JPS59161042A - Correcting process of wire bonding position - Google Patents
Correcting process of wire bonding positionInfo
- Publication number
- JPS59161042A JPS59161042A JP59030224A JP3022484A JPS59161042A JP S59161042 A JPS59161042 A JP S59161042A JP 59030224 A JP59030224 A JP 59030224A JP 3022484 A JP3022484 A JP 3022484A JP S59161042 A JPS59161042 A JP S59161042A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire bonding
- ball
- center
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はワイヤボンディングの位置補正方法に関する。[Detailed description of the invention] The present invention relates to a wire bonding position correction method.
半導体装置等の製造にお（・℃は、回路素子を形成する
シリコン片（ペレット）の電極と外部引出端子となるリ
ードとをワイヤで接続するワイヤボンディング作業があ
る。このワイヤボンディング作業は、極めて炉頂な作業
であることがら一自動化が図られて（・る。この自動化
の一形態として、一体化状態のペレットとリードとの位
置関係を測定（検出）し、この測定結果からボンディン
グ位置を演算して求め、自動的にワイヤボンディング機
構部を制御してワイヤボンティングを連続的に行なう方
法が提案されて℃・ろ。ところで、この方法１ｃ６って
、ペレットとリードとの位置測定後にペレットおよびリ
ードフレームが動かされることなく同一の設置位置でワ
イヤボンディングされる場合はよいが、測定位置（測定
ステーション）とワイヤボンディング位置（ワイヤボン
ディングステーション）が異なる場合は両者でのペレッ
トおよびリードの設定位置にずれが生じ易し・。また、
位置測定系やワイヤボンディング系が熱変形あるいは装
置各部の振動によって、当初の設定位置からずれた場合
には実際のボンディング位置がずれてしまう。In the manufacture of semiconductor devices, etc., there is wire bonding work that connects the electrodes of silicon pieces (pellets) that form circuit elements with the leads that serve as external terminals using wires. This wire bonding work is extremely As this work is carried out at the top of the furnace, automation is being attempted.As one form of this automation, the positional relationship between the integrated pellet and lead is measured (detected), and the bonding position is determined from this measurement result. A method has been proposed in which wire bonding is performed continuously by calculating and automatically controlling the wire bonding mechanism.By the way, in this method 1c6, after measuring the position of the pellet and lead, It is OK if wire bonding is performed at the same installation position without moving the lead frame, but if the measurement position (measuring station) and wire bonding position (wire bonding station) are different, the pellet and lead setting positions in both Misalignment can easily occur.Also,
If the position measurement system or the wire bonding system deviates from the initially set position due to thermal deformation or vibration of various parts of the device, the actual bonding position will deviate.
そこで、ペレットの電極に対するワイヤの接合状態を、
ときどき検査する必要があり、従来はこの作業は作業者
の目視観察によって行なっている。Therefore, the bonding state of the wire to the electrode of the pellet was
It is necessary to inspect from time to time, and conventionally this work has been carried out by visual observation by the operator.
しかし、このような目視観察作業では作業者によるため
作業性が低いとともに、良否の判断およびボンディング
機構の補正量の判断等が一定しなし・ｔｃどの欠点があ
る。However, such visual observation work is performed by an operator, so the workability is low, and there are drawbacks such as inconsistency in judgment of pass/fail and judgment of correction amount of the bonding mechanism.
したがって、本発明の目的は正確確実なワイヤボンディ
ングを行なうことにある。Therefore, an object of the present invention is to perform wire bonding accurately and reliably.
また、本発明の他の目的はワイヤボンディング後のボン
ディング状態の認識を自動的に行なうことにより、自動
ワイヤボンディング装置の無人運転化を図ることにある
。Another object of the present invention is to automatically recognize the bonding state after wire bonding, thereby realizing unmanned operation of an automatic wire bonding apparatus.
コノヨウな目的を達成するために本発明は、ペレットと
リードとの位置関係を検出し、この情報にもとづ〜・て
ボンディング位置を演算により求め、その結果によって
ボンディング機構を駆動させる自動ワイヤボンディング
方法にお〜・て、ボンディングステーションから外れた
アンローダ側にペレットのポンディングパッドに対する
ワイヤ接続部の接続状態を認識する検出機構を設けたも
のを使用し、この検出結果によってボンディング位置の
補正を図るものであって、以下実施例により本発明を説
明する。In order to achieve this purpose, the present invention detects the positional relationship between the pellet and the lead, calculates the bonding position based on this information, and uses the result to drive the bonding mechanism. In the method, a detection mechanism is installed on the unloader side away from the bonding station to recognize the connection state of the wire connection part to the pellet's bonding pad, and the bonding position is corrected based on the detection result. The present invention will be explained below with reference to Examples.
