JPS59143085A - リ−ドフレ−ムの部分めつき装置 - Google Patents

リ−ドフレ−ムの部分めつき装置

Info

Publication number
JPS59143085A
JPS59143085A JP1569983A JP1569983A JPS59143085A JP S59143085 A JPS59143085 A JP S59143085A JP 1569983 A JP1569983 A JP 1569983A JP 1569983 A JP1569983 A JP 1569983A JP S59143085 A JPS59143085 A JP S59143085A
Authority
JP
Japan
Prior art keywords
plating
lead frame
hole
plate
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1569983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0327637B2 (enrdf_load_html_response
Inventor
Takao Tokunaga
徳永　孝雄
Toshinobu Banjiyou
番條　敏信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1569983A priority Critical patent/JPS59143085A/ja
Publication of JPS59143085A publication Critical patent/JPS59143085A/ja
Publication of JPH0327637B2 publication Critical patent/JPH0327637B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1569983A 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置 Granted JPS59143085A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1569983A JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1569983A JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Publications (2)

Publication Number Publication Date
JPS59143085A true JPS59143085A (ja) 1984-08-16
JPH0327637B2 JPH0327637B2 (enrdf_load_html_response) 1991-04-16

Family

ID=11896013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1569983A Granted JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Country Status (1)

Country Link
JP (1) JPS59143085A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107354491A (zh) * 2017-07-03 2017-11-17 富加宜连接器（东莞）有限公司 一种均匀镀膜方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107354491A (zh) * 2017-07-03 2017-11-17 富加宜连接器（东莞）有限公司 一种均匀镀膜方法
CN107354491B (zh) * 2017-07-03 2019-03-22 富加宜连接器（东莞）有限公司 一种均匀镀膜方法

Also Published As

Publication number Publication date
JPH0327637B2 (enrdf_load_html_response) 1991-04-16

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