JPS59181546A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS59181546A
JPS59181546A JP59059366A JP5936684A JPS59181546A JP S59181546 A JPS59181546 A JP S59181546A JP 59059366 A JP59059366 A JP 59059366A JP 5936684 A JP5936684 A JP 5936684A JP S59181546 A JPS59181546 A JP S59181546A
Authority
JP
Japan
Prior art keywords
wire
cut
clamper
tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59059366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327853B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59059366A priority Critical patent/JPS59181546A/ja
Publication of JPS59181546A publication Critical patent/JPS59181546A/ja
Publication of JPS6327853B2 publication Critical patent/JPS6327853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59059366A 1984-03-29 1984-03-29 ワイヤボンデイング方法 Granted JPS59181546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59059366A JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59059366A JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP54165260A Division JPS6026300B2 (ja) 1979-12-18 1979-12-18 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59181546A true JPS59181546A (ja) 1984-10-16
JPS6327853B2 JPS6327853B2 (enrdf_load_stackoverflow) 1988-06-06

Family

ID=13111193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59059366A Granted JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59181546A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6327853B2 (enrdf_load_stackoverflow) 1988-06-06

Similar Documents

Publication Publication Date Title
US3934783A (en) Multiface wire bonding method and tool
US4422568A (en) Method of making constant bonding wire tail lengths
US3954217A (en) Method and apparatus for bonding and breaking leads to semiconductors
JPS59181546A (ja) ワイヤボンデイング方法
JPS6026300B2 (ja) ワイヤボンデイング装置
CN112771427B (zh) 光纤切断装置及光纤切断方法
US5395038A (en) High placement accuracy wire bonder for joining small closely spaced wiring features
JPS627004A (ja) 光フアイバ心線切断機
JPH1079399A (ja) ワイヤボンディング方法及び装置
JP3317809B2 (ja) 光ファイバ移動装置
JPH0135500B2 (enrdf_load_stackoverflow)
JP2000285748A (ja) 電線の捩れ矯正装置
JP2545551B2 (ja) ワイヤ放電加工機におけるワイヤ切断装置
WO2025105274A1 (ja) ボンディング装置
JPH04272787A (ja) ミシンの縫い糸緊張装置
JP2627968B2 (ja) 半導体組立装置
JP2004207555A (ja) ワイヤボンディング装置
JPH0611066B2 (ja) ワイヤボンデイング装置
JP3369764B2 (ja) ワイヤボンディング装置における放電用トーチ電極体
JPH079166A (ja) 溶接チップのドレッシング装置
JPH0220833Y2 (enrdf_load_stackoverflow)
JPH10213716A (ja) 光ファイバ融着接続装置
JPS61199644A (ja) ワイヤボンディング装置
JPS5879728A (ja) ワイヤボンデイング方法
KR20000005475U (ko) 반도체 패키지용 와이어본딩장치