JPS59126686A - リフトオフ法によるパタ−ン形成法 - Google Patents
リフトオフ法によるパタ−ン形成法Info
- Publication number
- JPS59126686A JPS59126686A JP58001184A JP118483A JPS59126686A JP S59126686 A JPS59126686 A JP S59126686A JP 58001184 A JP58001184 A JP 58001184A JP 118483 A JP118483 A JP 118483A JP S59126686 A JPS59126686 A JP S59126686A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cutting die
- coating layer
- deposited
- deposit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 22
- 230000007261 regionalization Effects 0.000 title 1
- 239000010410 layer Substances 0.000 claims abstract description 52
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- 239000011247 coating layer Substances 0.000 claims abstract description 19
- 206010011224 Cough Diseases 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 14
- 230000010358 mechanical oscillation Effects 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 241000981595 Zoysia japonica Species 0.000 description 2
- 208000031513 cyst Diseases 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- MYLBTCQBKAKUTJ-UHFFFAOYSA-N 7-methyl-6,8-bis(methylsulfanyl)pyrrolo[1,2-a]pyrazine Chemical compound C1=CN=CC2=C(SC)C(C)=C(SC)N21 MYLBTCQBKAKUTJ-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58001184A JPS59126686A (ja) | 1983-01-10 | 1983-01-10 | リフトオフ法によるパタ−ン形成法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58001184A JPS59126686A (ja) | 1983-01-10 | 1983-01-10 | リフトオフ法によるパタ−ン形成法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59126686A true JPS59126686A (ja) | 1984-07-21 |
JPS6317349B2 JPS6317349B2 (enrdf_load_stackoverflow) | 1988-04-13 |
Family
ID=11494361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58001184A Granted JPS59126686A (ja) | 1983-01-10 | 1983-01-10 | リフトオフ法によるパタ−ン形成法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59126686A (enrdf_load_stackoverflow) |
-
1983
- 1983-01-10 JP JP58001184A patent/JPS59126686A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6317349B2 (enrdf_load_stackoverflow) | 1988-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005142254A (ja) | 配線基板及びその製造方法 | |
JPS59126686A (ja) | リフトオフ法によるパタ−ン形成法 | |
JP4401527B2 (ja) | 半導体チップの製造方法 | |
JPS59232423A (ja) | パタ−ン形成方法 | |
CN118658790B (zh) | 封装基板的制法 | |
JP7689089B2 (ja) | 基板の製造方法 | |
JPH05259646A (ja) | プリント配線板の製造方法 | |
JP2630232B2 (ja) | 多層配線基板の製造方法 | |
CN108882562B (zh) | 线路板单元与其制作方法 | |
JP2929882B2 (ja) | 半導体装置用キャリアテープおよびその製造方法 | |
JPH0129055B2 (enrdf_load_stackoverflow) | ||
JPH05326783A (ja) | リードフレームの製造方法 | |
JPH02244663A (ja) | リードフレームの製造方法 | |
JP2775584B2 (ja) | 配線基板の製造法 | |
JPH01144656A (ja) | 多層配線構造およびその製造方法 | |
JP2644847B2 (ja) | 多層配線基板及びその製造方法 | |
JPS60154625A (ja) | 多層絶縁膜のスルホ−ル形成方法 | |
JPH0228324A (ja) | 半導体装置の製造方法 | |
JPH0645332A (ja) | 半導体装置の製造方法 | |
JP2000353748A (ja) | 半導体装置の製造方法 | |
JP3327189B2 (ja) | 多層配線tabテープの製造方法 | |
JPH0537124A (ja) | プリント配線板の製造方法 | |
JPS59155934A (ja) | 微細パタ−ンの形成方法 | |
JPH03108790A (ja) | プリント配線板の露光方法 | |
JPS60153145A (ja) | 半導体装置の製造方法 |