JPS59156003A - 温度補償圧電発振器 - Google Patents
温度補償圧電発振器Info
- Publication number
- JPS59156003A JPS59156003A JP3030983A JP3030983A JPS59156003A JP S59156003 A JPS59156003 A JP S59156003A JP 3030983 A JP3030983 A JP 3030983A JP 3030983 A JP3030983 A JP 3030983A JP S59156003 A JPS59156003 A JP S59156003A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- sheet
- crystal oscillator
- conductor layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/04—Constructional details for maintaining temperature constant
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
- C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030983A JPS59156003A (ja) | 1983-02-25 | 1983-02-25 | 温度補償圧電発振器 |
| EP83112593A EP0111890B1 (en) | 1982-12-15 | 1983-12-14 | Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure |
| DE8383112593T DE3382208D1 (de) | 1982-12-15 | 1983-12-14 | Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur. |
| US06/561,506 US4574255A (en) | 1982-12-15 | 1983-12-15 | MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate |
| AU22427/83A AU563467B2 (en) | 1982-12-15 | 1983-12-15 | Ceramic substrate for piezoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030983A JPS59156003A (ja) | 1983-02-25 | 1983-02-25 | 温度補償圧電発振器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59156003A true JPS59156003A (ja) | 1984-09-05 |
| JPH053162B2 JPH053162B2 (https=) | 1993-01-14 |
Family
ID=12300170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3030983A Granted JPS59156003A (ja) | 1982-12-15 | 1983-02-25 | 温度補償圧電発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59156003A (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793702A (en) * | 1980-12-02 | 1982-06-10 | Mitsubishi Electric Corp | Quartz oscillating circuit |
-
1983
- 1983-02-25 JP JP3030983A patent/JPS59156003A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793702A (en) * | 1980-12-02 | 1982-06-10 | Mitsubishi Electric Corp | Quartz oscillating circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH053162B2 (https=) | 1993-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4574255A (en) | MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate | |
| US4786888A (en) | Thermistor and method of producing the same | |
| JPS59156003A (ja) | 温度補償圧電発振器 | |
| JPS63300593A (ja) | セラミック複合基板 | |
| JPH0468803B2 (https=) | ||
| JP3317246B2 (ja) | 複合セラミック及び複合セラミック素子 | |
| JPH053161B2 (https=) | ||
| JPS59144206A (ja) | 積層セラミツク化水晶発振器 | |
| JPS5917233A (ja) | 複合積層セラミツク部品の製造方法 | |
| JPS59169210A (ja) | 積層型広帯域圧電発振器 | |
| JPS59168705A (ja) | 積層型電圧制御圧電発振器 | |
| JPH11265808A (ja) | サージ吸収素子及びその製造方法 | |
| JPH06333781A (ja) | Cr複合部品 | |
| US10718672B2 (en) | Piezoelectric device package | |
| JP3500277B2 (ja) | 積層型コンデンサおよびコンデンサ | |
| JPH03261122A (ja) | 可変容量素子 | |
| JPS59110208A (ja) | 複合積層化多周波水晶発振器 | |
| JP2853088B2 (ja) | 複合容量を有するセラミックブロック | |
| JPS6089995A (ja) | 複合積層セラミツク部品 | |
| JP2001077627A (ja) | 温度補償圧電発振器 | |
| JPS59169209A (ja) | 恒温槽付水晶発振器 | |
| JP2003347846A (ja) | 温度補償型水晶発振器 | |
| JPH0216005B2 (https=) | ||
| JPH06152240A (ja) | 電圧制御型発振器 | |
| JP3250944B2 (ja) | 配線基板 |