JPS59136955A - 熱伝導性電気絶縁シ−トの製造方法 - Google Patents

熱伝導性電気絶縁シ−トの製造方法

Info

Publication number
JPS59136955A
JPS59136955A JP58010764A JP1076483A JPS59136955A JP S59136955 A JPS59136955 A JP S59136955A JP 58010764 A JP58010764 A JP 58010764A JP 1076483 A JP1076483 A JP 1076483A JP S59136955 A JPS59136955 A JP S59136955A
Authority
JP
Japan
Prior art keywords
composition
molecule
silicone rubber
boron nitride
glass cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58010764A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6412099B2 (enExample
Inventor
Ryoichi Ito
伊東　亮一
Yukio Shimazaki
島崎　行雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP58010764A priority Critical patent/JPS59136955A/ja
Publication of JPS59136955A publication Critical patent/JPS59136955A/ja
Publication of JPS6412099B2 publication Critical patent/JPS6412099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58010764A 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−トの製造方法 Granted JPS59136955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58010764A JPS59136955A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−トの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58010764A JPS59136955A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−トの製造方法

Publications (2)

Publication Number Publication Date
JPS59136955A true JPS59136955A (ja) 1984-08-06
JPS6412099B2 JPS6412099B2 (enExample) 1989-02-28

Family

ID=11759393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58010764A Granted JPS59136955A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−トの製造方法

Country Status (1)

Country Link
JP (1) JPS59136955A (enExample)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313505A (en) * 1976-07-21 1978-02-07 Takeshige Shimonohara Retaining wall by assemblage
JPS5565533A (en) * 1978-11-10 1980-05-17 Denki Kagaku Kogyo Kk Production of insulating radiator sheet
JPS5580461A (en) * 1978-12-13 1980-06-17 Shin Etsu Chem Co Ltd Thermal conductive silicone rubber composition
JPS56161140A (en) * 1980-05-16 1981-12-11 Denki Kagaku Kogyo Kk Manufacture of insulating heat radiating sheet
JPS5763246A (en) * 1980-10-06 1982-04-16 Denki Kagaku Kogyo Kk Heat radiating sheet
JPS5847341A (ja) * 1981-09-16 1983-03-19 Nippon Telegr & Teleph Corp <Ntt> 移動通信方式
JPS6145325A (ja) * 1984-08-10 1986-03-05 Hitachi Ltd プリント装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313505A (en) * 1976-07-21 1978-02-07 Takeshige Shimonohara Retaining wall by assemblage
JPS5565533A (en) * 1978-11-10 1980-05-17 Denki Kagaku Kogyo Kk Production of insulating radiator sheet
JPS5580461A (en) * 1978-12-13 1980-06-17 Shin Etsu Chem Co Ltd Thermal conductive silicone rubber composition
JPS56161140A (en) * 1980-05-16 1981-12-11 Denki Kagaku Kogyo Kk Manufacture of insulating heat radiating sheet
JPS5763246A (en) * 1980-10-06 1982-04-16 Denki Kagaku Kogyo Kk Heat radiating sheet
JPS5847341A (ja) * 1981-09-16 1983-03-19 Nippon Telegr & Teleph Corp <Ntt> 移動通信方式
JPS6145325A (ja) * 1984-08-10 1986-03-05 Hitachi Ltd プリント装置

Also Published As

Publication number Publication date
JPS6412099B2 (enExample) 1989-02-28

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