第１図に本発明の位置補正方法を適用した自動位置補正
式ワイヤボンディング方法の一実施例を示す。同図には
ボンディング方法のフローチャートが示されて（・ろ。FIG. 1 shows an embodiment of an automatic position correction type wire bonding method to which the position correction method of the present invention is applied. The same figure shows a flowchart of the bonding method.
まず、ペレットを一部に固定したリードフレームを検査
装置（測定装置）およびワイヤボンディング装置の両ヌ
テーションを兼ねるステージ上にローディングし位置決
め固定する。そして、検査装置とステージとの位置設定
（初期位置設定）を行なう。その後、ペレット位置をワ
イヤボンディング装置に取り付けた検査装置、たとえば
工業用カメラおよび工業用テレビジョンを用（・てペレ
ットパターンの位置を検査する。First, a lead frame to which a pellet is partially fixed is loaded onto a stage that serves as both an inspection device (measuring device) and a wire bonding device, and is positioned and fixed. Then, the positions of the inspection device and the stage are set (initial position setting). Thereafter, the position of the pellet pattern is inspected using an inspection device attached to the wire bonding machine, such as an industrial camera and an industrial television.
つぎに、この検査（測定）結果の情報およびあらかじめ
入力してお（・たペレットの各電極、リードフレームの
各リード位置関係等の情報しこもとづき、コンピュータ
等の演算装置を用いて各ボンディング位置の計算（演算
）を行ブよう。つぎに、工業用カメラをステージ−ヒが
も外（２て、ワイヤボンディング装置のワイヤボンディ
ング機構部を臨ませ、前記演算結果による情報によって
順次金線を熱圧着によって接続し、単位ペレットのワイ
ヤボンデインクが終了したリードフレームは搬送機構に
よって順次搬送され所定の収容箱あるいは次の組立ライ
ンにアンローティングされる。この際、前記搬送機構の
一部には検査ポジションが設けられ、ペレットのポンデ
ィングパッドに接続された金線の接合部（接続部）の状
態、すなわち接続面積の状態を検査する検査機構が配設
されている。この検査機構は光学的方法でボンディング
部を捕え、光の強弱の分布によってボンディング状態を
判定認識する。この情報は順次コンピータ等の制御系に
送られ（フィードバックされ）、制御系によって統計処
理される。そして−一定の゛傾向等が現れ、ペレットの
ボンディングバンドに対する金線接合部である球状部（
圧着ボール）のずれが許容精度の限界に近くなった。り
あるいは許容精度を外れろものが生じるようになると、
初期位置の修正（補正）が行なわれ、新たな基準でワイ
ヤボンディング位置の演算を行なうようになっている。Next, based on the information on the inspection (measurement) results and the information inputted in advance (e.g., the positional relationship between each electrode on the pellet and each lead on the lead frame), each bonding position is determined using an arithmetic device such as a computer. Next, place the industrial camera on the stage (2) to face the wire bonding mechanism of the wire bonding machine, and heat the gold wire in sequence based on the information from the calculation results. The lead frames, which are connected by crimping and after the wire bonding of unit pellets has been completed, are sequentially transported by a transport mechanism and unloaded to a predetermined storage box or to the next assembly line.At this time, a part of the transport mechanism is An inspection mechanism is provided for inspecting the condition of the joint (connection) of the gold wire connected to the pellet's pounding pad, that is, the condition of the connection area.This inspection mechanism uses an optical method. The bonding area is captured by the light, and the bonding state is determined and recognized based on the distribution of light intensity. This information is sequentially sent (feedback) to a control system such as a computer and statistically processed by the control system. etc. appear, and a spherical part (
The misalignment of the crimp ball (crimped ball) is close to the limit of permissible accuracy. If something goes wrong or goes out of tolerance,
The initial position is corrected (corrected), and the wire bonding position is calculated based on a new standard.
