第１のワイヤ（９）の第２ボンド（９ｂ）に
第２のワイヤ０Ｑの第１ｒンド（１０ａ）を重複させる
と両ワイヤは相互によく圧着し、且つｌ？ターン（８）
との接合面積が大きくなって、強固なデンディングを行
なうことができる。
本例によるボンディングと従来方法１によるデンディン
グとの強度を比較したところ、次のようであった。
Ａ、引張強度試験　（試料数ｎ＝５００）従来方法によ
るもの　　２．５〜９．０グラム本発明によるもの　　
　８．０〜９．０グラムＢ、温度サイクル試験　（試料
ヘッド数ｎ＝１０）条件ニー２５℃に３０分間保ち、次
に＋８５℃まで上昇させ、＋８５℃に３０分間保ち、更
に＝２５℃まで下降させる（１周期３時間）サイクルを
５００回繰返す。
従来方法によるヘッド　　全数にポンド剥離発生本発明
によるヘッド　　全数にプント剥離なし更に落下試験（
高さ１メートルから厚さ３０＋ｎｍの座板に落下、Ｘ−
Ｙ方向各１０回）、振動試験（１０〜５５Ｈｚ掃引周期
１分、振幅１．５霧、Ｘ−Ｙ−Ｚ各方向２時間）及び耐
湿試験（４０℃、９０％相対湿度、５００時間）を行な
ってもボンド剥離の発生は皆無であり、本発明方法によ
るボンディングの信頼性が高いことが確かめられた。
発明の効果 以上詳述のように、本発明ワイヤボンディング方法によ
れば、第１のワイヤの第２ボンドに第２のワイヤの第１
ボンドを重複させるようにしたので、ボンディング時の
基板温度を高くすることなく第１のワイヤの第２ポンド
を強固にすることができ、信頼性の高いボンディングを
行なうことができる。
【図面の簡単な説明】
第１図は従来のワイヤボンディング方法を用いたサーマ
ルヘッドを示す余１視図、第２図は本発明ワイヤデンデ
ィング法を用いたサーマルヘッドの要部を示す斜視図で
ある。 （２）は発熱体、（３）は電極、（７）はプリント基板
、（８）は配線ハターン、（９）及び（ＩＧはボンディ
ングワイヤである。

Claims (1)

    【特許請求の範囲】
  1. 第１及び第２の導電部を金属細線で接続するワイヤポン
    ディング方法において、第１の金属細線の第１がンドを
    上記第１の導電部に行うと共に、上記第１の金属細線の
    第２雇ンド全上記第２の導電部に行い、上記第２の導電
    部に行なった上記第１の金属細線の第２ボンドに重複さ
    せて第２の金属細線の第１プントを行うようにしたこと
    を特徴とするワイヤボンディング方法。
JP58070619A 1983-04-21 1983-04-21 ワイヤボンデイング方法 Pending JPS59195836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58070619A JPS59195836A (ja) 1983-04-21 1983-04-21 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58070619A JPS59195836A (ja) 1983-04-21 1983-04-21 ワイヤボンデイング方法

Publications (1)

Publication Number Publication Date
JPS59195836A true JPS59195836A (ja) 1984-11-07

Family

ID=13436799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58070619A Pending JPS59195836A (ja) 1983-04-21 1983-04-21 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59195836A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999062114A1 (de) * 1998-05-27 1999-12-02 Robert Bosch Gmbh Verfahren und kontaktstelle zur herstellung einer bond-draht-verbindung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999062114A1 (de) * 1998-05-27 1999-12-02 Robert Bosch Gmbh Verfahren und kontaktstelle zur herstellung einer bond-draht-verbindung
US6477768B1 (en) 1998-05-27 2002-11-12 Robert Bosch Gmbh Method and contact point for establishing an electrical connection
US7083077B2 (en) 1998-05-27 2006-08-01 Robert Bosch Gmbh Method and contact point for establishing an electrical connection
US7906858B2 (en) 1998-05-27 2011-03-15 Robert Bosch Gmbh Contact securing element for bonding a contact wire and for establishing an electrical connection

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