JPS59188952A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPS59188952A
JPS59188952A JP6431683A JP6431683A JPS59188952A JP S59188952 A JPS59188952 A JP S59188952A JP 6431683 A JP6431683 A JP 6431683A JP 6431683 A JP6431683 A JP 6431683A JP S59188952 A JPS59188952 A JP S59188952A
Authority
JP
Japan
Prior art keywords
plating
lead frame
metal strip
partial
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6431683A
Other languages
Japanese (ja)
Other versions
JPH0135503B2 (en
Inventor
Yukitomo Tsukada
塚田 幸朝
Yoshiharu Koizumi
祥治 小泉
Tomoyuki Karasawa
唐澤 与幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP6431683A priority Critical patent/JPS59188952A/en
Publication of JPS59188952A publication Critical patent/JPS59188952A/en
Publication of JPH0135503B2 publication Critical patent/JPH0135503B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582Metallic layers on lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To enable to immediately confirm when the positional slippage of plating generates by a method wherein the position indicating parts of penetration holes, etc. showing the boundary of the plated region are previously formed at the place other than the part becoming a lead frame form of a metallic band strip. CONSTITUTION:The position indicating parts 12 are provided on the metallic band strip 10 in the longitudinal direction at fixed intervals and surround the plated regions 14 of partial plating to be applied, consisting of a plurality of penetration holes bored in the place other than the part becoming the lead frame form. The metallic band strip 10 thus previously provided with the indicating parts 12 showing the boundary of the region 14 is made to run in a series of plating processes, thus applying the partial plating in the regions 14. Such a manufacture enables to judge it even by visual observation at a glace whether the partial plating is exactly applied to a desired plated region or not and then enables to immediately cope with the accident in the case of the slippage of plating position.

Description

【発明の詳細な説明】 本発明はリードフレームの製造方法に関し、一層詳細に
は、金属帯条をプレス加工等によりリードフレーム形状
に形成する前に、金属帯条の段階であらかじめその内部
リード部、素子付部、外部リード部等となるべき部分の
めっき必要個所に部会めつきを施し、しかる後プレス加
工等によってリードフレーム形状に形成するものにおい
て、部分めっきを施す前に、施すべき部分めっきの領域
の境界を示す透孔等の位置表示部を設けておき、施され
る部分めっき位置が正確であるか否かを一目瞭然に確認
でき、めっき不良を解消して歩留まりよくリードフレー
ムを製造できるリードフレームの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lead frame, and more specifically, the present invention relates to a method for manufacturing a lead frame, and more particularly, before forming a metal strip into a lead frame shape by press working or the like, the internal lead portions of the metal strip are , plating of parts that are to become element attachment parts, external lead parts, etc. In products where partial plating is applied to the necessary parts and then formed into a lead frame shape by press processing etc., the partial plating to be applied before partial plating is applied. By providing a position indicator such as a through hole to indicate the boundary of the area, it is possible to check at a glance whether the partial plating position to be applied is accurate or not, eliminating plating defects and manufacturing lead frames with high yield. The present invention relates to a method for manufacturing a lead frame.

リードフレームを製造する場合に、まず金属帯条をプレ
ス加工やエツチング加工によってリードフレーム形状に
形成し、しかる後その内部リード部、素子f弓部、外部
リード部等のめっき必要個所に所定の部分めっきを施す
方法がある。まためっき工程中でのリードフレーム形状
の変形等を防止するため、上記とは逆に、あらかじめ金
属帯条の段階で、内部リード部、素子付部、外部リード
部等になるべき部分のめっき必要個所に対応して所定の
部分めっきを施し、しかる後にプレス加工等によってリ
ードフレーム形状に形成する方法がある。
When manufacturing a lead frame, first a metal strip is formed into a lead frame shape by pressing or etching, and then predetermined portions are applied to the parts that require plating, such as the internal lead part, the element f bow part, and the external lead part. There is a method of plating. In addition, in order to prevent deformation of the lead frame shape during the plating process, contrary to the above, it is necessary to plate the parts that will become the internal lead part, element attachment part, external lead part, etc. at the stage of forming the metal strip. There is a method in which predetermined partial plating is applied to corresponding parts, and then the lead frame shape is formed by press working or the like.

いずれの場合においても、部分めっきの位置が正確にリ
ードフレームの所定形状と一致していることが要求され
ることは言うまでもない。
In either case, it goes without saying that the position of the partial plating must accurately match the predetermined shape of the lead frame.

