JPH0327637B2 - - Google Patents
Info
- Publication number
- JPH0327637B2 JPH0327637B2 JP1569983A JP1569983A JPH0327637B2 JP H0327637 B2 JPH0327637 B2 JP H0327637B2 JP 1569983 A JP1569983 A JP 1569983A JP 1569983 A JP1569983 A JP 1569983A JP H0327637 B2 JPH0327637 B2 JP H0327637B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- plate
- hole
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 69
- 239000007788 liquid Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1569983A JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1569983A JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59143085A JPS59143085A (ja) | 1984-08-16 |
JPH0327637B2 true JPH0327637B2 (enrdf_load_stackoverflow) | 1991-04-16 |
Family
ID=11896013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1569983A Granted JPS59143085A (ja) | 1983-02-01 | 1983-02-01 | リ−ドフレ−ムの部分めつき装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59143085A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107354491B (zh) * | 2017-07-03 | 2019-03-22 | 富加宜连接器(东莞)有限公司 | 一种均匀镀膜方法 |
-
1983
- 1983-02-01 JP JP1569983A patent/JPS59143085A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59143085A (ja) | 1984-08-16 |
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