JPS59123789A - 陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法 - Google Patents

陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法

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Publication number
JPS59123789A
JPS59123789A JP58150456A JP15045683A JPS59123789A JP S59123789 A JPS59123789 A JP S59123789A JP 58150456 A JP58150456 A JP 58150456A JP 15045683 A JP15045683 A JP 15045683A JP S59123789 A JPS59123789 A JP S59123789A
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JP
Japan
Prior art keywords
plating
treated
treatment
oxidized film
aluminum body
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Pending
Application number
JP58150456A
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English (en)
Inventor
リチヤ−ド・ウエイン・バ−ンズ
イサ・セツド・マ−ミユ−ド
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International Business Machines Corp
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International Business Machines Corp
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Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS59123789A publication Critical patent/JPS59123789A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 ［技術分野］ 本発明は、硬質の陽極酸化を施された（ｈａｒｄａｎｏ
ｄｉｚｅｄ）アルミニウム基板上に銅をめっきするため
の処理方法に係る。
Ｅ従来技術］ 従来、アルミニウム及びアルミニウム合金のめつきにお
いて、多孔性の陽極酸化が表面の予備処理として几いら
れている。例えば、米国特許第３９４３０３９号明細書
は、ニッケルめっきの前の陽極酸化工程について開示し
ている。（ｉｌｅｒｎｉｃｋ及びＰｉｎｎｅｒによる５
ｕｒｆａｃｅ　Ｔｒｅａｔｍｅｎｔ　ｏｆ　Ａｌｕｍｉ
、ｎｕｍと題する文献は、陽極酸化が予備処理工程とし
て用いられているめっき方法について記載している。
Ａｍｅｒｉｃａｎ　　Ｅｌｅｃｔ、ｒｏｐｌａｊｅｒｓ
　　５ｏｃｉｅしｙ　　Ｊｏｕｒｎａｌ、虱枯靜ｇａｎ
ｄ　５ｕｒｆａｃｅ　Ｆｉｎｉｓｈｉｎｇの１９８２年
１０月号第５７頁における、Ｄａｖｊｄ　ＩＥ、　Ｔｈ
ｏｍａｓによる”Ａｃ１ｈｅｓｉｏｎ　　Ｆａｉｌｕｒ
ｅ　　ｏｆ　　Ｅ］、ｅｃｅｒｏｄｅｐｏｓｉｔｅｄＣ
ｏａｔｉｎｇｓ　ｏｎ　Ａｎｏｄｉｚｅｄ　Ａｌｕｍｉ
ｎｕｍ　Ａ１１ｏｙｓ”と題する文献は、陽極酸化をめ
っきの前の予備処理として用いることについて論じてい
る。
上記従来技術はすべて、薄い陽極酸化膜に関するもので
ある。その様な薄い被膜は、通常燐酸による陽極酸化を
用いている。その結果得られた被膜は、良好な絶品体で
なく、充分な電流密度を用いて電着が可能である。
更に、陽極酸化されたアルミニウムは、電子的パッケー
ジに用いられる誘電体材料として用いられている。厚い
陽極酸化膜の金属化は、銅箔を積層化した後に食刻する
ことによって達成されることが知られている。その様な
方法は、陽極酸化された基板の使用を、片面の回路板に
限定する。
アルミニウム及びアルミニウム合金を、自然酸化及び陽
極酸化された状態でめっきするための多くの方法が知ら
れている。従来、陽極酸化されたアルミニウムのめっき
は、０．０５１．ｎ＋ｍの厚さ迄の比較的薄い被膜に限
定されている。それらの被膜は多孔性であり、適切なめ
っき条件を用いイしは、成る種の金属が表面を条件付け
ることなく上記被１１桑」二にめっきされる。
０．１ｍｍ以上の厚い被膜は非導電性であり、それらの
被膜への直接のめっきは従来達成さ、れでいない。
［発明の概要コ 本発明の方法は、アルミニウム基板上の厚い陽極酸化膜
をめっきするための改良された方法により、良好な熱放
散特性を有する著しく低コス１へのパンケージンクを提
供する。本発明の方法は、著しい固着性を有する（ｆａ
ｓｔｅｒ）新規な予備処理組成物を提供する。アルミニ
ウム被処理体が陽極酸化されて、厚い陽極酸化膜が形成
される。次に、上記被処理体か塩化第一錫、塩酸及び水
より成る溶液中で室温において２分間増感及び食刻され
る。
蒸留水で洗浄された後、上記被処理体が塩化パラジウム
及び塩酸を含む溶液中で活性化される。上記活性化工程
の後に、再び蒸留水で洗浄される。
その結果、初めに無電解ニッケルめっき浴を用いてめっ
きされてから、従来の酸性の銅めっき浴中で電気めっき
される構造体がイ何られで。
無電解めっき又は電気めっきのいずれの溶液が用いられ
ても、厚い陽極酸化膜」−のめっきが、本発明の方法に
よる増感及び活性化工程の後に可能である。
実施例 本発明の方法は次の工程を含む。
（ａ）　　硬質の陽極酸化。
（ｂ）　　封１］二。
（ｃ）　　次の組成よる成る溶液中で増感及び食刻。
塩化第一錫（ＳｎＣＱ　２　・４Ｎ　２０）　　４’Ｏ
ｇ／　Ｑ塩酸（Ｉ＋（１，３６％）　　　　　　６０ｍ
　Ｑ　／　Ｑ水　　　　　　　　　　　　　　　　　　
　ＩＱ（ｄ）　　蒸留水中で洗浄。
（ｅ）　　次の組成より成る溶液中で活性化。
塩化パラジウム（ＰｄＣＱ　２　）　　　０．２５ｇ塩
酸（ｌｌｃｆｌ、３６％）　　　　　　　２．５ｍ１２
（ｆ）　　蒸留水中で洗浄。
（ｇ）　　無電解ニッケルめっき浴中で５乃至１０分間
めっき。
（ｈ）１乃至２Ａ／ｄｍ２の電流密度、１乃至２■の電
圧、及び２１乃至２７゛Ｃの温度を用いて、酸性の銅め
っき浴中てめつき。
銅のめつき時間は所望の被膜の厚さの関数である。次の
式は時間と厚さとの関係を示す。
」−記式において、 ｔ＝厚さ　（ｍｍ） 比重＝８．９５　（銅） ｇ／Ａ一時間＝１．１．８２（銅） 電流密度＝］乃至２Ａ／ｄｍ２ 電流効率＝９５％（酸性の銅めっき浴）である。
出願人　インターナショナル・ヒジネス・マシーンズ・
コーポレーション

