JPS59151424U - Standoff structure of chip-shaped electronic components - Google Patents

Standoff structure of chip-shaped electronic components

Info

Publication number
JPS59151424U
JPS59151424U JP4556983U JP4556983U JPS59151424U JP S59151424 U JPS59151424 U JP S59151424U JP 4556983 U JP4556983 U JP 4556983U JP 4556983 U JP4556983 U JP 4556983U JP S59151424 U JPS59151424 U JP S59151424U
Authority
JP
Japan
Prior art keywords
chip
shaped electronic
electronic components
standoff structure
standoff
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4556983U
Other languages
Japanese (ja)
Inventor
敏夫 中島
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP4556983U priority Critical patent/JPS59151424U/en
Publication of JPS59151424U publication Critical patent/JPS59151424U/en
Pending legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図はそれぞれ従来のチップ状電子部品の
接続要領を示す正面図、第3図乃至第12図は本考案に
係るチップ状電子部品のスタンドオフ構造の実施例を示
すもので、第3図は第1の実施例の電子部品の正面図、
第4図は同側面図、第5図は同第3図の■−■矢視図、
第6図は同突出部形成要領図、第7図は同接続要領図、
第8図は第2の実施例の電子部品の正面図、第9図は第
3の実施例の電子部品の正面図、第10図は同側面図、
第11図は第9図の刈−■矢視図、第12図は同接続要
領図であを。 図中、21.31.41はチップ状電子部品、22.3
2.42は外装体、23. 24. 33゜34.43
.44は電極、25は素子、26゜27.45.46は
先端部、26a、27a、35゜36.45a、46a
は突出部、28.48はスリット、29は半田、47は
穴である。
FIGS. 1 and 2 are front views showing the connection procedure for conventional chip-shaped electronic components, respectively, and FIGS. 3 to 12 show examples of standoff structures for chip-shaped electronic components according to the present invention. , FIG. 3 is a front view of the electronic component of the first embodiment,
Fig. 4 is a side view of the same, Fig. 5 is a view taken from the ■-■ arrow in Fig. 3,
Figure 6 is a diagram of the protrusion formation procedure, Figure 7 is a diagram of the connection procedure,
FIG. 8 is a front view of the electronic component of the second embodiment, FIG. 9 is a front view of the electronic component of the third embodiment, and FIG. 10 is a side view of the same.
Fig. 11 is a view in the direction of the cutting-■ arrow in Fig. 9, and Fig. 12 is a diagram of the same connection procedure. In the figure, 21.31.41 is a chip-shaped electronic component, 22.3
2.42 is the exterior body, 23. 24. 33°34.43
.. 44 is an electrode, 25 is an element, 26°27.45.46 is a tip, 26a, 27a, 35°36.45a, 46a
is a protrusion, 28.48 is a slit, 29 is solder, and 47 is a hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外装体により覆われた素子の両側から、基板表面に形成
された回路の部品接続部にフェースボンディングにより
接続するための電極を該外装体の外部に導出してなるチ
ップ状電子部品において、前記電極の導出部分に、前記
部品接続部に対向可能な位置で前記外装体の底面より下
方に垂直に突出する突出部を設け、該突出部をスタンド
オフ用に利用するようにしたことを特徴とするチップ状
電子部品のスタンドオフ構造。
In a chip-shaped electronic component in which electrodes are led out from both sides of an element covered by an exterior body for connection by face bonding to a component connection portion of a circuit formed on a surface of a substrate, the electrodes are The lead-out portion is provided with a protrusion that protrudes vertically downward from the bottom surface of the exterior body at a position that can face the component connection portion, and the protrusion is used for a standoff. Standoff structure for chip-shaped electronic components.
JP4556983U 1983-03-29 1983-03-29 Standoff structure of chip-shaped electronic components Pending JPS59151424U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4556983U JPS59151424U (en) 1983-03-29 1983-03-29 Standoff structure of chip-shaped electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4556983U JPS59151424U (en) 1983-03-29 1983-03-29 Standoff structure of chip-shaped electronic components

Publications (1)

Publication Number Publication Date
JPS59151424U true JPS59151424U (en) 1984-10-11

Family

ID=30176089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4556983U Pending JPS59151424U (en) 1983-03-29 1983-03-29 Standoff structure of chip-shaped electronic components

Country Status (1)

Country Link
JP (1) JPS59151424U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120334U (en) * 1986-01-22 1987-07-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120334U (en) * 1986-01-22 1987-07-30

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