JPS59135792A - 導体配線基板 - Google Patents
導体配線基板Info
- Publication number
- JPS59135792A JPS59135792A JP958383A JP958383A JPS59135792A JP S59135792 A JPS59135792 A JP S59135792A JP 958383 A JP958383 A JP 958383A JP 958383 A JP958383 A JP 958383A JP S59135792 A JPS59135792 A JP S59135792A
- Authority
- JP
- Japan
- Prior art keywords
- chromium
- thin film
- copper
- circuit board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims description 11
- 239000011651 chromium Substances 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 6
- 229910052705 radium Inorganic materials 0.000 claims 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP958383A JPS59135792A (ja) | 1983-01-24 | 1983-01-24 | 導体配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP958383A JPS59135792A (ja) | 1983-01-24 | 1983-01-24 | 導体配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59135792A true JPS59135792A (ja) | 1984-08-04 |
| JPH0155593B2 JPH0155593B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=11724331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP958383A Granted JPS59135792A (ja) | 1983-01-24 | 1983-01-24 | 導体配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135792A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012086315A (ja) * | 2010-10-20 | 2012-05-10 | Nippon Telegr & Teleph Corp <Ntt> | 微細可動構造体の製造方法および微細可動構造体 |
-
1983
- 1983-01-24 JP JP958383A patent/JPS59135792A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012086315A (ja) * | 2010-10-20 | 2012-05-10 | Nippon Telegr & Teleph Corp <Ntt> | 微細可動構造体の製造方法および微細可動構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155593B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59135792A (ja) | 導体配線基板 | |
| JPS58108788A (ja) | フレキシブル配線板の被覆方法 | |
| JPS5998597A (ja) | 多層プリント配線板 | |
| JPH053160B2 (enrdf_load_stackoverflow) | ||
| JPS589399A (ja) | 金属芯印刷配線板の製造方法 | |
| JPS5948078U (ja) | 薄膜混成集積回路 | |
| JPS58196801U (ja) | 電流検出抵抗器 | |
| JPS59132668U (ja) | セラミツク多層基板 | |
| JPS6018579U (ja) | 湿式多層セラミツク基板 | |
| JPS60242693A (ja) | 印刷配線板とその製造方法 | |
| JPS58191449A (ja) | 多層配線構造 | |
| JPS61256794A (ja) | 印刷配線板 | |
| JPS6037746A (ja) | 半導体装置 | |
| JPH055196B2 (enrdf_load_stackoverflow) | ||
| JPS6356990A (ja) | 二層印刷回路基板の製造方法 | |
| JPS60190060U (ja) | 耐湿性導電体パタ−ンを有するフレキシブルプリント回路板 | |
| JPS6021589A (ja) | 混成集積回路用基板 | |
| JPS6066071U (ja) | 多層配線板 | |
| JPS58164130U (ja) | スイツチ回路板 | |
| JPS58191450A (ja) | 多層配線構造 | |
| JPS6045095A (ja) | 厚膜多層基板の製造方法 | |
| JPS6089996A (ja) | 多層回路基板 | |
| JPS60240193A (ja) | インバータ制御装置 | |
| JPS6252989A (ja) | 金属ベース両面可撓性回路基板の製造法 | |
| JPS61226992A (ja) | 酸化絶縁層を備えた可撓性回路基板 |