JPS59116372A - 連続真空処理装置 - Google Patents

連続真空処理装置

Info

Publication number
JPS59116372A
JPS59116372A JP22500882A JP22500882A JPS59116372A JP S59116372 A JPS59116372 A JP S59116372A JP 22500882 A JP22500882 A JP 22500882A JP 22500882 A JP22500882 A JP 22500882A JP S59116372 A JPS59116372 A JP S59116372A
Authority
JP
Japan
Prior art keywords
station
wafer
processing
chamber
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22500882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377274B2 (enrdf_load_stackoverflow
Inventor
Tamotsu Shimizu
保 清水
Hideki Tateishi
秀樹 立石
Susumu Aiuchi
進 相内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP22500882A priority Critical patent/JPS59116372A/ja
Publication of JPS59116372A publication Critical patent/JPS59116372A/ja
Publication of JPH0377274B2 publication Critical patent/JPH0377274B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP22500882A 1982-12-23 1982-12-23 連続真空処理装置 Granted JPS59116372A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22500882A JPS59116372A (ja) 1982-12-23 1982-12-23 連続真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22500882A JPS59116372A (ja) 1982-12-23 1982-12-23 連続真空処理装置

Publications (2)

Publication Number Publication Date
JPS59116372A true JPS59116372A (ja) 1984-07-05
JPH0377274B2 JPH0377274B2 (enrdf_load_stackoverflow) 1991-12-10

Family

ID=16822629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22500882A Granted JPS59116372A (ja) 1982-12-23 1982-12-23 連続真空処理装置

Country Status (1)

Country Link
JP (1) JPS59116372A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295421A (ja) * 1986-04-04 1987-12-22 マテリアルズ　リサ−チ　コ−ポレイシヨン ウエハ状物品を輸送して少くとも一つの処理工程にかけるための装置及び方法
JPS6326357A (ja) * 1986-07-17 1988-02-03 Tokyo Electron Ltd スパツタリング装置
JPS6360276A (ja) * 1986-08-30 1988-03-16 Tokyo Electron Ltd スパツタリング装置
WO2004054926A1 (ja) * 2002-12-16 2004-07-01 Ideal Star Inc. 内包フラーレンの製造・回収システムツール
WO2010013333A1 (ja) * 2008-07-31 2010-02-04 株式会社島津製作所 真空装置及び真空処理方法
JP2013012447A (ja) * 2011-06-30 2013-01-17 Ulvac Japan Ltd 薄膜リチウム二次電池製造装置及び薄膜リチウム二次電池製造方法
JP2014162941A (ja) * 2013-02-22 2014-09-08 Stanley Electric Co Ltd 成膜装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564244A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Continuous vacuum treatment device for wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564244A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Continuous vacuum treatment device for wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295421A (ja) * 1986-04-04 1987-12-22 マテリアルズ　リサ−チ　コ−ポレイシヨン ウエハ状物品を輸送して少くとも一つの処理工程にかけるための装置及び方法
JPS6326357A (ja) * 1986-07-17 1988-02-03 Tokyo Electron Ltd スパツタリング装置
JPS6360276A (ja) * 1986-08-30 1988-03-16 Tokyo Electron Ltd スパツタリング装置
WO2004054926A1 (ja) * 2002-12-16 2004-07-01 Ideal Star Inc. 内包フラーレンの製造・回収システムツール
WO2010013333A1 (ja) * 2008-07-31 2010-02-04 株式会社島津製作所 真空装置及び真空処理方法
JP2013012447A (ja) * 2011-06-30 2013-01-17 Ulvac Japan Ltd 薄膜リチウム二次電池製造装置及び薄膜リチウム二次電池製造方法
JP2014162941A (ja) * 2013-02-22 2014-09-08 Stanley Electric Co Ltd 成膜装置

Also Published As

Publication number Publication date
JPH0377274B2 (enrdf_load_stackoverflow) 1991-12-10

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