JPH0480534B2 - - Google Patents
Info
- Publication number
- JPH0480534B2 JPH0480534B2 JP58047949A JP4794983A JPH0480534B2 JP H0480534 B2 JPH0480534 B2 JP H0480534B2 JP 58047949 A JP58047949 A JP 58047949A JP 4794983 A JP4794983 A JP 4794983A JP H0480534 B2 JPH0480534 B2 JP H0480534B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- wiring
- power
- lsi
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4794983A JPS59175148A (ja) | 1983-03-24 | 1983-03-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4794983A JPS59175148A (ja) | 1983-03-24 | 1983-03-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59175148A JPS59175148A (ja) | 1984-10-03 |
JPH0480534B2 true JPH0480534B2 (enrdf_load_stackoverflow) | 1992-12-18 |
Family
ID=12789609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4794983A Granted JPS59175148A (ja) | 1983-03-24 | 1983-03-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59175148A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5165086A (en) * | 1985-02-20 | 1992-11-17 | Hitachi, Ltd. | Microprocessor chip using two-level metal lines technology |
US5280450A (en) * | 1990-05-14 | 1994-01-18 | Hitachi, Ltd. | High-speed semicondustor memory integrated circuit arrangement having power and signal lines with reduced resistance |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420680A (en) * | 1977-07-18 | 1979-02-16 | Hitachi Ltd | Large scale integrated circuit |
-
1983
- 1983-03-24 JP JP4794983A patent/JPS59175148A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59175148A (ja) | 1984-10-03 |
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