JPS5912942A - ポリエステル基板に金属層を付着させる方法 - Google Patents
ポリエステル基板に金属層を付着させる方法Info
- Publication number
- JPS5912942A JPS5912942A JP58068506A JP6850683A JPS5912942A JP S5912942 A JPS5912942 A JP S5912942A JP 58068506 A JP58068506 A JP 58068506A JP 6850683 A JP6850683 A JP 6850683A JP S5912942 A JPS5912942 A JP S5912942A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- polyester
- polyester substrate
- metal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 43
- 239000002184 metal Substances 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 42
- 229920000728 polyester Polymers 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 title claims description 33
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims 2
- 239000003637 basic solution Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 27
- 238000007772 electroless plating Methods 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 16
- 239000010410 layer Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 150000002739 metals Chemical class 0.000 description 12
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 230000005855 radiation Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 230000001235 sensitizing effect Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- MARDFMMXBWIRTK-UHFFFAOYSA-N [F].[Ar] Chemical compound [F].[Ar] MARDFMMXBWIRTK-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 230000008313 sensitization Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical group Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US396922 | 1982-07-09 | ||
| US06/396,922 US4440801A (en) | 1982-07-09 | 1982-07-09 | Method for depositing a metal layer on polyesters |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5912942A true JPS5912942A (ja) | 1984-01-23 |
| JPS6317905B2 JPS6317905B2 (enExample) | 1988-04-15 |
Family
ID=23569137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58068506A Granted JPS5912942A (ja) | 1982-07-09 | 1983-04-20 | ポリエステル基板に金属層を付着させる方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4440801A (enExample) |
| EP (1) | EP0098346B1 (enExample) |
| JP (1) | JPS5912942A (enExample) |
| DE (1) | DE3364472D1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0490453A (ja) * | 1990-08-01 | 1992-03-24 | Daikin Ind Ltd | 冷凍装置の運転制御装置 |
| US5364689A (en) * | 1992-02-21 | 1994-11-15 | Hashimoto Forming Industry Co., Ltd. | Painting with magnetically formed pattern and painted product with magnetically formed pattern |
| JP2016113688A (ja) * | 2014-12-17 | 2016-06-23 | キヤノン・コンポーネンツ株式会社 | めっき皮膜付樹脂製品及びその製造方法、並びにエンコーダ |
| JP2017133082A (ja) * | 2016-01-29 | 2017-08-03 | 株式会社タッチパネル研究所 | 導電性フィルムの製造方法および導電性フィルム |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4486463A (en) * | 1983-12-21 | 1984-12-04 | Gte Laboratories, Incorporated | Selective metal plating onto poly(phenylene sulfide) substrates |
| US4639378A (en) * | 1984-01-17 | 1987-01-27 | Inoue Japax Research Incorporated | Auto-selective metal deposition on dielectric surfaces |
| US4615907A (en) * | 1984-11-23 | 1986-10-07 | Phillips Petroleum Company | Plating poly(arylene sulfide) surfaces |
| US4661372A (en) * | 1985-12-23 | 1987-04-28 | General Motors Corporation | UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface |
| US5064681A (en) * | 1986-08-21 | 1991-11-12 | International Business Machines Corporation | Selective deposition process for physical vapor deposition |
| EP0272420A3 (en) * | 1986-12-22 | 1989-11-02 | General Electric Company | Photopatterned aromatic polymeric substrates, method for making same and use |
