GB1324653A - Electroless plating processes - Google Patents

Electroless plating processes

Info

Publication number
GB1324653A
GB1324653A GB1324653DA GB1324653A GB 1324653 A GB1324653 A GB 1324653A GB 1324653D A GB1324653D A GB 1324653DA GB 1324653 A GB1324653 A GB 1324653A
Authority
GB
United Kingdom
Prior art keywords
ions
electroless plating
substrate
electrons
dec
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Atomic Energy Authority
Original Assignee
UK Atomic Energy Authority
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Atomic Energy Authority filed Critical UK Atomic Energy Authority
Publication of GB1324653A publication Critical patent/GB1324653A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3178—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1324653 Activation and electroless plating UNITED KINGDOM ATOMIC ENERGY AUTHORITY 11 Dec 1970 [11 Dec 1969] 60626/ 69 Addition to 1247007 Heading C7F Prior to electroless plating , a substrate is bombarded with a dosage of ions sufficient to provide an activated, but not a coated surface, the ions being derived from a source forming a plasma of ions and electrons, and the surface being subjected to alternate periods of bombardment by said ions and electrons respectively in order to prevent build-up of charge on the surface. As shown, make-and-break contacts 1, one of C and the other of Pd, are driven by vibrator 2 and an arc is produced by D.C. source 3. A.C. is applied between 1 and extraction electrode 4 by winding 5, there being beyond the aperture in 4 two arcuate plates 6, one electrically connected to 4 and the other connected in phase to 5. Thus there are produced in +ve and -ve half cycles Pd ions and electrons respectively which are deflected to bombard substrate 7, any neutral particles being caught on plates 6. The ion energy may be 100-1000 eV, the substrate glass or plastics, and the subsequent electroless coating Ni or magnetic alloy, e.g. Ni-Co-P.
GB1324653D 1970-12-11 1970-12-11 Electroless plating processes Expired GB1324653A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6062669 1970-12-11

Publications (1)

Publication Number Publication Date
GB1324653A true GB1324653A (en) 1973-07-25

Family

ID=10485833

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1324653D Expired GB1324653A (en) 1970-12-11 1970-12-11 Electroless plating processes

Country Status (1)

Country Link
GB (1) GB1324653A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440801A (en) * 1982-07-09 1984-04-03 International Business Machines Corporation Method for depositing a metal layer on polyesters
US4686114A (en) * 1986-01-17 1987-08-11 Halliwell Michael J Selective electroless plating
US7622205B2 (en) 2004-04-16 2009-11-24 Fuji Electric Device Technology Co. Ltd. Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate
US8039045B2 (en) 2004-07-27 2011-10-18 Fuji Electric Co., Ltd. Method of manufacturing a disk substrate for a magnetic recording medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440801A (en) * 1982-07-09 1984-04-03 International Business Machines Corporation Method for depositing a metal layer on polyesters
US4686114A (en) * 1986-01-17 1987-08-11 Halliwell Michael J Selective electroless plating
US7622205B2 (en) 2004-04-16 2009-11-24 Fuji Electric Device Technology Co. Ltd. Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate
US8039045B2 (en) 2004-07-27 2011-10-18 Fuji Electric Co., Ltd. Method of manufacturing a disk substrate for a magnetic recording medium

Similar Documents

Publication Publication Date Title
US4250009A (en) Energetic particle beam deposition system
US3913320A (en) Electron-bombardment ion sources
GB1483966A (en) Vapourized-metal cluster ion source and ionized-cluster beam deposition
GB1209266A (en) Improvements in methods and apparatus for making electrical conductive pattern
GB1532759A (en) Production of monocrystalline layers on substrates
FR2402301A1 (en) Micro-machining substrates by ion erosion - where magnetron creates electron cyclotron resonance in neutral argon ion plasma
US3341352A (en) Process for treating metallic surfaces with an ionic beam
GB1324653A (en) Electroless plating processes
GB1518911A (en) Ion plating method
GB1064101A (en) Improvements in or relating to ion sources
GB1420545A (en) Evaporation by electron beans
JPS57157511A (en) Opposite target type sputtering device
GB1207091A (en) Method of manufacturing and electronic discharge tube including a photocathode
Ohya et al. Production of atomic-oxygen negative-ion beam by positive ion-Induced sputtering of semiconductive BaTiO3 ceramic
GB1351582A (en) Ion source
JPH04354868A (en) Target for magnetron sputtering device
JPS5585671A (en) Sputtering apparatus
FR2208708A1 (en) Vacuum deposition of catalyst - from atomic dispersion produced by bombarding target with accelerated ions
GB1205216A (en) Improvements in or relating to mass spectrometers
GB1447754A (en) Apparatus for and process of metal coating
FR2319194A1 (en) Heavy iron source producing e.g. uranium oxide ions - by bombardment of a target with a neutral or partly neutralised primary beam
FR2335942A2 (en) Heavy iron source producing e.g. uranium oxide ions - by bombardment of a target with a neutral or partly neutralised primary beam
JPS5635763A (en) Film thickness controlling system
SE332461B (en)
JPH04263066A (en) Sputtering deposition device

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee