JPS59175148A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59175148A
JPS59175148A JP4794983A JP4794983A JPS59175148A JP S59175148 A JPS59175148 A JP S59175148A JP 4794983 A JP4794983 A JP 4794983A JP 4794983 A JP4794983 A JP 4794983A JP S59175148 A JPS59175148 A JP S59175148A
Authority
JP
Japan
Prior art keywords
power supply
wiring
lsi
chip
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4794983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0480534B2 (enrdf_load_stackoverflow
Inventor
Toshiaki Sakai
酒井　敏昭
Kazumasa Nawata
名和田　一正
Mitsuhisa Shimizu
光久 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4794983A priority Critical patent/JPS59175148A/ja
Publication of JPS59175148A publication Critical patent/JPS59175148A/ja
Publication of JPH0480534B2 publication Critical patent/JPH0480534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP4794983A 1983-03-24 1983-03-24 半導体装置 Granted JPS59175148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4794983A JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4794983A JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS59175148A true JPS59175148A (ja) 1984-10-03
JPH0480534B2 JPH0480534B2 (enrdf_load_stackoverflow) 1992-12-18

Family

ID=12789609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4794983A Granted JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS59175148A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology
US5280450A (en) * 1990-05-14 1994-01-18 Hitachi, Ltd. High-speed semicondustor memory integrated circuit arrangement having power and signal lines with reduced resistance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology
US5280450A (en) * 1990-05-14 1994-01-18 Hitachi, Ltd. High-speed semicondustor memory integrated circuit arrangement having power and signal lines with reduced resistance

Also Published As

Publication number Publication date
JPH0480534B2 (enrdf_load_stackoverflow) 1992-12-18

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