| US4882200A (en) * | 1987-05-21 | 1989-11-21 | General Electric Company | Method for photopatterning metallization via UV-laser ablation of the activator |
| DE68919328T2 (de) * | 1988-10-28 | 1995-05-24 | Ibm | Ultraviolette Laserablation und Ätzen von organischen Feststoffen. |
| JPH05202483A (ja) * | 1991-04-25 | 1993-08-10 | Shipley Co Inc | 無電解金属化方法と組成物 |
| US5378502A (en) * | 1992-09-09 | 1995-01-03 | U.S. Philips Corporation | Method of chemically modifying a surface in accordance with a pattern |
| BE1008038A5 (fr) * | 1994-01-31 | 1996-01-03 | Lucien Diego Laude | Procede de metallisation de matieres plastiques, et produits ainsi obtenus. |
| US6086946A (en) * | 1996-08-08 | 2000-07-11 | International Business Machines Corporation | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
| DE19852776A1 (de) * | 1998-11-16 | 2000-05-18 | Fraunhofer Ges Forschung | Verfahren zur Metallisierung von Kunststoffen |
| AU6495599A (en) | 1998-11-18 | 2000-06-05 | Radiovascular Systems, L.L.C. | Radioactive coating solutions, methods, and substrates |
| US6579609B1 (en) * | 2000-11-08 | 2003-06-17 | General Electric Company | Metallized polyester composition |
| JP4135459B2 (ja) * | 2002-10-10 | 2008-08-20 | トヨタ自動車株式会社 | 無電解めっき素材の前処理方法及びめっき被覆部材の製造方法 |
| DE102004017440A1 (de) * | 2004-04-08 | 2005-11-03 | Enthone Inc., West Haven | Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen |
| EP1975276A1 (en) * | 2007-03-30 | 2008-10-01 | Danmarks Tekniske Universitet | Preparation of a polymer article for selective metallization |
| US8051560B2 (en) * | 2009-10-16 | 2011-11-08 | Unimicron Technology Corp. | Method of fabricating a solder pad structure |
| US8637146B2 (en) * | 2011-11-17 | 2014-01-28 | Dupont Teijin Films U.S. Limited Partnership | Metallized opaque films with robust metal layer attachment |
| WO2013107065A1 (zh) * | 2012-01-18 | 2013-07-25 | 光宏精密股份有限公司 | 线路基板结构及其制作方法 |
| JP5997213B2 (ja) * | 2013-08-09 | 2016-09-28 | キヤノン・コンポーネンツ株式会社 | めっき方法 |
| LT6518B (lt) * | 2016-09-13 | 2018-04-25 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Būdas, skirtas elektrai laidžioms sritims ant polimerinio gaminio paviršiaus formuoti |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196238A (ja) * | 1982-05-13 | 1983-11-15 | Toyo Ink Mfg Co Ltd | 無電解メツキ方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436468A (en) * | 1965-05-28 | 1969-04-01 | Texas Instruments Inc | Plastic bodies having regions of altered chemical structure and method of making same |
| US3394023A (en) * | 1967-02-09 | 1968-07-23 | Thin Film Inc | Process for converting water-repellent surfaces of plastic into water-attractive surfaces |
| GB1324653A (en) * | 1970-12-11 | 1973-07-25 | Atomic Energy Authority Uk | Electroless plating processes |
| US3925578A (en) * | 1971-07-29 | 1975-12-09 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
| US3993802A (en) * | 1971-07-29 | 1976-11-23 | Photocircuits Division Of Kollmorgen Corporation | Processes and products for making articles for electroless plating |
| US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
| US3907621A (en) * | 1971-07-29 | 1975-09-23 | Photocircuits Corp | Method of sensitizing substrates for chemical metallization |
| NL176479C (nl) * | 1971-12-08 | 1985-04-16 | Hoechst Ag | Werkwijze voor het bekleden van kunststofvoorwerpen met koper. |
| US3801478A (en) * | 1972-01-27 | 1974-04-02 | Cottbus Textilkombinat | Process of metallizing polymeric materials |
| JPS57487B2 (enExample) * | 1974-08-31 | 1982-01-06 | ||
| US4042730A (en) * | 1976-03-29 | 1977-08-16 | Bell Telephone Laboratories, Incorporated | Process for electroless plating using separate sensitization and activation steps |
