JP2779245B2 - Manufacturing method of TAB tape with bump - Google Patents

Description

The present invention relates to a method for manufacturing a TAB tape with bumps.

(Prior Art) As shown in FIG. 3, a conventional TAB tape with bumps has a device hole 13 in a fixed-width insulating tape 11, a sprocket hole 17 for automatic feeding, and a device hole 13 in the device hole 13. Projecting bumps 16 for connecting to semiconductor elements
It has a lead 12 attached.

As a method of forming the bump 16, a press working is known. This method comprises the steps of (a)
Set the TAB tape on the molds 18 and 19 at predetermined positions, and (b)
After forming the bump 16 on the lead 12 by pressing,
(C) The TAB tape is removed from the dies 18 and 19,
Bumps 16 are formed on the leads 12 of the B tape.

(Problems to be Solved by the Invention) However, in such a TAB tape with bumps, when gang bonding is automatically performed on the TAB tape with bumps using a tape bonder, the leads 12 with bumps 16 are used as alignment patterns. We are recognizing,
Since the pressed surface of the lead 12 is processed by the press working, the surface roughness of the processed surface is reduced, and light is not irregularly reflected, so that an accurate pattern recognition state cannot be obtained and erroneous recognition occurs. Moreover, since the surface of the lead 12 with the bump 16 is not uniform among the leads 12 due to the press working, accurate pattern recognition cannot be obtained. As a result, the bumps 16 cannot be aligned with the aluminum electrodes of the semiconductor element, and the leads 12 with the bumps 16 are displaced from the aluminum electrodes, causing interference with the surrounding passivation film.

Therefore, an object of the present invention is to provide a method of manufacturing a TAB tape with bumps, which can accurately recognize a pattern of a TAB tape with bumps even if leads are processed by press working.

(Means for Solving the Problems) In order to solve the above problems, the present invention provides a bumped TA.
In a method of manufacturing a B tape, a press die having a bump forming portion and a projecting portion processing portion disposed at predetermined positions, a device hole for mounting an element, a lead projecting into the device hole, and a projecting portion for recognition. And a TAB tape having the TAB tape at a predetermined position of the pressing die.
A tape is set, the TAB tape is pressed with the press mold, bumps are formed on the leads in the device holes at the bump forming locations of the press mold, and the protrusion of the press mold is formed. The projecting part for recognition in the device hole is subjected to shearing processing at a part processing part.

(Operation) As described above, with the bumps obtained by simultaneously performing the forming of the bumps and the processing of the recognition protrusions by pressing.
For TAB tapes, the relative position between the bump and the recognition protrusion is determined by the precision of the press mold that has been secured in the same stage in advance, and is always the same. Therefore, the pattern recognition of the recognition protrusion without the lead pattern recognition is required. By performing the above, alignment with the element can be performed. Moreover, since the recognition protrusion is sheared, the surface for pattern recognition does not have a small surface roughness and the shape is always the same, so that accurate pattern recognition can be performed. For these reasons, the electrodes of the element and the bumps can be reliably aligned.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

 FIG. 1 is a process chart showing one embodiment of the present invention.

FIG. 1A is a plan view of the TAB tape before press working. A sprocket hole 7 is previously opened in the TAB tape for automatically feeding the device hole 3 and the insulating tape 1. The TAB tape has leads 2 and protrusions 4 formed to protrude into device holes 3. First
FIG. 2B is a plan view of the TAB tape after press working.
A TAB tape is set on a press die having a bump forming portion and a protruding portion processed portion arranged at a predetermined position,
When the TAB tape is pressed by the mold, the bumps 6 of the leads 2 are formed at the same time as the protrusions 5. The projection 5 at this time is obtained by shearing the projection 4 before pressing.

In the thus obtained TAB tape with bumps, since the positional relationship between the bumps 6 and the protrusions 5 other than the leads is always the same, the aluminum electrode of the semiconductor element is recognized by pattern recognition of the protrusions 5 other than the leads. Position can be surely adjusted.

 FIG. 2 is a view showing another embodiment of the present invention.

FIG. 2 (a) is a plan view of the TAB tape before press working. A sprocket hole 7 is previously opened in the TAB tape for automatically feeding the device hole 3 and the insulating tape 1. The TAB tape has leads 2 and protrusions 24 formed to protrude into the device holes 3. Second
FIG. 2B is a plan view of the TAB tape after press working.
The bump 6 is formed on the lead 2 at the same time as the protrusion 25. The projection 25 at this time is obtained by shearing the projection 24 before pressing.

(Effects of the Invention) As described above, according to the present invention, the TAB tape is pressed by the press die to form bumps on the leads and to shear the recognition protrusions. When the bumps and the electrodes of the element are connected to each other, if the processed protrusions are recognized as a pattern, accurate alignment with the element can be performed even if the leads cannot be recognized as a pattern. Therefore, the bumped lead is securely connected to the electrode of the element, and does not interfere with the passivation around the electrode.

[Brief description of the drawings]

1 (a) and 1 (b) are process drawings showing one embodiment of the present invention, FIGS. 2 (a) and 2 (b) are other embodiments, FIG. 3 is a conventional example, and FIG. It is a process drawing of processing. 1,11… insulating tape, 2,12… lead, 3,13… device hole, 4,5,24,25 …… protrusion, 6,16 …… bump, 1
8,19 ... Mold.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60

Claims (1)

(57) [Claims] 1. A press die having a bump forming portion and a projecting portion processing portion disposed at a predetermined position, a device hole for mounting an element, a lead projecting into the device hole, and a projecting portion for recognition. Prepare a TAB tape, set the TAB tape at a predetermined position of the press die, press work the TAB tape with the press die,
A bump is formed on a lead in the device hole at a bump forming portion of the press die, and a recognition protruding portion in the device hole is sheared at a protruding portion processing portion of the press die. Method of manufacturing TAB tape with bumps.