DE3364472D1 - A method for depositing a metal layer on polyesters - Google Patents

A method for depositing a metal layer on polyesters

Info

Publication number
DE3364472D1
DE3364472D1 DE8383102361T DE3364472T DE3364472D1 DE 3364472 D1 DE3364472 D1 DE 3364472D1 DE 8383102361 T DE8383102361 T DE 8383102361T DE 3364472 T DE3364472 T DE 3364472T DE 3364472 D1 DE3364472 D1 DE 3364472D1
Authority
DE
Germany
Prior art keywords
polyesters
depositing
metal layer
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383102361T
Other languages
German (de)
English (en)
Inventor
Ari Aviram
Veronica Ione Mayne-Banton
Rangaswamy Srinivasan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3364472D1 publication Critical patent/DE3364472D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8383102361T 1982-07-09 1983-03-10 A method for depositing a metal layer on polyesters Expired DE3364472D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/396,922 US4440801A (en) 1982-07-09 1982-07-09 Method for depositing a metal layer on polyesters

Publications (1)

Publication Number Publication Date
DE3364472D1 true DE3364472D1 (en) 1986-08-21

Family

ID=23569137

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383102361T Expired DE3364472D1 (en) 1982-07-09 1983-03-10 A method for depositing a metal layer on polyesters

Country Status (4)

Country Link
US (1) US4440801A (enExample)
EP (1) EP0098346B1 (enExample)
JP (1) JPS5912942A (enExample)
DE (1) DE3364472D1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4486463A (en) * 1983-12-21 1984-12-04 Gte Laboratories, Incorporated Selective metal plating onto poly(phenylene sulfide) substrates
US4639378A (en) * 1984-01-17 1987-01-27 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4661372A (en) * 1985-12-23 1987-04-28 General Motors Corporation UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface
US5064681A (en) * 1986-08-21 1991-11-12 International Business Machines Corporation Selective deposition process for physical vapor deposition
EP0272420A3 (en) * 1986-12-22 1989-11-02 General Electric Company Photopatterned aromatic polymeric substrates, method for making same and use
US4882200A (en) * 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
DE68919328T2 (de) * 1988-10-28 1995-05-24 Ibm Ultraviolette Laserablation und Ätzen von organischen Feststoffen.
JP2546069B2 (ja) * 1990-08-01 1996-10-23 ダイキン工業株式会社 冷凍装置の運転制御装置
JPH05202483A (ja) * 1991-04-25 1993-08-10 Shipley Co Inc 無電解金属化方法と組成物
EP0556449B1 (en) * 1992-02-21 1997-03-26 Hashimoto Forming Industry Co., Ltd. Painting with magnetically formed pattern and painted product with magnetically formed pattern
US5378502A (en) * 1992-09-09 1995-01-03 U.S. Philips Corporation Method of chemically modifying a surface in accordance with a pattern
BE1008038A5 (fr) * 1994-01-31 1996-01-03 Lucien Diego Laude Procede de metallisation de matieres plastiques, et produits ainsi obtenus.
US6086946A (en) * 1996-08-08 2000-07-11 International Business Machines Corporation Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby
DE19852776A1 (de) * 1998-11-16 2000-05-18 Fraunhofer Ges Forschung Verfahren zur Metallisierung von Kunststoffen
AU6495599A (en) 1998-11-18 2000-06-05 Radiovascular Systems, L.L.C. Radioactive coating solutions, methods, and substrates
US6579609B1 (en) * 2000-11-08 2003-06-17 General Electric Company Metallized polyester composition
JP4135459B2 (ja) * 2002-10-10 2008-08-20 トヨタ自動車株式会社 無電解めっき素材の前処理方法及びめっき被覆部材の製造方法
DE102004017440A1 (de) * 2004-04-08 2005-11-03 Enthone Inc., West Haven Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen
EP1975276A1 (en) * 2007-03-30 2008-10-01 Danmarks Tekniske Universitet Preparation of a polymer article for selective metallization
US8051560B2 (en) * 2009-10-16 2011-11-08 Unimicron Technology Corp. Method of fabricating a solder pad structure
US8637146B2 (en) * 2011-11-17 2014-01-28 Dupont Teijin Films U.S. Limited Partnership Metallized opaque films with robust metal layer attachment
WO2013107065A1 (zh) * 2012-01-18 2013-07-25 光宏精密股份有限公司 线路基板结构及其制作方法
JP5997213B2 (ja) * 2013-08-09 2016-09-28 キヤノン・コンポーネンツ株式会社 めっき方法
JP6059198B2 (ja) * 2014-12-17 2017-01-11 キヤノン・コンポーネンツ株式会社 めっき皮膜付樹脂製品及びその製造方法、並びにエンコーダ
JP2017133082A (ja) * 2016-01-29 2017-08-03 株式会社タッチパネル研究所 導電性フィルムの製造方法および導電性フィルム
LT6518B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Būdas, skirtas elektrai laidžioms sritims ant polimerinio gaminio paviršiaus formuoti

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
US3394023A (en) * 1967-02-09 1968-07-23 Thin Film Inc Process for converting water-repellent surfaces of plastic into water-attractive surfaces
GB1324653A (en) * 1970-12-11 1973-07-25 Atomic Energy Authority Uk Electroless plating processes
US3925578A (en) * 1971-07-29 1975-12-09 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
NL176479C (nl) * 1971-12-08 1985-04-16 Hoechst Ag Werkwijze voor het bekleden van kunststofvoorwerpen met koper.
US3801478A (en) * 1972-01-27 1974-04-02 Cottbus Textilkombinat Process of metallizing polymeric materials
JPS57487B2 (enExample) * 1974-08-31 1982-01-06
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
CH610596A5 (enExample) * 1977-02-16 1979-04-30 Ebauches Sa
US4133908A (en) * 1977-11-03 1979-01-09 Western Electric Company, Inc. Method for depositing a metal on a surface
US4268536A (en) * 1978-12-07 1981-05-19 Western Electric Company, Inc. Method for depositing a metal on a surface
US4239789A (en) * 1979-05-08 1980-12-16 International Business Machines Corporation Maskless method for electroless plating patterns
FR2477170B1 (fr) * 1980-02-28 1986-09-19 Toyo Boseki Article moule a base de polyester ou de polyamide sature ayant des proprietes ameliorees et son procede de production
JPS58196238A (ja) * 1982-05-13 1983-11-15 Toyo Ink Mfg Co Ltd 無電解メツキ方法

Also Published As

Publication number Publication date
JPS6317905B2 (enExample) 1988-04-15
US4440801A (en) 1984-04-03
EP0098346A1 (en) 1984-01-18
EP0098346B1 (en) 1986-07-16
JPS5912942A (ja) 1984-01-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee