JPS59113631A - 半導体用ボンデイングワイヤの巻取装置 - Google Patents

半導体用ボンデイングワイヤの巻取装置

Info

Publication number
JPS59113631A
JPS59113631A JP57223387A JP22338782A JPS59113631A JP S59113631 A JPS59113631 A JP S59113631A JP 57223387 A JP57223387 A JP 57223387A JP 22338782 A JP22338782 A JP 22338782A JP S59113631 A JPS59113631 A JP S59113631A
Authority
JP
Japan
Prior art keywords
wire
tension
winding
take
tension roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57223387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234459B2 (enrdf_load_stackoverflow
Inventor
Yasushi Imahama
今浜　靖志
Tamotsu Koizumi
小泉　保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP57223387A priority Critical patent/JPS59113631A/ja
Publication of JPS59113631A publication Critical patent/JPS59113631A/ja
Publication of JPH0234459B2 publication Critical patent/JPH0234459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H59/00—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
    • B65H59/38—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension
    • B65H59/384—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension using electronic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Wire Bonding (AREA)
JP57223387A 1982-12-20 1982-12-20 半導体用ボンデイングワイヤの巻取装置 Granted JPS59113631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57223387A JPS59113631A (ja) 1982-12-20 1982-12-20 半導体用ボンデイングワイヤの巻取装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57223387A JPS59113631A (ja) 1982-12-20 1982-12-20 半導体用ボンデイングワイヤの巻取装置

Publications (2)

Publication Number Publication Date
JPS59113631A true JPS59113631A (ja) 1984-06-30
JPH0234459B2 JPH0234459B2 (enrdf_load_stackoverflow) 1990-08-03

Family

ID=16797345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57223387A Granted JPS59113631A (ja) 1982-12-20 1982-12-20 半導体用ボンデイングワイヤの巻取装置

Country Status (1)

Country Link
JP (1) JPS59113631A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123044A (ja) * 1989-10-05 1991-05-24 Rohm Co Ltd 半導体装置の製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123044A (ja) * 1989-10-05 1991-05-24 Rohm Co Ltd 半導体装置の製造装置

Also Published As

Publication number Publication date
JPH0234459B2 (enrdf_load_stackoverflow) 1990-08-03

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