JPS59119857A - ヒ−トシンク - Google Patents

ヒ−トシンク

Info

Publication number
JPS59119857A
JPS59119857A JP57228886A JP22888682A JPS59119857A JP S59119857 A JPS59119857 A JP S59119857A JP 57228886 A JP57228886 A JP 57228886A JP 22888682 A JP22888682 A JP 22888682A JP S59119857 A JPS59119857 A JP S59119857A
Authority
JP
Japan
Prior art keywords
substrate
sic layer
laminated
layer
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57228886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322705B2 (cs
Inventor
Katsumi Yagi
克己 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP57228886A priority Critical patent/JPS59119857A/ja
Publication of JPS59119857A publication Critical patent/JPS59119857A/ja
Publication of JPH0322705B2 publication Critical patent/JPH0322705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57228886A 1982-12-27 1982-12-27 ヒ−トシンク Granted JPS59119857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57228886A JPS59119857A (ja) 1982-12-27 1982-12-27 ヒ−トシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57228886A JPS59119857A (ja) 1982-12-27 1982-12-27 ヒ−トシンク

Publications (2)

Publication Number Publication Date
JPS59119857A true JPS59119857A (ja) 1984-07-11
JPH0322705B2 JPH0322705B2 (cs) 1991-03-27

Family

ID=16883396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57228886A Granted JPS59119857A (ja) 1982-12-27 1982-12-27 ヒ−トシンク

Country Status (1)

Country Link
JP (1) JPS59119857A (cs)

Also Published As

Publication number Publication date
JPH0322705B2 (cs) 1991-03-27

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