上記の部分めっきを施すには、金属帯条の両側縁に所定
ピンチで送り孔を設けて、この送り孔を基準に金属帯条
を間欠送りするなどして、所定間隔をおいて部分めっき
を施すようにしている。
In order to apply the above-mentioned partial plating, feed holes at specified pinch points on both sides of the metal strip, feed the metal strip intermittently based on these holes, and perform partial plating at predetermined intervals. I am trying to apply it.

しかしながら、その素子付部や内部リード部には銀めっ
きあるいは金めつきを、外部リード部には錫めっきある
いははんだ合金めっきをというように複数種類のめっき
を連続工程で行う場合には、めっきラインが20mにも
及ぶことがあり、この間で時として金属帯条が送り機構
の一部に引掛かるなどして位置ずれを起こしたまま流れ
、ずれた位置に連続して部分めっきが施されて、不良品
が大量に発生するという現実の問題がある。
However, when performing multiple types of plating in a continuous process, such as silver plating or gold plating on the element attachment part and internal lead part, and tin plating or solder alloy plating on the external lead part, the plating line The length of the metal strip can be as long as 20 meters, and during this time, the metal strip sometimes gets caught in a part of the feeding mechanism and flows while being misaligned, and partial plating is applied continuously to the misaligned position. There is a real problem of large quantities of defective products.

この場合にあっても前者の製造方法によるときは、部分
めっきがリードフレーム形状上に直接流されるから、め
っき位置が正確か否かは直ちに確認でき、事故等に対処
することができる。
Even in this case, when the former manufacturing method is used, the partial plating is directly flowed onto the lead frame shape, so it is possible to immediately check whether the plating position is accurate or not, and it is possible to deal with accidents and the like.

しかるに、後者の製造方法によるときは、部分めっきが
金属帯条上に直接流されるから目安となるものがなく、
めっき位置′力征確か否かは目視確認では容易に確認で
きず、また計測確認では時間がかかり、さらに基準ゲー
ジを当てて判定するにしても、位置ずれした後は一応正
確なピッチでめっきされる(ただし連続的に位置ずれし
ている)から、確認が困難である。
However, when using the latter manufacturing method, there is no guideline as the partial plating is poured directly onto the metal strip.
It is not easy to visually check whether the plating position is correct or not, measurement confirmation takes time, and even if a reference gauge is used to determine whether the plating position is correct or not, the plating may not be done at the correct pitch after the position has shifted. (However, it is difficult to confirm because the position is continuously shifted).

本発明は上記後者の製造方法の難点を解消すべ(なされ
、その目的とするところは、めっきに位置ずれが生した
ときは目視によっても直ちに確認しえ、事故等に迅速に
対処することができ、歩留まりよくリードフレームを製
造できるリードフレームの製造方法を提供するものであ
り、その特徴は、施すべきめっき領域に対応して、あら
かしめめっき領域の境界を示す透孔等の位置表示部を、
金属帯条のリードフレーム形状となる部分以外の所に設
けて後、所要の部分めっきを行うところにある。
The present invention has been made to solve the above-mentioned difficulties of the latter manufacturing method, and its purpose is to be able to visually confirm any misalignment of the plating, and to be able to quickly deal with accidents, etc. , provides a lead frame manufacturing method that can manufacture lead frames with a high yield, and its features include position indicator parts such as through holes that indicate the boundaries of rough plating areas, corresponding to the areas to be plated,
After the metal strip is provided in a part other than the part that will become the lead frame shape, the required partial plating is performed.

以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

第1図は本発明方法に用いる金属帯条10を示す。12
は金属帯条10上にその長手方向に所定間隔をおいて設
けられた位置表示部であり、施すべき部分めっきのめっ
き領域14を囲んで、リードフレーム形状となる部分以
外の所に穿設された複数個の透孔から成る。
FIG. 1 shows a metal strip 10 used in the method of the invention. 12
are position display parts provided on the metal strip 10 at predetermined intervals in the longitudinal direction thereof, and are perforated in areas other than the part that will become the lead frame shape, surrounding the plating area 14 of the partial plating to be applied. It consists of multiple through holes.

該透孔は丸孔であっても角孔であってもよい。The through hole may be a round hole or a square hole.

図示の例では透孔は後工程での内部リード部16となる
べきリード間の打ち抜き部に穿設され、内部リード部1
6とその内側の素子付部18との必要なめっき領域14
を囲んで設けられている。
In the illustrated example, the through hole is bored in a punched part between the leads that will become the internal lead part 16 in a later process, and the internal lead part 1
6 and the necessary plating area 14 of the element attachment part 18 inside thereof.
It is set up around.

