JPH0575182B2 - - Google Patents

Info

Publication number
JPH0575182B2
JPH0575182B2 JP62192860A JP19286087A JPH0575182B2 JP H0575182 B2 JPH0575182 B2 JP H0575182B2 JP 62192860 A JP62192860 A JP 62192860A JP 19286087 A JP19286087 A JP 19286087A JP H0575182 B2 JPH0575182 B2 JP H0575182B2
Authority
JP
Japan
Prior art keywords
lsi
wiring
wiring board
chip
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62192860A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6437046A (en
Inventor
Tatsuo Inoe
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62192860A priority Critical patent/JPS6437046A/ja
Publication of JPS6437046A publication Critical patent/JPS6437046A/ja
Publication of JPH0575182B2 publication Critical patent/JPH0575182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP62192860A 1987-07-31 1987-07-31 Multi-chip package Granted JPS6437046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62192860A JPS6437046A (en) 1987-07-31 1987-07-31 Multi-chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62192860A JPS6437046A (en) 1987-07-31 1987-07-31 Multi-chip package

Publications (2)

Publication Number Publication Date
JPS6437046A JPS6437046A (en) 1989-02-07
JPH0575182B2 true JPH0575182B2 (enrdf_load_stackoverflow) 1993-10-20

Family

ID=16298175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62192860A Granted JPS6437046A (en) 1987-07-31 1987-07-31 Multi-chip package

Country Status (1)

Country Link
JP (1) JPS6437046A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105118811A (zh) * 2015-07-27 2015-12-02 电子科技大学 一种采用均热板及微通道对多热源器件散热的均温装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174856A (ja) * 2011-02-21 2012-09-10 Hitachi Cable Ltd ヒートシンク及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105118811A (zh) * 2015-07-27 2015-12-02 电子科技大学 一种采用均热板及微通道对多热源器件散热的均温装置

Also Published As

Publication number Publication date
JPS6437046A (en) 1989-02-07

Similar Documents

Publication Publication Date Title
US6707684B1 (en) Method and apparatus for direct connection between two integrated circuits via a connector
US4771366A (en) Ceramic card assembly having enhanced power distribution and cooling
US4956694A (en) Integrated circuit chip stacking
US6580611B1 (en) Dual-sided heat removal system
US5982632A (en) Short power signal path integrated circuit package
US5038194A (en) Semiconductor device
US5130768A (en) Compact, high-density packaging apparatus for high performance semiconductor devices
JPH033290A (ja) 電子回路アセンブリ用サーマルシヤント及びその製造方法
JPH02180056A (ja) 多機能接地面
EP0268260B1 (en) Flexible film chip carrier with decoupling capacitors
US6979891B2 (en) Integrated circuit packaging architecture
US7161251B2 (en) Partially populated ball grid design to accommodate landing pads close to the die
US7438558B1 (en) Three-dimensional stackable die configuration for an electronic circuit board
JPH0575182B2 (enrdf_load_stackoverflow)
KR102578797B1 (ko) 반도체 패키지
JPH0519316B2 (enrdf_load_stackoverflow)
JPS5954247A (ja) 電子部品
JPH04290258A (ja) マルチチップモジュール
JPH10214928A (ja) プリント配線板
US6747352B1 (en) Integrated circuit having multiple power/ground connections to a single external terminal
US20250006585A1 (en) Semiconductor packages with multiple types of conductive components
JP2970206B2 (ja) 半導体装置
JP2892687B2 (ja) 半導体素子用パツケージ
JP2906677B2 (ja) 集積回路パッケージ
JPH10294435A (ja) メモリモジュールおよび情報処理装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees