JPS59158570A - 固体撮像素子用パッケージの製造方法 - Google Patents

固体撮像素子用パッケージの製造方法

Info

Publication number
JPS59158570A
JPS59158570A JP58030733A JP3073383A JPS59158570A JP S59158570 A JPS59158570 A JP S59158570A JP 58030733 A JP58030733 A JP 58030733A JP 3073383 A JP3073383 A JP 3073383A JP S59158570 A JPS59158570 A JP S59158570A
Authority
JP
Japan
Prior art keywords
lead
solid
frame body
ceramic molding
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58030733A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518256B2 (enrdf_load_stackoverflow
Inventor
Akiya Izumi
泉　章也
Masahiko Kadowaki
正彦 門脇
Makoto Auchi
誠 阿内
Takeshi Fujita
毅 藤田
Toshio Kobayashi
敏男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58030733A priority Critical patent/JPS59158570A/ja
Publication of JPS59158570A publication Critical patent/JPS59158570A/ja
Publication of JPH0518256B2 publication Critical patent/JPH0518256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Light Receiving Elements (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58030733A 1983-02-28 1983-02-28 固体撮像素子用パッケージの製造方法 Granted JPS59158570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58030733A JPS59158570A (ja) 1983-02-28 1983-02-28 固体撮像素子用パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58030733A JPS59158570A (ja) 1983-02-28 1983-02-28 固体撮像素子用パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPS59158570A true JPS59158570A (ja) 1984-09-08
JPH0518256B2 JPH0518256B2 (enrdf_load_stackoverflow) 1993-03-11

Family

ID=12311867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58030733A Granted JPS59158570A (ja) 1983-02-28 1983-02-28 固体撮像素子用パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPS59158570A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196562U (enrdf_load_stackoverflow) * 1984-11-28 1986-06-21
KR100393050B1 (ko) * 2001-07-18 2003-07-28 주식회사 애트랩 광센서 및 그 패키징 방법
JP2012238687A (ja) * 2011-05-11 2012-12-06 Sony Corp 半導体パッケージ、半導体装置の製造方法、および固体撮像装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196562U (enrdf_load_stackoverflow) * 1984-11-28 1986-06-21
KR100393050B1 (ko) * 2001-07-18 2003-07-28 주식회사 애트랩 광센서 및 그 패키징 방법
JP2012238687A (ja) * 2011-05-11 2012-12-06 Sony Corp 半導体パッケージ、半導体装置の製造方法、および固体撮像装置
US10483308B2 (en) 2011-05-11 2019-11-19 Sony Corporation Reducing thickness of module in solid state imaging device

Also Published As

Publication number Publication date
JPH0518256B2 (enrdf_load_stackoverflow) 1993-03-11

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