JPS59143085A - リ−ドフレ−ムの部分めつき装置 - Google Patents
リ−ドフレ−ムの部分めつき装置Info
- Publication number
- JPS59143085A JPS59143085A JP1569983A JP1569983A JPS59143085A JP S59143085 A JPS59143085 A JP S59143085A JP 1569983 A JP1569983 A JP 1569983A JP 1569983 A JP1569983 A JP 1569983A JP S59143085 A JPS59143085 A JP S59143085A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- anode
- plate
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1569983A JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1569983A JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59143085A true JPS59143085A (ja) | 1984-08-16 |
JPH0327637B2 JPH0327637B2 (enrdf_load_stackoverflow) | 1991-04-16 |
Family
ID=11896013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1569983A Granted JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59143085A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107354491A (zh) * | 2017-07-03 | 2017-11-17 | 富加宜连接器(东莞)有限公司 | 一种均匀镀膜方法 |
-
1983
- 1983-02-01 JP JP1569983A patent/JPS59143085A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107354491A (zh) * | 2017-07-03 | 2017-11-17 | 富加宜连接器(东莞)有限公司 | 一种均匀镀膜方法 |
CN107354491B (zh) * | 2017-07-03 | 2019-03-22 | 富加宜连接器(东莞)有限公司 | 一种均匀镀膜方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0327637B2 (enrdf_load_stackoverflow) | 1991-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ITRM980277A1 (it) | Procedimento per la disposizione di uno strato di materiale su un substrato e sistema di placcatura | |
JPS59143085A (ja) | リ−ドフレ−ムの部分めつき装置 | |
US4483749A (en) | Method and apparatus for plating minute parts | |
JP2617637B2 (ja) | 部分めっき装置および半導体装置用リードフレーム | |
JP3440348B2 (ja) | 連続めっき方法および連続めっき装置 | |
JPH02205697A (ja) | バンプメッキ装置 | |
JPS6214235B2 (enrdf_load_stackoverflow) | ||
JPH0864743A (ja) | リードフレームとこれを用いた半導体装置の製造方法 | |
JPH03239351A (ja) | リードフレームの製造方法 | |
JP2593638Y2 (ja) | 半導体製造装置 | |
KR200148654Y1 (ko) | 반도체의 납도금장치 | |
JPH03202488A (ja) | メッキ装置 | |
JP3438420B2 (ja) | 部分めっき装置 | |
JP3015766B2 (ja) | 半導体リードフレームのメッキ方法およびその装置 | |
TW534929B (en) | Apparatus for partially removing plating films of leadframe | |
JP2663369B2 (ja) | リードフレームの部分めっき装置 | |
JPH04199550A (ja) | リードの半田メッキ装置 | |
JP2926497B2 (ja) | 半導体装置の製造方法 | |
JPS5931882A (ja) | 浴中表面処理方法及びその装置 | |
JPS5828829A (ja) | 半導体ウエハ−のメツキ装置 | |
JPH1046394A (ja) | メッキ治具 | |
JP3167782B2 (ja) | 電子部品の高速半田めっき装置 | |
JPH04137541A (ja) | 突起電極の形成方法 | |
JPH11100692A (ja) | リードフレームの部分めっき装置および部分めっき方法 | |
PL83007B1 (en) | Electroplating - esp of selected regions of semiconductors[FR2144766A1] |