JPS59173690A - ヒ−トパイプ構造ｉｃ基板 - Google Patents
ヒ−トパイプ構造ｉｃ基板Info
- Publication number
- JPS59173690A JPS59173690A JP4677483A JP4677483A JPS59173690A JP S59173690 A JPS59173690 A JP S59173690A JP 4677483 A JP4677483 A JP 4677483A JP 4677483 A JP4677483 A JP 4677483A JP S59173690 A JPS59173690 A JP S59173690A
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat
- spacer
- base plate
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- 239000002241 glass-ceramic Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000011796 hollow space material Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4677483A JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ｉｃ基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4677483A JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ｉｃ基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59173690A true JPS59173690A (ja) | 1984-10-01 |
| JPS6239358B2 JPS6239358B2 (en, 2012) | 1987-08-22 |
Family
ID=12756670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4677483A Granted JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ｉｃ基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173690A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1930682A4 (en) * | 2005-09-01 | 2011-04-06 | Fuchigami Micro Co | HEATHER AND MANUFACTURING METHOD THEREFOR |
| US8534348B2 (en) | 2005-09-01 | 2013-09-17 | Molex Incorporated | Heat pipe and method for manufacturing same |
| WO2021172479A1 (ja) | 2020-02-26 | 2021-09-02 | 京セラ株式会社 | 放熱部材 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111051U (en, 2012) * | 1987-01-07 | 1988-07-16 | ||
| JPH01133852U (en, 2012) * | 1988-03-07 | 1989-09-12 | ||
| JPH01169897U (en, 2012) * | 1988-05-20 | 1989-11-30 | ||
| JPH0273856U (en, 2012) * | 1988-07-18 | 1990-06-06 | ||
| JPH0314861U (en, 2012) * | 1989-06-26 | 1991-02-14 |
-
1983
- 1983-03-18 JP JP4677483A patent/JPS59173690A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1930682A4 (en) * | 2005-09-01 | 2011-04-06 | Fuchigami Micro Co | HEATHER AND MANUFACTURING METHOD THEREFOR |
| US8534348B2 (en) | 2005-09-01 | 2013-09-17 | Molex Incorporated | Heat pipe and method for manufacturing same |
| WO2021172479A1 (ja) | 2020-02-26 | 2021-09-02 | 京セラ株式会社 | 放熱部材 |
| US12292238B2 (en) | 2020-02-26 | 2025-05-06 | Kyocera Corporation | Heat dissipation member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239358B2 (en, 2012) | 1987-08-22 |
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