JPS59139664A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS59139664A
JPS59139664A JP58014199A JP1419983A JPS59139664A JP S59139664 A JPS59139664 A JP S59139664A JP 58014199 A JP58014199 A JP 58014199A JP 1419983 A JP1419983 A JP 1419983A JP S59139664 A JPS59139664 A JP S59139664A
Authority
JP
Japan
Prior art keywords
region
resistance
resistance element
element region
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58014199A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234466B2 (enExample
Inventor
Haruji Futami
二見　治司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58014199A priority Critical patent/JPS59139664A/ja
Publication of JPS59139664A publication Critical patent/JPS59139664A/ja
Publication of JPH0234466B2 publication Critical patent/JPH0234466B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP58014199A 1983-01-31 1983-01-31 半導体集積回路装置 Granted JPS59139664A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58014199A JPS59139664A (ja) 1983-01-31 1983-01-31 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58014199A JPS59139664A (ja) 1983-01-31 1983-01-31 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS59139664A true JPS59139664A (ja) 1984-08-10
JPH0234466B2 JPH0234466B2 (enExample) 1990-08-03

Family

ID=11854439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58014199A Granted JPS59139664A (ja) 1983-01-31 1983-01-31 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS59139664A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593051U (ja) * 1992-05-20 1993-12-17 沖電気工業株式会社 半導体圧力センサ
JP2021034500A (ja) * 2019-08-22 2021-03-01 セイコーエプソン株式会社 半導体装置及び発振器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50117767U (enExample) * 1974-03-07 1975-09-26
JPS57145359A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50117767U (enExample) * 1974-03-07 1975-09-26
JPS57145359A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593051U (ja) * 1992-05-20 1993-12-17 沖電気工業株式会社 半導体圧力センサ
JP2021034500A (ja) * 2019-08-22 2021-03-01 セイコーエプソン株式会社 半導体装置及び発振器

Also Published As

Publication number Publication date
JPH0234466B2 (enExample) 1990-08-03

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