JPS59107594A - Automatically soldering machine - Google Patents
Automatically soldering machineInfo
- Publication number
- JPS59107594A JPS59107594A JP21798182A JP21798182A JPS59107594A JP S59107594 A JPS59107594 A JP S59107594A JP 21798182 A JP21798182 A JP 21798182A JP 21798182 A JP21798182 A JP 21798182A JP S59107594 A JPS59107594 A JP S59107594A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- equipment
- speed
- solder
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はプリント板に実装された電気部品をはんだ付け
する自動はんだ付装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic soldering device for soldering electrical components mounted on a printed circuit board.
一般に、自動はすだ付は装置としては、はんだ付は工程
に含まれる予熱、フラックス塗布、プレヒーター、はん
だ槽、冷却器および洗浄槽等のはんだ付は機器を必要と
する。Generally, automatic soldering requires equipment, while soldering requires equipment such as preheating, flux application, preheater, soldering bath, cooler, and cleaning bath included in the soldering process.
従来、この種のプリント板のはんだ付装置は、はんだ付
けに必要なこれらはんだ付は機器が直線又は楕円状のラ
インに組込１れており、プリント板の搬送はレール上を
モーターと直結したチェーン等により、設定したある一
定の速度で移動する。Conventionally, in this type of printed board soldering equipment, the soldering equipment required for soldering was built into a straight or elliptical line, and the printed board was transported on a rail directly connected to a motor. It moves at a certain set speed using a chain or the like.
したがって、これらはんだ付は機器を通過する速度は一
定で必ジ、又移動時のキャリヤセツティングが固定又は
半固定である。従って、プリント板の大きさ及び実装す
る電気部品によって、はんだ付は条件を変え最良のはん
だ付は性を得るため各はんだ付は機器を通過する速度及
び周間を変える必要があるが、搬送が同一ラインのため
速度及び角変の変更ができないという欠点があった。Therefore, the speed of soldering through the equipment must be constant, and the carrier setting during movement must be fixed or semi-fixed. Therefore, depending on the size of the printed circuit board and the electrical components to be mounted, the soldering conditions change, and in order to obtain the best soldering properties, it is necessary to change the speed and distance at which each soldering passes through the equipment. There was a drawback that the speed and angle change could not be changed because the line was the same.
本発明の目的は、はんだ付けすべきプリント板を移動す
る搬送機構を独立して設置することにょジ、搬送速度が
自由に設定でき、プリント板の大きさ、実装される′電
気部品によって予熱時間の設定及びはんだ而の通過速度
並びにはんだ面秦らの分離角度等をはんだ付けに最適な
条件に搬送速度及び角度を容易に調整でき、はんだツラ
ラ、はんだ穴明き等の不良発生を防止しはんだ付は性能
を向上させた自動はんだ付装置を提供することにある。The object of the present invention is to independently install a conveyance mechanism for moving printed circuit boards to be soldered. The transfer speed and angle can be easily adjusted to the optimum conditions for soldering, such as the solder passing speed and the separation angle of the solder surface, preventing defects such as solder icicles and solder holes. Our objective is to provide automatic soldering equipment with improved performance.
本発明の自動はんだ付装置は、はんだ付けすべきプリン
ト板をつかんで搬送する搬送機構と、この搬送機構の外
周に所定間隔でそれぞれ設置されたプリント板のフラッ
クス塗布手段、予熱手段、はんだ槽、冷却手段およびフ
ラックス除去手段とを含んで構成され、所定プログラム
により前記搬送機構を可動させてはんだ付けを行うこと
を特徴とする。The automatic soldering apparatus of the present invention includes a transport mechanism that grasps and transports printed boards to be soldered, a printed board flux application means, a preheating means, a soldering bath, and It is characterized in that it includes a cooling means and a flux removing means, and performs soldering by moving the conveying mechanism according to a predetermined program.
本発明によれば、はんだ付装置の搬送機構をはんだ付機
器とは別に独立させることにより、各（・寸んだ付機器
を通過する速度及び角度をはんだ付は性に最適な条件に
変えることができる。According to the present invention, by making the conveyance mechanism of the soldering device independent from the soldering equipment, it is possible to change the speed and angle at which the soldering equipment passes through each soldering equipment to optimal conditions for soldering. Can be done.
