JPH04108959U - automatic soldering equipment - Google Patents

Abstract

(57) [Summary] [Purpose] The present invention relates to an automatic soldering device that can sequentially solder printed circuit boards of different sizes. [Structure] A printed circuit board is mounted on a carrier 1011 or the like, and the carrier moving means 103 is moved along the side of the casing 100.
1, 1032, 1033. Then, flux is applied by the flux application means 104, and the heating means 1
After heating in step 05, soldering is performed in soldering means 106, and then cooling is performed in cooling means 107. According to the present invention, not only can printed circuit boards of different sizes be processed continuously, but also
Processing can be performed under optimal conditions depending on the number of components mounted on the board, and the device itself can be downsized.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to an automatic soldering device for printed circuit boards, especially for printers of different sizes. The present invention relates to an automatic soldering device that can continuously solder printed circuit boards.

0002

[Conventional technology]

Conventionally, various types of automatic soldering equipment have been used to automatically solder components onto printed circuit boards. Although there are various types, the so-called flow soldering type is often used. Figure 4 is a top view of a conventional flow soldering type automatic soldering device. The housing 601 has a length of about 3 to 4 m, a width of about 1.5 to 2 m, and a front view. It is a rectangular parallelepiped with a height of about 1 m.

[0003] Two conveyors 6021 and 6022 are installed diagonally in the length direction of the housing 601 so as to rise from upstream to downstream. Move in the X direction. Note that depending on the size of the printed circuit board to be soldered, the conveyors 6021 and 6022 can be adjusted to the arrows Y ₁ and Y ₂ in the width direction of the housing 601, respectively.

0004 Inside the casing 601, flakes are placed in order from the upstream direction of the conveyors 6021 and 6022. A gas tank 603, a heater 604, and a solder tank 605 are installed. That is, the bottom of the printed circuit boards on conveyors 6021 and 6022 is first coated with flak. Flux is sprayed from the bath tank 603. Next, the bottom surface is preheated by the heater 604, and the solder is blown out from the solder tank 605. Soldering is performed at the necessary locations.

[0005]

[Problem that the idea aims to solve]

Such automatic soldering equipment has the following problems. 1) It is necessary to adjust the width of the conveyor to process printed circuit boards of different sizes. This makes it possible to process printed circuit boards of different sizes continuously. do not have.

[0006] Therefore, the size of printed circuit boards has been standardized, and after soldering, the printed circuit boards have been cut to a predetermined size. 2) In order to preheat the printed circuit board to predetermined conditions, the heater needs to be larger than a certain level, so it is inevitable that the entire device will become larger. 3) It is not possible to adjust the soldering conditions according to the material, thickness, and number of mounted components of the printed circuit board. 4) The installation floor space for automatic soldering equipment requires a maximum of approximately ^8m2 .

[0007] This invention was developed in view of the above problems, and the size and soldering conditions Not only is it possible to configure settings for each board, but it is also possible to downsize the entire device. The purpose of the present invention is to provide an automatic soldering device that enables automatic soldering.

[0008]

[Means to solve the problem]