ここで、ペレットのボンディングバンド（電極）に対す
るワイヤの球状部の位置関係の認識方法につ℃・て２つ
の例について説明する。まず、第２図（ａｔ 、 （ｂ
ｌに示す方法は、圧着ボール１カずれが小さく・場合、
すなわち、圧着ボール１の中心０′がボンディングバン
ド２内にあル場合、圧着ボごル１のＸ 、 Ｙ方向の位
置ずれがポンディングパッド２０Ｘ、Ｙ方向長さの半分
以下ならば、圧着ボール１で被われたボンディングバン
ド２を認識することにより、Ｘ、Ｙ方向の圧着ボール１
の接線を求めることができる。すなわち、第２図（ａｔ
で示すように、ボンディングバンドクの中心に対して圧
着ボール１がｌだけずれて（・ろ場合、ポンディングパ
ッド２の認識結果は、第２図（ｂ）で示すように、光の
明るいボンディングバンド部（桝内に１と表示した領域
）と、金の圧着ボール１からなる光の暗（・領域（同図
中ハンチングで示す領域であり、がつ桝内に０と表示し
た領域とからなるマトリックスとなる。したがって、Ｙ
方向およびＹ方向にあって数値が０から１に変わる位置
が接点となるので、その点を通り、Ｘ、Ｙ方向に垂線を
引けば、圧着ボール１のほぼ中心０が求められる。なお
、この場合０から１に変わる位置が線分と１．する場合
には垂線は前記線分の中心に描くようにするどとによっ
て圧着ボールのほぼ中心は求まる。また。Here, two examples of how to recognize the positional relationship of the spherical part of the wire with respect to the bonding band (electrode) of the pellet will be described. First, Figure 2 (at, (b)
In the method shown in l, when the displacement of one crimp ball is small,
That is, when the center 0' of the crimp ball 1 is within the bonding band 2, if the displacement of the crimp ball 1 in the X and Y directions is less than half the length of the bonding pad 20 in the X and Y directions, the crimp ball By recognizing the bonding band 2 covered by 1, the bonding ball 1 in the X and Y directions is
You can find the tangent line. That is, FIG. 2 (at
As shown in Fig. 2(b), if the crimp ball 1 is shifted by l with respect to the center of the bonding band, the recognition result of the bonding pad 2 will be the bright bonding The band part (area indicated as 1 in the box) and the dark area (area (area indicated by hunting in the figure) consisting of the gold crimped ball 1 and the area indicated as 0 in the box) Therefore, Y
Since the position where the numerical value changes from 0 to 1 in the X and Y directions is a contact point, if a perpendicular line is drawn in the X and Y directions through that point, the approximate center 0 of the crimp ball 1 can be found. In this case, the position where the value changes from 0 to 1 is the line segment and 1. In this case, the approximate center of the crimped ball can be found by drawing a perpendicular line at the center of the line segment. Also.
この方法ではマトリックスを細分化すれば−１−７−１
ホど圧着ボールの中心とマトリックス線の中心０１との
差は△Ｓは小さくなる傾向にある。このような方法は、
実際のワイヤボンディングにあって圧着ボール１の中心
がポンディングパッド２の領域から外れることはほとん
どないので、実用的にはこの方法が最も簡単でかつ実際
的である。また、第２（ａ）におけるハツチングで示す
鎖線領域がたとえば、ポンディングパッド２に対する圧
着ボール１の中心のずれ許容領域である。また、大径の
鎖線円はポンディングパッドの中心に圧着ボールが一致
した状態を示す。In this method, if you subdivide the matrix, -1-7-1
The difference ΔS between the center of the hot-pressed ball and the center 01 of the matrix line tends to become smaller. Such a method is
Since the center of the crimp ball 1 rarely deviates from the area of the bonding pad 2 during actual wire bonding, this method is practically the simplest and most practical. Further, the hatched chain line area in 2(a) is, for example, an area where the center of the press-bonded ball 1 with respect to the bonding pad 2 is allowed to shift. Further, a large-diameter chain line circle indicates a state in which the crimp ball is aligned with the center of the bonding pad.
他の認識方法について第３図（ａ） 、 （ｂ）に示す
。この方法は、圧着ボール１のずれが大きい場合、すな
わち、前記第２図（ａ） 、 （ｂ）で示す方法ではポ
ンディングパッドから圧着ボールの中心が外れる場合に
はＸ、Ｙ方向の接線が求められない。そこで、任意の接
線を１本求めれば、その接線と直角の方向の線上に圧着
ボールの中心が存在するので、圧着ボールの径のばらつ
きが小さければ、圧着ボールの半径の平均値の点を圧着
ボールの中心と考えても誤差が小さいので、その点を圧
着ボールの中心と考えてもさしつかえない。Other recognition methods are shown in FIGS. 3(a) and 3(b). In this method, if the displacement of the crimp ball 1 is large, that is, if the center of the crimp ball deviates from the bonding pad in the method shown in FIGS. 2(a) and (b), the tangents in the X and Y directions will Not asked for. Therefore, if you find one arbitrary tangent, the center of the crimp ball will be on a line perpendicular to the tangent, so if the variation in the diameter of the crimp ball is small, the point of the average radius of the crimp ball will be crimped. Since the error is small even if it is considered as the center of the ball, it is safe to consider that point as the center of the crimped ball.
