JPS59155761U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS59155761U JPS59155761U JP4676283U JP4676283U JPS59155761U JP S59155761 U JPS59155761 U JP S59155761U JP 4676283 U JP4676283 U JP 4676283U JP 4676283 U JP4676283 U JP 4676283U JP S59155761 U JPS59155761 U JP S59155761U
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- printed board
- contact
- component mounting
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来の部品取付例を示す基板の断面図
である。第３図〜第６図は本考案の実施例に関し、第４
図は平面図である。第３図は第４図のＡ−Ａでの断面図
である。第６図は、部品を取付けた状態を示す平面図で
ある。第５図は、第６図のＢ−Ｂでの断面図である。
１１．１□、１３・・・部品、２・・・リード線、３・
・・加工部分、４・・・基板、５・・・取付孔、６・・
・スペーサ、７・・・盛り上がり、８・・・裏面のラン
ド、９・・・半田。FIGS. 1 and 2 are cross-sectional views of a board showing an example of conventional component attachment. Figures 3 to 6 relate to embodiments of the present invention;
The figure is a plan view. FIG. 3 is a sectional view taken along line AA in FIG. 4. FIG. 6 is a plan view showing the state in which parts are attached. FIG. 5 is a sectional view taken along line BB in FIG. 6. 11.1□, 13...Parts, 2...Lead wire, 3.
...Processed part, 4... Board, 5... Mounting hole, 6...
・Spacer, 7...raised area, 8... land on back side, 9... solder.
Claims (1)
からの半抜きプレス作業で電気部品取付側の面に盛り上
りを設けてなり、取付けるべき電気部品からの水平対称
のリード線をそれぞれ上記別々の盛り上りの上面に当接
して取付孔へ向けて下げるリード線屈曲部の高さを高め
て、上記電気部品を表面から離し且つ表面に対し平行に
取付けることができることを特徴とする、プリント基板
。In contact with the flesh of each of the pair of electrical component mounting holes, a bulge is created on the surface on the electrical component mounting side by half-cutting press work from the back side, and horizontally symmetrical lead wires from the electrical components to be mounted are connected to each other. It is characterized by increasing the height of the bent portion of the lead wire that comes into contact with the upper surface of the separate bulges and lowers toward the mounting hole, so that the electrical component can be mounted away from the surface and parallel to the surface. Printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4676283U JPS59155761U (en) | 1983-04-01 | 1983-04-01 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4676283U JPS59155761U (en) | 1983-04-01 | 1983-04-01 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59155761U true JPS59155761U (en) | 1984-10-19 |
Family
ID=30177309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4676283U Pending JPS59155761U (en) | 1983-04-01 | 1983-04-01 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155761U (en) |
-
1983
- 1983-04-01 JP JP4676283U patent/JPS59155761U/en active Pending
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