Claims (1)

    【特許請求の範囲】
  1. アルミニウム被処理体の表面をＳ　ｎ　ＣＱ　２及びＨ
    ＣＱの溶液中で増感し、上記表面をＰｄＣＱ２及びＨｌ
    を含む溶液中で活性化することを含む、封止された厚い
    陽極酸化膜を有するアルミニウム被処理体をめっきのた
    めに処理する方法。
JP58150456A 1982-12-27 1983-08-19 陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法 Pending JPS59123789A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/453,022 US4431707A (en) 1982-12-27 1982-12-27 Plating anodized aluminum substrates
US453022 1982-12-27

Publications (1)

Publication Number Publication Date
JPS59123789A true JPS59123789A (ja) 1984-07-17

Family

ID=23798911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58150456A Pending JPS59123789A (ja) 1982-12-27 1983-08-19 陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法

Country Status (4)

Country Link
US (1) US4431707A (ja)
EP (1) EP0114943B1 (ja)
JP (1) JPS59123789A (ja)
DE (1) DE3377656D1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140398A (ja) * 1983-01-28 1984-08-11 Pilot Precision Co Ltd Ａ１又はａ１合金の表面処理方法
JPS63252446A (ja) * 1987-04-09 1988-10-19 Toshiba Corp はんだバンプの形成方法
JPS63305532A (ja) * 1987-06-05 1988-12-13 Toshiba Corp バンプの形成方法
JP2002505379A (ja) * 1998-02-26 2002-02-19 フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ 耐食性被覆及び軽金属からなる支持体のための被覆系