FIG. 1 is a top view showing the structure of the automatic soldering device according to the present invention. When the board is loaded and transported, it is always located at four home positions. carriers 1011, 1012, 1013, 1014, carrier 1011, A rectangular housing 100 is used to change the directions of 1012, 1013, and 1014 by 90°. The first and fourth home positions are located at two adjacent corners of the and second rotary actuators 1021, 1022, and the second rotary actuators 1021, 1022, The four carriers 1011, 1012, 1013, and 1014 are arranged along the side of from the first rotary actuator 1021, which is the home position of a first carrier moving means 1031 whose terminal end is a second home position; It is arranged perpendicularly to the first carrier moving means 1031 and on the second side of the housing 100. The first step is to move four carriers 1011, 1012, 1013, and 1014 along the second carrier moving means 1032 and the second carrier moving means 1032 perpendicular to the second carrier moving means 1032; Four carriers 1011, 1012, 1013 and 1014 and set the end as the third home position. The carrier moving means 1033 and the third carrier moving means 1032 are arranged perpendicularly to each other. Four carriers 1011, 1012, 10 are placed along the fourth side of the housing 100. 13, 1014 from the second rotary actuator 1022 to the first rotary actuator a fourth carrier moving means 1034 to be moved to the actuator 1021; Four carriers 1011 and 1012 are installed at the bottom of the carrier moving means 1031. , 1013, 1014, apply flux to the specified position on the bottom surface of the printed circuit board mounted on the board. under the flux applying means 104 and the second carrier moving means 1032. The four carriers 1011 and 1 move together with the carrier 101. Preheating means for preheating the lower surface of the printed circuit board mounted on 012, 1013, and 1014 105, and four carriers 1 installed at the bottom of the third carrier moving means 1033. Melted on the bottom surface of the printed circuit board mounted on 011, 1012, 1013, and 1014. soldering means 106 for bringing the solder into contact with each other; and third carrier moving means 1033 as well. Four carriers 1011 and 1012 are installed at the third home position at the bottom of the , 1013, 1014, a cooling means 107 for cooling the lower surface of the printed circuit board mounted on the board. and the operation timing of the first and second rotary actuators 1021 and 1022. and first, second, third and fourth carrier moving means 1031, 1032, 103 3, a control means 108 for controlling the carrier movement speed of 1034; Ru.

[0009]

[Effect]

According to the present invention, boards of different sizes are mounted on each carrier. The flux application time, heating time, and soldering time are set.

0010

【Example】

2 and 3 are a top view and a front view of an embodiment of an automatic soldering device according to the present invention. The arrows in the figure indicate the direction of movement of the printed circuit board and carrier, and the numbers in the circle indicate the moving direction of the printed circuit board and carrier. shall represent the order of operation. In this automatic soldering apparatus 200, four carriers 2011, 2012, and 2013 are used. and 2014 each move between four home positions.

[0011] The first home position is on the first rotary actuator 2011. , an example in which the first moving means is from the first home position toward the heater 205 For example, a conveyor 2031 is installed. At the bottom of the conveyor 2031 is a flask for applying flux to the printed circuit board. A fence is installed.

0012 The terminal end of this conveyor 2031 is the second home position. At the bottom of the heater 205 for preheating the printed circuit board mounted on the carrier A second moving means, for example, an air cylinder and a guide rail 2021 are installed. . Furthermore, a chain 2033 is installed as a third means of movement, and is attached to the carrier. The carrier is moved by hooking the attached claw (not shown).

[0013] In the middle of this chain 2033, for example, there is a solder tank 206 in which molten solder flows. will be installed. A fan 207 is installed at the end of the chain 2033, and a third becomes the home position of The second rotary actuator 2022 is in the fourth home position, Second rotary actuator 2022 and first rotary actuator 2 A fourth moving means, such as a conveyor 2034, is installed between the There is.

[0014] FIG. 4 is a flowchart of the control operation executed by the control device, and the following figure shows 2. This will be explained with reference to FIGS. 3 and 4. Four carriers 2011, 2012, 2013 and 2014 as mentioned above The home position of is determined as follows. First home position: on the first rotary actuator 2011 Second home position: end of first conveyor 2031 Third home position: on cooling fan 207 Fourth home position: on second rotary actuator 2012 There are currently four carriers 2011, 2012, 2013 and 2014 at home. Suppose that it is located at the location.

[0015] The carriers are moved to the next step each time each carrier is located at its home position. However, it is not specified which carrier is in which home position. Not specified. From now on, it is assumed that the first carrier 2011 is at the first home position, and the first carrier 2011 is at the first home position. Only the movement of carrier 2011 will be explained.

[0016] That is, the carrier 2011 is in the first rotary actuator, which is the first home position. Move to the tuator 2021 and when all carriers are at home position Step 401), for example, the printed circuit board 21 is loaded by a loading robot (not shown). 0 is loaded onto carrier 2011 (step 402). When the mounting of the printed circuit board is completed, the first rotary actuator 2021 Rotates 90 degrees counterclockwise (step 403) and conveyor 2031 starts operating. do.