| CH610596A5 (enExample) * | 1977-02-16 | 1979-04-30 | Ebauches Sa | |
| US4133908A (en) * | 1977-11-03 | 1979-01-09 | Western Electric Company, Inc. | Method for depositing a metal on a surface |
| US4268536A (en) * | 1978-12-07 | 1981-05-19 | Western Electric Company, Inc. | Method for depositing a metal on a surface |
| US4239789A (en) * | 1979-05-08 | 1980-12-16 | International Business Machines Corporation | Maskless method for electroless plating patterns |
| FR2477170B1 (fr) * | 1980-02-28 | 1986-09-19 | Toyo Boseki | Article moule a base de polyester ou de polyamide sature ayant des proprietes ameliorees et son procede de production |
-
1982
- 1982-07-09 US US06/396,922 patent/US4440801A/en not_active Expired - Lifetime
-
1983
- 1983-03-10 DE DE8383102361T patent/DE3364472D1/de not_active Expired
- 1983-03-10 EP EP83102361A patent/EP0098346B1/en not_active Expired
- 1983-04-20 JP JP58068506A patent/JPS5912942A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196238A (ja) * | 1982-05-13 | 1983-11-15 | Toyo Ink Mfg Co Ltd | 無電解メツキ方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0490453A (ja) * | 1990-08-01 | 1992-03-24 | Daikin Ind Ltd | 冷凍装置の運転制御装置 |
| US5364689A (en) * | 1992-02-21 | 1994-11-15 | Hashimoto Forming Industry Co., Ltd. | Painting with magnetically formed pattern and painted product with magnetically formed pattern |
| US5630877A (en) * | 1992-02-21 | 1997-05-20 | Hashimoto Forming Industry Co., Ltd. | Painting with magnetically formed pattern and painted product with magnetically formed pattern |
| JP2016113688A (ja) * | 2014-12-17 | 2016-06-23 | キヤノン・コンポーネンツ株式会社 | めっき皮膜付樹脂製品及びその製造方法、並びにエンコーダ |
| JP2017133082A (ja) * | 2016-01-29 | 2017-08-03 | 株式会社タッチパネル研究所 | 導電性フィルムの製造方法および導電性フィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317905B2 (enExample) | 1988-04-15 |
| US4440801A (en) | 1984-04-03 |
| DE3364472D1 (en) | 1986-08-21 |
| EP0098346A1 (en) | 1984-01-18 |
| EP0098346B1 (en) | 1986-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6317905B2 (enExample) | ||
| JP3117386B2 (ja) | 基板を選択的に金属被覆する方法 | |
| US4328298A (en) | Process for manufacturing lithography masks | |
| EP0182193B1 (en) | A method of depositing a copper pattern on a substrate | |
| US4865873A (en) | Electroless deposition employing laser-patterned masking layer | |
| US4981715A (en) | Method of patterning electroless plated metal on a polymer substrate | |
| US4882200A (en) | Method for photopatterning metallization via UV-laser ablation of the activator | |
| JP3038057B2 (ja) | 基板の画定されたエッチング方法 | |
| EP0180101B1 (en) | Deposition of patterns using laser ablation | |
| JPH01500472A (ja) | 印刷回路板の製造方法 | |
| JPS63105973A (ja) | 光選択的金属付着法 | |
| JP2004343109A (ja) | 金属配線形成方法及びこれを用いた電磁波遮蔽フィルタ | |
| JP3999696B2 (ja) | 無電解めっき方法及びめっき部品 | |
| KR100292652B1 (ko) | 무전해도금용활성화촉매액및무전해도금방법 | |
| US5810913A (en) | Activating catalytic solution for electroless plating and method of electroless plating | |
| US5112434A (en) | Method for patterning electroless metal on a substrate followed by reactive ion etching | |
| US3776770A (en) | Method of selectively depositing a metal on a surface of a substrate | |
| US3839083A (en) | Selective metallization process | |
| JPH048958B2 (enExample) | ||
| JP2013204107A (ja) | 無電解めっき方法および配線板 | |
| JPH09272980A (ja) | 無電解めっきのための活性化触媒液および無電解めっき方法 | |
| JP2006526889A (ja) | ポリマー支持体材料およびセラミック支持体材料の構造化された金属被覆の方法、および当該方法に用いられる活性化可能な化合物 | |
| JPH0978250A (ja) | 導電性パターンの形成方法 | |
| JP3161407B2 (ja) | 無電解めっきのための活性化触媒液、および無電解めっき方法 | |
| JPS6177393A (ja) | 基板表面を部分金属化する方法 |