JPS59117156U - 絶縁物封止半導体装置 - Google Patents

絶縁物封止半導体装置

Info

Publication number
JPS59117156U
JPS59117156U JP1983009605U JP960583U JPS59117156U JP S59117156 U JPS59117156 U JP S59117156U JP 1983009605 U JP1983009605 U JP 1983009605U JP 960583 U JP960583 U JP 960583U JP S59117156 U JPS59117156 U JP S59117156U
Authority
JP
Japan
Prior art keywords
insulator
heat sink
main surface
external leads
dissipation plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983009605U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320121Y2 (enExample
Inventor
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1983009605U priority Critical patent/JPS59117156U/ja
Publication of JPS59117156U publication Critical patent/JPS59117156U/ja
Application granted granted Critical
Publication of JPS6320121Y2 publication Critical patent/JPS6320121Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983009605U 1983-01-26 1983-01-26 絶縁物封止半導体装置 Granted JPS59117156U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983009605U JPS59117156U (ja) 1983-01-26 1983-01-26 絶縁物封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983009605U JPS59117156U (ja) 1983-01-26 1983-01-26 絶縁物封止半導体装置

Publications (2)

Publication Number Publication Date
JPS59117156U true JPS59117156U (ja) 1984-08-07
JPS6320121Y2 JPS6320121Y2 (enExample) 1988-06-03

Family

ID=30141062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983009605U Granted JPS59117156U (ja) 1983-01-26 1983-01-26 絶縁物封止半導体装置

Country Status (1)

Country Link
JP (1) JPS59117156U (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (enExample) * 1975-04-15 1976-10-22
JPS5250680U (enExample) * 1975-10-08 1977-04-11
JPS562660A (en) * 1979-06-21 1981-01-12 Nec Home Electronics Ltd Manufacture of airtight bonding substance
JPS5758771U (enExample) * 1980-09-25 1982-04-07
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (enExample) * 1981-04-30 1982-11-05

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (enExample) * 1975-04-15 1976-10-22
JPS5250680U (enExample) * 1975-10-08 1977-04-11
JPS562660A (en) * 1979-06-21 1981-01-12 Nec Home Electronics Ltd Manufacture of airtight bonding substance
JPS5758771U (enExample) * 1980-09-25 1982-04-07
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (enExample) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPS6320121Y2 (enExample) 1988-06-03

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