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600658A (en) * 1983-11-07 1986-07-15 Motorola, Inc. Metallization means and method for high temperature applications
JPS60170287A (ja) * 1984-02-14 1985-09-03 信越化学工業株式会社 銅張積層基板
US4525759A (en) * 1984-04-02 1985-06-25 Shipley Company Inc. Aluminum storage disc
US4519876A (en) * 1984-06-28 1985-05-28 Thermo Electron Corporation Electrolytic deposition of metals on laser-conditioned surfaces
US4862799A (en) * 1987-11-13 1989-09-05 Rockwell International Corporation Copper coated anodized aluminum ink metering roller
US4954370A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Electroless plating of nickel on anodized aluminum
US5218472A (en) * 1989-03-22 1993-06-08 Alcan International Limited Optical interference structures incorporating porous films
US5220140A (en) * 1991-06-17 1993-06-15 Alcan International Limited Susceptors for browning or crisping food in microwave ovens
DE4444567A1 (de) * 1994-12-02 1996-06-05 Siemens Ag Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung
US6884393B2 (en) * 2001-07-13 2005-04-26 Ethicon, Inc. Surface treatment of aluminum alloys to improve sterilization process compatibility
CN101914798B (zh) * 2010-07-29 2012-01-18 南昌航空大学 一种提高铝合金微弧氧化后疲劳强度的方法
DE102015105449B4 (de) * 2015-04-09 2019-01-17 Rieger Metallveredlung GmbH & Co. KG Verfahren zum Aufbringen einer Schutzschicht auf Aluminiumteile
CN111378999B (zh) * 2020-05-12 2021-06-08 武汉风帆电化科技股份有限公司 铝合金表面实现阳极氧化膜和磷镍合金复合涂层的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167232A (ja) * 1974-12-07 1976-06-10 Fujitsu Ltd Mudenkainitsukerumetsukino maeshoriho

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE111897C (ja) * 1956-10-08
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
US3340161A (en) * 1964-02-19 1967-09-05 Sperry Rand Corp Printed circuits and method of manufacture thereof
US3725108A (en) * 1969-03-05 1973-04-03 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
NL6908381A (ja) * 1969-06-03 1970-12-07
US3914126A (en) * 1973-02-12 1975-10-21 Xerox Corp Nickel oxide interlayers for photoconductive elements
US3943039A (en) * 1974-10-08 1976-03-09 Kaiser Aluminum & Chemical Corporation Anodizing pretreatment for nickel plating
US4100038A (en) * 1977-11-08 1978-07-11 M&T Chemicals Inc. Plating on aluminum alloys
DE2811396A1 (de) * 1978-03-16 1979-09-27 Hoechst Ag Verfahren zur anodischen oxidation von aluminium und dessen verwendung als druckplatten-traegermaterial

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167232A (ja) * 1974-12-07 1976-06-10 Fujitsu Ltd Mudenkainitsukerumetsukino maeshoriho

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140398A (ja) * 1983-01-28 1984-08-11 Pilot Precision Co Ltd Ａ１又はａ１合金の表面処理方法
JPS63252446A (ja) * 1987-04-09 1988-10-19 Toshiba Corp はんだバンプの形成方法
JPS63305532A (ja) * 1987-06-05 1988-12-13 Toshiba Corp バンプの形成方法
JP2002505379A (ja) * 1998-02-26 2002-02-19 フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ 耐食性被覆及び軽金属からなる支持体のための被覆系

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DE3377656D1 (en) 1988-09-15
EP0114943B1 (en) 1988-08-10
US4431707A (en) 1984-02-14
EP0114943A1 (en) 1984-08-08

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