なお位置表示部12は、場合によってはめっき領域14
の4隅にそれぞれ1個ずつ透孔を設けたのでもよく、あ
るいは3隅に1個ずつ透孔を設けてめっき領域14の2
辺を示すようにしてもよく、さらには2個のみ設けてめ
っき領域14″の単に1辺だけを示すものであってもよ
い。また透孔の替わりに、溝、凹部、あるいは突起等(
図示せず)をリードフレーム形状となる部分以外の所に
設けてめっき領域14の境界を画するようにしてもよい
Note that the position display section 12 may be located in the plating area 14 depending on the case.
Alternatively, one through hole may be provided at each of the four corners of the plating area 14, or one through hole may be provided at each of the three corners of the plating area 14.
The sides may be indicated, or even two may be provided to indicate only one side of the plating area 14''.Furthermore, instead of a through hole, a groove, a recess, a protrusion, etc. (
(not shown) may be provided at a location other than the portion forming the lead frame shape to define the boundary of the plating region 14.

なお、20は金属帯条10の両側縁に一定ピノチで設け
た送り孔である。
Incidentally, reference numeral 20 denotes feed holes provided with a constant pitch on both side edges of the metal strip 10.

上記の位置表示部12.送り孔20は金属帯条10に連
続プレス加工により正確に形成しておく。
The above position display section 12. The feed hole 20 is accurately formed in the metal strip 10 by continuous press working.

このようにあらかじめめっき領域14の境界を示す位置
表示部12を設けた金属帯条10を通常の一連のめっき
工程中に流し、めっき領域14内に例えば銀の部分めっ
きを施す。部分めっきを施すにはコムマスク等を用いて
通常の方法で行うことができる。何らかの原因で部分め
っきが位置表示部12からずれた場合であっても、位置
表示部12を目安として目視によって直ちに確認できる
から、めらき作業を中止し、適当な対策を講しることが
できる。後は適宜金型を用いて、部分めっきされた金属
帯条lOのめっき部分がリードフレームの所望めっき領
域となるように位置合わせしてブレスで1]ちt友けば
よい。
The metal strip 10 provided with the position indicator 12 indicating the boundary of the plating area 14 in advance is passed through a series of normal plating processes, and the plating area 14 is partially plated with, for example, silver. Partial plating can be performed using a conventional method using a comb mask or the like. Even if the partial plating deviates from the position display section 12 for some reason, it can be immediately confirmed visually using the position display section 12 as a guide, so the plating work can be stopped and appropriate countermeasures can be taken. . After that, using an appropriate mold, align the plated portion of the partially plated metal strip 10 to the desired plating area of the lead frame, and press with a press.

なお外部リード部22に対しては、上記一連のめっき工
程中で錫めっき等の必要なめっきを同時に施ずくこの場
合上記の位置表示gB 12の部分めっきが正確な位置
にめっきされていれは、外部リード部22に対するめっ
きも同様に位置精度が出ている)か、あるいは後工程の
適宜段階で必要な錫めっき等を施すとよい。
In addition, for the external lead portion 22, necessary plating such as tin plating is applied at the same time during the above series of plating steps. The plating on the external lead portion 22 may also be performed with high positional accuracy), or the necessary tin plating or the like may be applied at an appropriate stage in the subsequent process.

あるいは位置表示部を外部リート部22に施ずめっき領
域を示すようにのみ設けて(図示せず)、外部リード部
22に対応する錫めっき等と、内部リード部16.素子
付部1Bに対応する銀めっき等とを一連のめっき工程で
めっきするようにしても、同様にめっき位置の正確さを
迅速に確認することができる。
Alternatively, a position display section is provided on the external lead section 22 to indicate only the plating area (not shown), and the tin plating or the like corresponding to the external lead section 22 and the internal lead section 16. Even if silver plating or the like corresponding to the element attachment portion 1B is plated in a series of plating steps, the accuracy of the plating position can be similarly quickly confirmed.

あるいはまた、前記の内部リート部16.素子付部18
に対応するめっき領域14を示す位置表示部1−2と外
部リード部22のめっき領域を示す位置表示部(図示せ
ず)との両方を設けてもよいことはもちろんである。
Alternatively, the internal reat portion 16. Element attachment part 18
Of course, both the position display section 1-2 indicating the plating area 14 corresponding to the plating area 1-2 and the position display section (not shown) indicating the plating area of the external lead section 22 may be provided.

