JPH0158270B2 - - Google Patents
Info
- Publication number
- JPH0158270B2 JPH0158270B2 JP10924782A JP10924782A JPH0158270B2 JP H0158270 B2 JPH0158270 B2 JP H0158270B2 JP 10924782 A JP10924782 A JP 10924782A JP 10924782 A JP10924782 A JP 10924782A JP H0158270 B2 JPH0158270 B2 JP H0158270B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- hydrochloric acid
- concentration
- etching solution
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 103
- 238000005530 etching Methods 0.000 claims description 89
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 14
- 230000008929 regeneration Effects 0.000 claims description 12
- 238000011069 regeneration method Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 3
- 230000001172 regenerating effect Effects 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 45
- 238000004448 titration Methods 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 7
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229960003280 cupric chloride Drugs 0.000 description 5
- 229940045803 cuprous chloride Drugs 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 235000011118 potassium hydroxide Nutrition 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000001139 pH measurement Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229960002163 hydrogen peroxide Drugs 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- JBJWASZNUJCEKT-UHFFFAOYSA-M sodium;hydroxide;hydrate Chemical compound O.[OH-].[Na+] JBJWASZNUJCEKT-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10924782A JPS591679A (ja) | 1982-06-25 | 1982-06-25 | エツチング液の制御管理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10924782A JPS591679A (ja) | 1982-06-25 | 1982-06-25 | エツチング液の制御管理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS591679A JPS591679A (ja) | 1984-01-07 |
| JPH0158270B2 true JPH0158270B2 (zh) | 1989-12-11 |
Family
ID=14505338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10924782A Granted JPS591679A (ja) | 1982-06-25 | 1982-06-25 | エツチング液の制御管理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS591679A (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144499U (ja) * | 1984-08-22 | 1986-03-24 | 株式会社タダノ | 屈伸機構の作動制御装置 |
| JPS6159300U (zh) * | 1984-09-25 | 1986-04-21 | ||
| JPS61217500A (ja) * | 1985-03-22 | 1986-09-27 | 新明和工業株式会社 | 作業車の作動制御装置 |
| US5013395A (en) * | 1987-08-28 | 1991-05-07 | International Business Machines Corporation | Continuous regeneration of acid solution |
| EP0342669B1 (en) * | 1988-05-20 | 1995-08-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| JP2976319B2 (ja) * | 1992-08-21 | 1999-11-10 | 鶴見曹達株式会社 | エッチング廃液処理装置 |
| JP3597250B2 (ja) * | 1995-03-31 | 2004-12-02 | 日本アクア株式会社 | エッチング液の再生方法およびエッチング液再生装置 |
| US7743494B2 (en) * | 2008-01-11 | 2010-06-29 | Ppg Industries Ohio, Inc. | Process of fabricating a circuit board |
-
1982
- 1982-06-25 JP JP10924782A patent/JPS591679A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS591679A (ja) | 1984-01-07 |
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