JPH0731543Y2 - Manufacturing equipment for metal leads with bumps - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an apparatus for manufacturing metal leads with bumps of TAB tape.

(Prior Art) FIG. 3 is a plan view of a TAB tape. As shown in FIG. 3, a group of metal leads projecting from two opposite sides of the device hole 16 of the TAB tape 15 is formed in advance by a method such as etching, and then a bump is formed near the tip of the group of metal leads. As shown in FIG. 4, a recess 13a corresponding to the position where the bump is to be formed is provided in the lower die, and a metal lead 11 having a length sufficient to bridge the recess 13a is installed horizontally in the recess 13a. I'm setting it up.

When forming the bumps of the metal leads 11, the recesses 13a of the mold used conventionally corresponded to each metal lead one to one and were independent from each other, as shown in FIG.

(Problems to be solved by the invention) However, in such a mold, as shown in FIG. 6, when the metal lead is set on the metal, a positional deviation ex in the direction orthogonal to the extending direction of the metal lead ex If the press working is performed with the occurrence of the bump, the bump of the area required for the metal lead cannot be obtained, which is necessary for bonding the metal lead to the semiconductor.
There is a problem that bumps having a predetermined bonding area cannot be obtained.

Therefore, an object of the present invention is to provide a bumped lead manufacturing apparatus capable of obtaining a bonding area originally required for a bump even if a positional deviation occurs when the metal lead is set in a mold.

(Means for Solving the Problems) In order to solve the above problems, the manufacturing apparatus for metal leads with bumps of the present invention is an apparatus for press-molding bumps near the tips of metal lead groups, and at least one of the molds. A recess is provided at a position corresponding to the position of the bump, and the recess extends across the plurality of metal leads in a direction orthogonal to the extending direction of the metal lead group.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing a metal mold set on a lower die according to an embodiment of the present invention.

The bumpy metal lead manufacturing apparatus includes an upper die and a lower die. The upper die has a flat pressing surface, and the lower die 3 has a recess 3a corresponding to a predetermined position of the metal lead 1. Recess 3a
Is a groove that laterally bridges a plurality of metal leads 1 in a direction orthogonal to the extending direction of the group of metal leads 1.

In press molding using a manufacturing apparatus for metal leads having such bumps, first, the metal leads 1 are set at predetermined positions on the lower mold 3, and then press working is performed to form bumps.

When the metal leads 1 and the recesses 3a are aligned, that is, when the metal leads 1 are set, even if a positional deviation ex occurs in a direction orthogonal to the extending direction of the metal leads 1 as shown in FIG. There is a lower mold recess 3a corresponding to the bump forming position of the lead 1. Therefore, it is possible to obtain a size required as a bump near the tip of the metal lead 1, that is, a bonding area required when the metal lead is bonded to the semiconductor IC chip. Further, regarding the deviation ey in the extending direction of the metal lead 1, the length of the metal lead 1 is absorbed by previously forming it so that the concave portion 3a can be surely crossed over even if the position deviation ey occurs. It will be possible.

In this embodiment, the metal lead 1 has a width of about 50 μm and a thickness of about
The lower mold recess 3a was formed to have a depth of about 15 to 20 μm and a groove with a cross-sectional width of about 50 μm. In addition, the length of the metal lead 1 is set to be 70 μm longer than the center of the bump in consideration of the positional deviation amount ey. Further, although the metal lead 1 used is one which has been plated with Au in advance, it can be used even after press molding.

Further, although FIG. 1 shows a recess in which a plurality of metal leads 1 are crossed, when the pitch between the metal leads is sufficiently wide, the recesses are formed.
3a may be formed in a thin shape having a length in consideration of the amount of positional deviation without horizontally mounting a plurality of metal leads.

(Effect of the Invention) As described above, the present invention has the shape in which the concave portion provided in the mold has a shape in which a plurality of metal leads are laid horizontally in the direction orthogonal to the extending direction of the metal leads. A bump having a predetermined bonding area can be formed at the tip of the metal lead protruding from the side even if the metal lead is misaligned on the mold, and the bumps can face each other such as a memory element.
TAB with bumps for semiconductor devices with external electrodes on the sides
Since the tape can be manufactured stably and the bonding area with the semiconductor element is not reduced, a bonding portion having high reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view showing a metal die set in a mold showing an embodiment of the present invention, FIG. 2 is a plan view showing a positional deviation state of the set of the present invention, and FIG. 3 is a conventional TAB tape as a whole. FIG. 4 is a cross-sectional view illustrating a method of manufacturing a metal lead with bumps, FIG. 5 is a plan view in which a metal lead is set in a mold showing an example of a conventional technique, and FIG. 6 is a conventional bump. Explanatory drawing in the manufacturing apparatus of an attached metal lead. 1 …… Metal lead, 13 …… Lower mold 3 …… Lower mold, 13a …… Concave 3a …… Concave, 14 …… Bump 11 …… Metal lead, 15 …… TAB tape 12 …… Upper mold, 16 …… Device hole

Claims (1)

[Scope of utility model registration request] 1. A device for press-molding a bump near the tip of a metal lead group, wherein a recess is provided in at least one of the molds at a position corresponding to the position of the bump, and the recess is the extending direction of the metal lead group. An apparatus for manufacturing a metal lead with bumps, characterized in that the metal lead is horizontally mounted on a plurality of the metal leads in a direction orthogonal to the above.