次に本発明の実施例について図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の実施例のはんだ付装置の立体図で、は
んだ付は丁べきプリント板をはさみ各はんだ何機器間を
移動する搬送機構１により、このプリント板をフラック
ス塗布装置フラクサ−２ア予Ｍ５ブリヒーター３．（は
んだ伺けを行なうけんだ槽４、冷却器５およびフラック
スを除去する洗浄槽６と順次制御部（図示せず）のコン
トロールによりプリント板を運搬する機構となっている
。FIG. 1 is a three-dimensional view of a soldering apparatus according to an embodiment of the present invention, in which a printed board to be soldered is sandwiched between the soldering devices, and a conveying mechanism 1 moves the printed board between the flux applicators and the fluxer 2. Pre-M5 Buri Heater 3. (The system includes a soldering bath 4 for performing soldering, a cooler 5, and a cleaning bath 6 for removing flux, which are sequentially controlled by a control section (not shown) to transport the printed board.
この搬送機構ｌば、片腕で上下移動、腕の伸縮、回転等
の動きが自在にでき、各はんだ付機器を通過する際プロ
グラムによりはんだ付は条件に最適な速度及び角度で移
動することにより安定したけんだ付は性が得られる。This transport mechanism allows you to freely move up and down with one arm, extend and contract the arm, rotate, etc., and when passing through each soldering device, the soldering is stabilized by moving at the speed and angle that is optimal for the conditions according to the program. Shikendatsuke gives you sex.
このはんだ付装置のプリント板搬送機構を（はんだ付は
機器と独立させることにより、各はんだ何機器間を通過
する速度及び角変を任意に変えることができる。従って
、はんだ付けに最適な予熱時間、はんだ槽内を通過する
速度並びにはんだ面からの分離角度等を調整することが
可能となり、はんだツララ、穴明き等はんだ付は不良の
発生を撲滅できる。By making the printed board conveyance mechanism of this soldering machine independent of the soldering equipment, the speed and angle at which each solder passes between the equipment can be arbitrarily changed. Therefore, the optimal preheating time for soldering can be adjusted. It becomes possible to adjust the speed at which the solder passes through the solder bath, the separation angle from the solder surface, etc., and the occurrence of soldering defects such as solder icicles and holes can be eliminated.
更に、リード線カッター（図示せず）を設置することに
よりプリント板はんだ付は作業の最終工程までオンライ
ンで作業でき、プリント板の取外し運搬等の作業がなく
なり効率の良いはんだ付は作業ができる。Furthermore, by installing a lead wire cutter (not shown), printed board soldering can be performed online up to the final process, and work such as removing and transporting printed boards can be eliminated, allowing for efficient soldering.
第１図は本発明の実施例の立体図である。
図において、ｌ・・・・・・搬送機構、２・・・・・・
フラクサー、３・・・・・・ブリヒーター、４・・・・
・・はんだ槽、５・・・・・・冷却ファン、６・・・・
・・洗浄槽である。
丙
第１にFIG. 1 is a three-dimensional view of an embodiment of the invention. In the figure, l...transport mechanism, 2...
Fluxer, 3...Buriheater, 4...
...Solder bath, 5...Cooling fan, 6...
...It is a cleaning tank. C first
Claims (1)
構と、この搬送機構の外周に所定間隔でそれぞれ設置さ
れたプリント板のフラックス塗布手段、予熱手段、はん
だ槽、冷却手段およびフラックス除去手段とを含み、所
定プログラムにより前記搬送機構を可動させてはんだ付
けを行うことを特徴とする自動はんだ付装置。It includes a conveyance mechanism that grasps and conveys printed boards to be soldered, and a printed board flux application means, a preheating means, a soldering bath, a cooling means, and a flux removal means, which are respectively installed at predetermined intervals around the outer periphery of this conveyance mechanism. . An automatic soldering apparatus, characterized in that the transfer mechanism is moved according to a predetermined program to perform soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21798182A JPS59107594A (en) | 1982-12-13 | 1982-12-13 | Automatically soldering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21798182A JPS59107594A (en) | 1982-12-13 | 1982-12-13 | Automatically soldering machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59107594A true JPS59107594A (en) | 1984-06-21 |
Family
ID=16712750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21798182A Pending JPS59107594A (en) | 1982-12-13 | 1982-12-13 | Automatically soldering machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107594A (en) |
-
1982
- 1982-12-13 JP JP21798182A patent/JPS59107594A/en active Pending
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