JPS59157300A - 板状ワ−クのめつき装置 - Google Patents
板状ワ−クのめつき装置Info
- Publication number
- JPS59157300A JPS59157300A JP3147883A JP3147883A JPS59157300A JP S59157300 A JPS59157300 A JP S59157300A JP 3147883 A JP3147883 A JP 3147883A JP 3147883 A JP3147883 A JP 3147883A JP S59157300 A JPS59157300 A JP S59157300A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- work
- plating
- shaped
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3147883A JPS59157300A (ja) | 1983-02-25 | 1983-02-25 | 板状ワ−クのめつき装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3147883A JPS59157300A (ja) | 1983-02-25 | 1983-02-25 | 板状ワ−クのめつき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59157300A true JPS59157300A (ja) | 1984-09-06 |
JPH0411640B2 JPH0411640B2 (de) | 1992-03-02 |
Family
ID=12332368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3147883A Granted JPS59157300A (ja) | 1983-02-25 | 1983-02-25 | 板状ワ−クのめつき装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59157300A (de) |
-
1983
- 1983-02-25 JP JP3147883A patent/JPS59157300A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0411640B2 (de) | 1992-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4174261A (en) | Apparatus for electroplating, deplating or etching | |
US4372825A (en) | Plating sparger and method | |
KR101913882B1 (ko) | 도금 방법 | |
JP2020111781A (ja) | 表面処理装置 | |
JP3299725B2 (ja) | メッキ方法とその装置 | |
US5211826A (en) | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass | |
JPS59157300A (ja) | 板状ワ−クのめつき装置 | |
JPH033758B2 (de) | ||
JP4920365B2 (ja) | 処理槽 | |
US6284108B1 (en) | Method and apparatus for momentum plating | |
KR100732263B1 (ko) | 기판 형태의 작업물, 특히 인쇄 회로 기판을 전해처리하기위한 장치 | |
CN109317355B (zh) | 淋幕式涂布装置及淋幕式涂布系统 | |
JPH0261093A (ja) | 長尺ワーク用電気めっき装置 | |
KR0155204B1 (ko) | 도금액 분사식 도금장치 | |
JP3450179B2 (ja) | 表面処理装置 | |
JPS5985890A (ja) | 金属ストリツプの水平型流体支持電解処理方法及び装置 | |
JPH03191090A (ja) | 水平型電気めっき装置 | |
JP3063142U (ja) | 均圧式基板表面処理構造 | |
JP3015651B2 (ja) | 連続式電気めっき方法 | |
WO2003033774A1 (fr) | Dispositif de plaquage par transfert immerge pourvu de tubes de projection de fluide de plaquage | |
JP3022093B2 (ja) | 給液ノズル | |
JPS6389700A (ja) | めつき液噴射式めつき処理装置 | |
JP2004238690A (ja) | メッキ液噴出ノズル装置を設けた液中搬送式のメッキ処理装置 | |
JPH031390B2 (de) | ||
JPH036394A (ja) | 水平めっき槽 |