JPS59124149A - セラミツク回路基板の製造方法 - Google Patents

セラミツク回路基板の製造方法

Info

Publication number
JPS59124149A
JPS59124149A JP57233705A JP23370582A JPS59124149A JP S59124149 A JPS59124149 A JP S59124149A JP 57233705 A JP57233705 A JP 57233705A JP 23370582 A JP23370582 A JP 23370582A JP S59124149 A JPS59124149 A JP S59124149A
Authority
JP
Japan
Prior art keywords
ceramic circuit
green sheet
binder
copper paste
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57233705A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035075B2 (cg-RX-API-DMAC7.html
Inventor
Hirozo Yokoyama
横山　博三
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57233705A priority Critical patent/JPS59124149A/ja
Publication of JPS59124149A publication Critical patent/JPS59124149A/ja
Publication of JPH035075B2 publication Critical patent/JPH035075B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP57233705A 1982-12-29 1982-12-29 セラミツク回路基板の製造方法 Granted JPS59124149A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57233705A JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57233705A JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS59124149A true JPS59124149A (ja) 1984-07-18
JPH035075B2 JPH035075B2 (cg-RX-API-DMAC7.html) 1991-01-24

Family

ID=16959251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57233705A Granted JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS59124149A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153193A (ja) * 1984-01-23 1985-08-12 富士通株式会社 セラミツク回路基板用導電ペ−スト
JPH01179407A (ja) * 1988-01-07 1989-07-17 Murata Mfg Co Ltd セラミック生シートの積層方法
JPH01212419A (ja) * 1988-02-19 1989-08-25 Murata Mfg Co Ltd セラミック積層体の製造方法
JPH05213679A (ja) * 1991-10-18 1993-08-24 Internatl Business Mach Corp <Ibm> 金属／セラミック基板における金属・セラミック間の界面領域およびその形成方法
JPH05221760A (ja) * 1992-02-04 1993-08-31 Shinko Electric Ind Co Ltd 回路形成用金属ペースト及びセラミック回路基板の製造方法
WO2012105068A1 (ja) * 2011-02-04 2012-08-09 三菱電機株式会社 パターン形成方法および太陽電池の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396692A (en) * 1977-02-03 1978-08-24 Dainippon Printing Co Ltd Method of making electrode plate
JPS55107295A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Method of fabricating ceramic circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396692A (en) * 1977-02-03 1978-08-24 Dainippon Printing Co Ltd Method of making electrode plate
JPS55107295A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Method of fabricating ceramic circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153193A (ja) * 1984-01-23 1985-08-12 富士通株式会社 セラミツク回路基板用導電ペ−スト
JPH01179407A (ja) * 1988-01-07 1989-07-17 Murata Mfg Co Ltd セラミック生シートの積層方法
JPH01212419A (ja) * 1988-02-19 1989-08-25 Murata Mfg Co Ltd セラミック積層体の製造方法
JPH05213679A (ja) * 1991-10-18 1993-08-24 Internatl Business Mach Corp <Ibm> 金属／セラミック基板における金属・セラミック間の界面領域およびその形成方法
JPH05221760A (ja) * 1992-02-04 1993-08-31 Shinko Electric Ind Co Ltd 回路形成用金属ペースト及びセラミック回路基板の製造方法
WO2012105068A1 (ja) * 2011-02-04 2012-08-09 三菱電機株式会社 パターン形成方法および太陽電池の製造方法

Also Published As

Publication number Publication date
JPH035075B2 (cg-RX-API-DMAC7.html) 1991-01-24

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