JPS59169694A - 半田接着方法 - Google Patents

半田接着方法

Info

Publication number
JPS59169694A
JPS59169694A JP4214583A JP4214583A JPS59169694A JP S59169694 A JPS59169694 A JP S59169694A JP 4214583 A JP4214583 A JP 4214583A JP 4214583 A JP4214583 A JP 4214583A JP S59169694 A JPS59169694 A JP S59169694A
Authority
JP
Japan
Prior art keywords
solder
lead
tin
alloy
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4214583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431800B2 (enrdf_load_stackoverflow
Inventor
Makoto Kitano
誠 北野
Toshihiro Yamada
山田　俊宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4214583A priority Critical patent/JPS59169694A/ja
Publication of JPS59169694A publication Critical patent/JPS59169694A/ja
Publication of JPH0431800B2 publication Critical patent/JPH0431800B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP4214583A 1983-03-16 1983-03-16 半田接着方法 Granted JPS59169694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4214583A JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4214583A JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Publications (2)

Publication Number Publication Date
JPS59169694A true JPS59169694A (ja) 1984-09-25
JPH0431800B2 JPH0431800B2 (enrdf_load_stackoverflow) 1992-05-27

Family

ID=12627768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4214583A Granted JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Country Status (1)

Country Link
JP (1) JPS59169694A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
JPS6471591A (en) * 1987-09-09 1989-03-16 Sumitomo Spec Metals Joining method for metal or alloy piece
JPH04270092A (ja) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp 半田材料及び接合方法
JPH0596395A (ja) * 1991-10-04 1993-04-20 Mitsubishi Electric Corp 接合材、接合方法および半導体装置
EP0875932A3 (en) * 1997-04-30 1999-08-04 International Business Machines Corporation Semi-conductor substrates and methods
WO2024176947A1 (ja) * 2023-02-22 2024-08-29 三菱電機株式会社 半導体装置、電力変換装置および半導体装置の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
JPS6471591A (en) * 1987-09-09 1989-03-16 Sumitomo Spec Metals Joining method for metal or alloy piece
JPH04270092A (ja) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp 半田材料及び接合方法
JPH0596395A (ja) * 1991-10-04 1993-04-20 Mitsubishi Electric Corp 接合材、接合方法および半導体装置
EP0875932A3 (en) * 1997-04-30 1999-08-04 International Business Machines Corporation Semi-conductor substrates and methods
KR100294968B1 (ko) * 1997-04-30 2001-07-12 포만 제프리 엘 반도체기판용다층땜납밀봉밴드및그제조방법
WO2024176947A1 (ja) * 2023-02-22 2024-08-29 三菱電機株式会社 半導体装置、電力変換装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0431800B2 (enrdf_load_stackoverflow) 1992-05-27

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