JPS59172745A - 半導体装置の電極形成方法 - Google Patents

半導体装置の電極形成方法

Info

Publication number
JPS59172745A
JPS59172745A JP58048115A JP4811583A JPS59172745A JP S59172745 A JPS59172745 A JP S59172745A JP 58048115 A JP58048115 A JP 58048115A JP 4811583 A JP4811583 A JP 4811583A JP S59172745 A JPS59172745 A JP S59172745A
Authority
JP
Japan
Prior art keywords
layer
chromium
copper
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58048115A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0473292B2 (OSRAM
Inventor
Mitsuo Kishimoto
岸本　光雄
Kenji Oka
岡　健二
Mitsuo Omi
大海　三男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP58048115A priority Critical patent/JPS59172745A/ja
Publication of JPS59172745A publication Critical patent/JPS59172745A/ja
Publication of JPH0473292B2 publication Critical patent/JPH0473292B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
JP58048115A 1983-03-22 1983-03-22 半導体装置の電極形成方法 Granted JPS59172745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58048115A JPS59172745A (ja) 1983-03-22 1983-03-22 半導体装置の電極形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58048115A JPS59172745A (ja) 1983-03-22 1983-03-22 半導体装置の電極形成方法

Publications (2)

Publication Number Publication Date
JPS59172745A true JPS59172745A (ja) 1984-09-29
JPH0473292B2 JPH0473292B2 (OSRAM) 1992-11-20

Family

ID=12794313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58048115A Granted JPS59172745A (ja) 1983-03-22 1983-03-22 半導体装置の電極形成方法

Country Status (1)

Country Link
JP (1) JPS59172745A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652590A1 (en) * 1993-11-05 1995-05-10 Casio Computer Co., Ltd. Method of fabricating a semiconductor device with a bump electrode
US5511435A (en) * 1993-10-04 1996-04-30 Casio Computer Co., Ltd. Apparatus for measuring vehicle running condition
US6723628B2 (en) 2000-03-27 2004-04-20 Seiko Epson Corporation Method for forming bonding pad structures in semiconductor devices
US6812123B2 (en) 2000-03-27 2004-11-02 Seiko Epson Corporation Semiconductor devices and methods for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101263A (en) * 1978-01-26 1979-08-09 Nec Corp Semiconductor device
JPS57170555A (en) * 1981-03-30 1982-10-20 Ibm Solder supporting pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101263A (en) * 1978-01-26 1979-08-09 Nec Corp Semiconductor device
JPS57170555A (en) * 1981-03-30 1982-10-20 Ibm Solder supporting pad

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5511435A (en) * 1993-10-04 1996-04-30 Casio Computer Co., Ltd. Apparatus for measuring vehicle running condition
EP0652590A1 (en) * 1993-11-05 1995-05-10 Casio Computer Co., Ltd. Method of fabricating a semiconductor device with a bump electrode
US5538920A (en) * 1993-11-05 1996-07-23 Casio Computer Co., Ltd. Method of fabricating semiconductor device
US5705856A (en) * 1993-11-05 1998-01-06 Casio Computer Co., Ltd. Semiconductor device
US6723628B2 (en) 2000-03-27 2004-04-20 Seiko Epson Corporation Method for forming bonding pad structures in semiconductor devices
US6812123B2 (en) 2000-03-27 2004-11-02 Seiko Epson Corporation Semiconductor devices and methods for manufacturing the same
US7091609B2 (en) * 2000-03-27 2006-08-15 Seiko Epson Corporation Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric

Also Published As

Publication number Publication date
JPH0473292B2 (OSRAM) 1992-11-20

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