以上のように本発明に係るリードフレームの製造方法に
よれば、部分めっきが所望のめっき領域に正確にめっき
されているか否かが目視によっても一目瞭然に判定でき
、めっき位置がずれた場合の事故に直ちに対処でき、め
っき不良を解消することができ、リードフレームを歩留
まりよく製造できるという著効を奏する。
As described above, according to the lead frame manufacturing method according to the present invention, it is possible to visually determine whether or not the partial plating is accurately plated on the desired plating area, thereby preventing accidents when the plating position shifts. This has the remarkable effect of being able to immediately deal with problems, eliminate plating defects, and manufacture lead frames with a high yield.

以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。
Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は位置表示部を設けた金属帯条の一実施例を示す
説明図である。 10・・・金属帯条、  12・・・位置表示部。 14・・・めっき領域、  16・・・内部リート部、
  18・・・素子付部、  20・・・送り孔。 22・・・外部リード部。
FIG. 1 is an explanatory diagram showing an embodiment of a metal strip provided with a position display section. 10... Metal strip, 12... Position display section. 14... Plating area, 16... Internal reat part,
18... Element attachment part, 20... Feed hole. 22...External lead part.

Claims (1)

【特許請求の範囲】[Claims] ■、金属帯条に、リードフレーム形状に形成した際の内
部リード部、素子付部、外部リード部等になるべき部分
のめっき必要個所に対応してあらかじめ必要な部分めっ
きを施し、しかる後にプレス加工あるいはエツチング加
工等により所要のリードフレーム形状に形成するリード
フレームの製造方法において、前記施すべきめっき領域
に対応して、あらかじめめっき領域の境界を示す透孔等
の位置表示部を、金属帯条のリードフレーム形状となる
部分以外の所に設けて後、前記所要の部分めっきを行う
ことを特徴とするリードフレームの製造方法。
■ Plating the parts that will become the internal lead part, element attachment part, external lead part, etc. when the metal strip is formed into a lead frame shape. Apply the necessary partial plating in advance according to the necessary parts, and then press. In a method for manufacturing a lead frame in which a desired lead frame shape is formed by processing or etching, a position indicating portion such as a through hole indicating the boundary of the plating region is placed in advance on a metal strip, corresponding to the plating region to be plated. A method for manufacturing a lead frame, characterized in that the required partial plating is performed after the lead frame is provided at a location other than the portion that will form the lead frame shape.
JP6431683A 1983-04-11 1983-04-11 Manufacture of lead frame Granted JPS59188952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6431683A JPS59188952A (en) 1983-04-11 1983-04-11 Manufacture of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6431683A JPS59188952A (en) 1983-04-11 1983-04-11 Manufacture of lead frame

Publications (2)

Publication Number Publication Date
JPS59188952A true JPS59188952A (en) 1984-10-26
JPH0135503B2 JPH0135503B2 (en) 1989-07-25

Family

ID=13254704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6431683A Granted JPS59188952A (en) 1983-04-11 1983-04-11 Manufacture of lead frame

Country Status (1)

Country Link
JP (1) JPS59188952A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153653U (en) * 1988-04-01 1989-10-23
JPH03127856A (en) * 1989-10-13 1991-05-30 Mitsui High Tec Inc Manufacture of lead frame
JP2012253265A (en) * 2011-06-06 2012-12-20 Shinko Electric Ind Co Ltd Method for manufacturing lead frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6518547B2 (en) 2015-08-07 2019-05-22 新光電気工業株式会社 Lead frame, semiconductor device and method of manufacturing lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137209A (en) * 1982-02-09 1983-08-15 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS5999750A (en) * 1982-11-30 1984-06-08 Sumitomo Metal Mining Co Ltd Manufactue of lead frame for ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137209A (en) * 1982-02-09 1983-08-15 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS5999750A (en) * 1982-11-30 1984-06-08 Sumitomo Metal Mining Co Ltd Manufactue of lead frame for ic

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153653U (en) * 1988-04-01 1989-10-23
JPH03127856A (en) * 1989-10-13 1991-05-30 Mitsui High Tec Inc Manufacture of lead frame
JP2012253265A (en) * 2011-06-06 2012-12-20 Shinko Electric Ind Co Ltd Method for manufacturing lead frame

Also Published As

Publication number Publication date
JPH0135503B2 (en) 1989-07-25

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