JPS5910767Y2 - 多層印刷配線構造 - Google Patents
多層印刷配線構造Info
- Publication number
- JPS5910767Y2 JPS5910767Y2 JP8215479U JP8215479U JPS5910767Y2 JP S5910767 Y2 JPS5910767 Y2 JP S5910767Y2 JP 8215479 U JP8215479 U JP 8215479U JP 8215479 U JP8215479 U JP 8215479U JP S5910767 Y2 JPS5910767 Y2 JP S5910767Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- printed wiring
- multilayer printed
- grid
- coordinate system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8215479U JPS5910767Y2 (ja) | 1979-06-18 | 1979-06-18 | 多層印刷配線構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8215479U JPS5910767Y2 (ja) | 1979-06-18 | 1979-06-18 | 多層印刷配線構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS562271U JPS562271U (enrdf_load_stackoverflow) | 1981-01-10 |
| JPS5910767Y2 true JPS5910767Y2 (ja) | 1984-04-04 |
Family
ID=29315387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8215479U Expired JPS5910767Y2 (ja) | 1979-06-18 | 1979-06-18 | 多層印刷配線構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910767Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168294A (ja) * | 1982-03-29 | 1983-10-04 | 日立化成工業株式会社 | 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法 |
-
1979
- 1979-06-18 JP JP8215479U patent/JPS5910767Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS562271U (enrdf_load_stackoverflow) | 1981-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6373139B1 (en) | Layout for a ball grid array | |
| JPH0786407A (ja) | 集積回路の多層配線方法 | |
| JPS6115395A (ja) | 半導体チツプ用モジユ−ル | |
| CN113747658A (zh) | 使用两个布线层的集成电路的印刷电路板连接 | |
| JPS5910767Y2 (ja) | 多層印刷配線構造 | |
| US4361634A (en) | Artwork master for production of multilayer circuit board | |
| JP3408590B2 (ja) | 多層プリント基板の配線構造 | |
| CA1055164A (en) | Multilayer circuit board | |
| JP2795032B2 (ja) | 多層薄膜配線基板 | |
| JPH033398B2 (enrdf_load_stackoverflow) | ||
| JPH0143876Y2 (enrdf_load_stackoverflow) | ||
| JPH0521927A (ja) | 平面回路板を用いたハーネス回路の接続方法 | |
| JPH06326214A (ja) | 多層配線構造及びその形成方法 | |
| JP2947219B2 (ja) | スタンダードセル方式の半導体集積回路の配線構造 | |
| JPS63304375A (ja) | 自動配線方法 | |
| JPS59104196A (ja) | 多層配線基板 | |
| JPS58139449A (ja) | 垂直信号線を有する多層集積回路 | |
| JPS5855808Y2 (ja) | 高密度論理回路の実装構造 | |
| JPS63136694A (ja) | 多層配線基板 | |
| HK40064093A (en) | Printed circuit board connection for integrated circuits using two routing layers | |
| JPS634694A (ja) | 多層プリント基板 | |
| JPS60127797A (ja) | 多層プリント配線基板 | |
| JPH04106857U (ja) | ジヤンパーチツプ | |
| JP2871076B2 (ja) | 多層印刷回路基板 | |
| JPH09114876A (ja) | 配線パターンの設計方法、配線パターン設計装置、および多層配線基板の製造方法 |