JPS591679A - エツチング液の制御管理方法 - Google Patents

エツチング液の制御管理方法

Info

Publication number
JPS591679A
JPS591679A JP10924782A JP10924782A JPS591679A JP S591679 A JPS591679 A JP S591679A JP 10924782 A JP10924782 A JP 10924782A JP 10924782 A JP10924782 A JP 10924782A JP S591679 A JPS591679 A JP S591679A
Authority
JP
Japan
Prior art keywords
etching
hydrochloric acid
soln
concn
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10924782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0158270B2 (zh
Inventor
Ryozo Kawai
河合　良三
Jun Kokubu
国分　純
Yoshiji Namikawa
好次 南川
Yutaka Oshida
豊 押田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP10924782A priority Critical patent/JPS591679A/ja
Publication of JPS591679A publication Critical patent/JPS591679A/ja
Publication of JPH0158270B2 publication Critical patent/JPH0158270B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP10924782A 1982-06-25 1982-06-25 エツチング液の制御管理方法 Granted JPS591679A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10924782A JPS591679A (ja) 1982-06-25 1982-06-25 エツチング液の制御管理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10924782A JPS591679A (ja) 1982-06-25 1982-06-25 エツチング液の制御管理方法

Publications (2)

Publication Number Publication Date
JPS591679A true JPS591679A (ja) 1984-01-07
JPH0158270B2 JPH0158270B2 (zh) 1989-12-11

Family

ID=14505338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10924782A Granted JPS591679A (ja) 1982-06-25 1982-06-25 エツチング液の制御管理方法

Country Status (1)

Country Link
JP (1) JPS591679A (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144499U (ja) * 1984-08-22 1986-03-24 株式会社タダノ 屈伸機構の作動制御装置
JPS6159300U (zh) * 1984-09-25 1986-04-21
JPS61217500A (ja) * 1985-03-22 1986-09-27 新明和工業株式会社 作業車の作動制御装置
JPS6462483A (en) * 1987-08-28 1989-03-08 Ibm Regeneration of metal-containing acidic solution
EP0342669A2 (en) * 1988-05-20 1989-11-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
JPH0665763A (ja) * 1992-08-21 1994-03-08 Tsurumi Soda Co Ltd エッチング廃液処理装置
JPH08269747A (ja) * 1995-03-31 1996-10-15 Nippon Aqua Kk エッチング液の再生方法およびエッチング液
JP2011522395A (ja) * 2008-01-11 2011-07-28 ピーピージー インダストリーズ オハイオ， インコーポレイテッド バイア内の導電性コア上に電着コーティングを有する回路ボードおよびその作製方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144499U (ja) * 1984-08-22 1986-03-24 株式会社タダノ 屈伸機構の作動制御装置
JPS6159300U (zh) * 1984-09-25 1986-04-21
JPS61217500A (ja) * 1985-03-22 1986-09-27 新明和工業株式会社 作業車の作動制御装置
JPS6462483A (en) * 1987-08-28 1989-03-08 Ibm Regeneration of metal-containing acidic solution
EP0342669A2 (en) * 1988-05-20 1989-11-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
JPH0665763A (ja) * 1992-08-21 1994-03-08 Tsurumi Soda Co Ltd エッチング廃液処理装置
JPH08269747A (ja) * 1995-03-31 1996-10-15 Nippon Aqua Kk エッチング液の再生方法およびエッチング液
JP3597250B2 (ja) * 1995-03-31 2004-12-02 日本アクア株式会社 エッチング液の再生方法およびエッチング液再生装置
JP2011522395A (ja) * 2008-01-11 2011-07-28 ピーピージー インダストリーズ オハイオ， インコーポレイテッド バイア内の導電性コア上に電着コーティングを有する回路ボードおよびその作製方法

Also Published As

Publication number Publication date
JPH0158270B2 (zh) 1989-12-11

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