接線の求め方は、
（１）圧着ボール１で被われているポンディングパッド
領域（同図（ｂ）で示す桝内に０と表示した領域）と、
被われていないポンディングパッド領域（同図（ｂ）で
示すハツチングを施こしかつ桝内に１と表示した領域）
の境界の任意の一点（接点）Ｐを求める。゛
（２）つぎに、接点Ｐを通る直線を引き、その直線の傾
きを変化させながら、その直線上の明暗（０又は１）を
調べ、接線の傾きを求める。たとえば、第３図（ｂ）で
示す直線Ａは直線の接点Ｐの左側に０刹す
の領域が連線して現われ、右側は１の領域が現われる。How to find the tangent line is as follows: (1) The area of the bonding pad covered by the crimped ball 1 (the area indicated as 0 in the box shown in Figure (b)),
Uncovered pounding pad area (area shown in Figure (b) with hatching and marked 1 in the box)
Find an arbitrary point (contact point) P on the boundary of . (2) Next, draw a straight line passing through the contact point P, and while changing the slope of the straight line, check the brightness (0 or 1) on the straight line to find the slope of the tangent. For example, in the straight line A shown in FIG. 3(b), a continuous region of 0 appears on the left side of the contact point P of the straight line, and a region of 1 appears on the right side.
したがって、これは接線ではないことがわかる。同様に
、直線Ｂも接線ではない。そして直線Ｃで示すように、
接点Ｐの両側が同じ領域、すなわち、１の領域にある場
合が接線となる。そこで、この直線Ｃの接点Ｐに垂線を
描き、圧着ボール１の平均半径ｒを接点Ｐから求めろこ
とによって圧着ボール１の中心Ｏの位置を知ることがで
きる。この方法は前記方法よりも精度が低いので、圧着
ボールがＸ、Ｙ方向のいずれの方向にずれているのかを
知るのは簡単なので、順次ずれが小さくなる方向に位置
を移動してワイヤボンディングし、繰り返して位置補正
を行なうのが実用的と考えられる。Therefore, we know that this is not a tangent line. Similarly, straight line B is also not a tangent. And as shown by straight line C,
When both sides of the contact point P are in the same area, that is, in one area, it becomes a tangent line. Therefore, by drawing a perpendicular line to the contact point P of this straight line C and finding the average radius r of the crimp ball 1 from the contact point P, the position of the center O of the crimp ball 1 can be found. This method has lower accuracy than the above method, but since it is easy to know in which direction the crimp ball is displaced in the X or Y direction, wire bonding is performed by sequentially moving the position in the direction where the displacement becomes smaller. , it is considered practical to perform position correction repeatedly.
一方、圧着ボールがポンディソゲパッドに全熱。On the other hand, the crimped ball is completely heated by the pondisogae pad.
かかっていない場合、この場合はポンディングパッド以
外の領域には圧着ボールが接着しないので、ワイヤボン
ディング装置は金線切れ等によって停止する。したがっ
て、この場合だけは、作業者が位置合せをしなければな
らなくなる。。If not, the wire bonding device will stop due to wire breakage, etc., since the crimp ball will not adhere to areas other than the bonding pad. Therefore, only in this case, the operator has to perform alignment. .
なお、前記圧着ボールのずれ量はあらかじめコンピュー
タにインプットしたプログラムによって自動的に求めら
れる。The amount of displacement of the crimp ball is automatically determined by a program input into the computer in advance.
このような実施例によれば、常にワイヤボンディングの
接続後の状態を検査し、正確なワイヤボンディングがで
きるようにすることから、ワイヤボンディングの歩留の
向上か図れる。また、自動ワイヤボンディング作業の無
人化も図ることができる。According to this embodiment, since the state of wire bonding after connection is constantly inspected to ensure accurate wire bonding, it is possible to improve the yield of wire bonding. Furthermore, automatic wire bonding work can be unmanned.
なお、本発明の方法によるボンディング状態測定は前記
実施例に限定されなり・。すなわち、第４図のフローチ
ャートで示すように、ペレット位置測定およびボンディ
ング位置の演算とワイヤボンディングとが離れて行なわ
れる場合には、ワイヤボンディング後の接続状態情報を
ワイヤボンディング装置の位置設定をワイヤボンディン
グの途中で補正するようにしてもよ〜・。Note that the bonding state measurement by the method of the present invention is not limited to the above embodiments. In other words, as shown in the flowchart of FIG. 4, when pellet position measurement and bonding position calculation and wire bonding are performed separately, the connection state information after wire bonding is used to set the position of the wire bonding device during wire bonding. You can also try to correct it in the middle of the process.
以上のように１本発明の位置補正方法を適用した自動位
置補正式ワイヤボンディング方法によれば、ボンディン
グ結果をフィードバンクしてワイヤボンディングを補正
しながら行なうため、正確確実なワイヤボンディングが
行なえ、歩留が向上する。As described above, according to the automatic position correction type wire bonding method to which the position correction method of the present invention is applied, since wire bonding is performed while correcting wire bonding by feeding the bonding results, accurate and reliable wire bonding can be performed and Improves retention.
また、本発明のボンデイン矛位置補正方法を適用した自
動位置補正ワイヤボンディング装置によれば、ローディ
ングからアンローディング、および装置稼動中に生じろ
各部のずれ、振動によるワイヤボンディングの変化をも
自動的に検出ｔ７かつフィードバンクするため、一連の
作業においてほとんど作業者が不要となる。したがって
、−人の作業者が一度に多数台のこれら装置群を管理す
ることができろため１人件費の節減も図れろなどの効果
を奏する。In addition, according to the automatic position correction wire bonding device to which the bonding spear position correction method of the present invention is applied, changes in wire bonding due to misalignment of various parts and vibrations that occur during loading to unloading and during device operation can be automatically corrected. Since detection t7 and feedbank are performed, almost no operator is required in the series of operations. Therefore, it is possible for one worker to manage a large number of these devices at the same time, resulting in a reduction in personnel costs.
第１図は本発明の位置補正方法を適用した自動位置補正
式ワイヤボンディング方法の一実施例を示すフローチャ
ート、第２図（ａｌ 、 （ｂ）はベレットのポンディ
ングパッドに対するワイヤの接続位置の認識方法を示す
説明図、第３図（ａ） 、 （ｂ）はベレットのボンデ
ィングパットに対するワイヤの接続位置の他の認識方法
を示す説明図、第４図は本発明の位置補正方法を適用し
た他の実施例を示すフローチャートである。
１・・・圧着ボール、２・・・ボンディングパット、０
・・圧着ボールの中心、Ｐ・・−圧着ボールの接点、ｒ
・・・圧着ボールの平均半径、０．・・マトリックスに
よる圧着ボールの中心５△Ｓ・・マトリックスによる圧
着ボールの中心と圧着ボールの中心と力ずれ。
Ａ、Ｂ、Ｃ・・・直線。
第 １ 図 第 ４ 図↓
「Ｉ■口
第 ２ 図
（ｔｙ−） （ネ）
第 ３ 図
との） Ｃ幻FIG. 1 is a flowchart showing an example of an automatic position correction type wire bonding method applying the position correction method of the present invention, and FIGS. 3(a) and 3(b) are explanatory diagrams showing another method of recognizing the connection position of the wire to the bonding pad of the bullet, and FIG. It is a flowchart showing an example of 1... Pressure-bonding ball, 2... Bonding pad, 0
...Center of the crimp ball, P... - Contact point of the crimp ball, r
...Average radius of the crimped ball, 0. ...Center of the crimped ball due to the matrix 5ΔS... Force difference between the center of the crimped ball due to the matrix and the center of the crimped ball. A, B, C...straight line. Fig. 1 Fig. 4 ↓ “I■mouth Fig. 2 (ty-) (ne) with Fig. 3) C illusion
Claims (1)
布によってボンディング状態を認識し、前記認識結果に
基づき圧着ボールの周囲に少なくとも１本の接線を引く
ことにより前記圧着ボールの中心を求め、前記圧着ボー
ルの中心を認識した上でボンディング位置の補正をする
ことを特徴とするワイヤボンディングの位置補正方法。1. Capturing the bonding part by an optical method, recognizing the bonding state by the distribution of the intensity of light, and finding the center of the crimp ball by drawing at least one tangent around the crimp ball based on the recognition result, A wire bonding position correction method characterized by correcting the bonding position after recognizing the center of the crimp ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59030224A JPS59161042A (en) | 1984-02-22 | 1984-02-22 | Correcting process of wire bonding position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59030224A JPS59161042A (en) | 1984-02-22 | 1984-02-22 | Correcting process of wire bonding position |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52038530A Division JPS6034260B2 (en) | 1977-04-06 | 1977-04-06 | wire bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59161042A true JPS59161042A (en) | 1984-09-11 |
Family
ID=12297745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59030224A Pending JPS59161042A (en) | 1984-02-22 | 1984-02-22 | Correcting process of wire bonding position |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59161042A (en) |
-
1984
- 1984-02-22 JP JP59030224A patent/JPS59161042A/en active Pending
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