[0017] A flux coating device 204 is installed at the bottom of the conveyor 2031, and a key When carrier 201 passes, flux is applied to the bottom surface of the printed circuit board (step 404). When carrier 2011 reaches the end of conveyor 2031, all other carriers It stops at that position until it reaches the home position (step 405).

[0018] This allows subsequent preheating, soldering and cooling to be performed at optimal speed for the printed circuit board. It is necessary to do this at It's a good thing. When the conditions are met, the carrier 2011 moves onto the heater 205 and residual heat starts. At the same time, the air cylinder 2032 operates to unite the heater 205 and the carrier 2011. The lower surface of the printed circuit board 210 is preheated (step 406).

[0019] The speed of movement at this time depends on the size of the printed circuit board or the number of parts installed. Set so that the optimum residual heat can be obtained according to the conditions. When the carrier 2011 reaches the end of the air cylinder 2032, the chain 203 3 starts operating. The solder tank 206 installed at the bottom of the chain 2033 allows the printed circuit board to be Solder is applied to the fixed position (step 407).

[0020] The fan 207 installed at the end of the chain 2033 cools the (step 408), and waits until all carriers reach their home positions (step 408). Step 409). When all carriers reach the home position, carrier 2011 moves to the second rotor. 2022 (step 410), e.g. The printed circuit board 210 is removed from the carrier 2011 by a lenoid (not shown). It is removed (step 411).

[0021] Then, when all carriers are located at the home position (step 412), the second The rotary actuator 2022 rotates 90 degrees (step 413), and the The carrier 2011 that has become It is collected in the ether 2021 (step 414). FIG. 5 is a top view of the carrier used in the automatic soldering device according to the present invention, and is a rectangular shaped carrier. It is composed of a frame 501.

[0022] Bars 5021 and 5022 are attached to both ends of the frame 501, and - 5021 and 5022 have two ends that pass through these two bars 5021 and 5022. Two printed circuit board supports 5031 and 5032 are fitted therethrough. Bars 5021 and 5022 between one printed circuit board support 5031 and frame 501 Springs 5041 and 5042 are installed on the printed circuit board support 5031. Force is applied to the inside of the frame 501.

[0023] There are two width determining tools 505 on the outside of the other printed circuit board support 5032. - Two printed circuit board supports 5031 and 5022 are installed between 5021 and 5022. and 5032 widths are adjustable. Furthermore, the two printed circuit board supports 5031 and 5032 hold the printed circuit board. Printed circuit board support claws 5061 and 5062 are attached to support the printed circuit board. Ensures support for the lint board.

Note that the printed circuit board can be removed by, for example, moving the printed circuit board support 5031 outward against the springs 5041 and 5042 using a solenoid (not shown). Since the automatic soldering device according to the present invention moves the heater together with the carrier, it is possible to reduce the size of the device itself, with a length of about 2 m and a depth of about 1.5 m. 3m, and the installation floor space is also ^2.6m2 , which is about 1/3 of the conventional size.

[0025]

[Effect of the idea]

According to the present invention, by mounting a printed circuit board on a carrier, size differences can be reduced. The printed circuit boards to be soldered are successively soldered under the optimum conditions for each printed circuit board. Not only is it possible to do this, but the size of the automatic soldering equipment itself is also reduced. be able to.

[Brief explanation of drawings]

FIG. 1 is a structural diagram of an automatic soldering device according to the present invention.

FIG. 2 is a top view of the embodiment.

FIG. 3 is a front view of the embodiment.

FIG. 4 is a flowchart of control operations in the embodiment.

FIG. 5 is a top view of the carrier.

FIG. 6 is a structural diagram of a conventional automatic soldering device.

[Explanation of symbols]

101...Carriers 1021, 1022...Rotary actuators 1031, 1032, 1033, 1034...Carrier moving means 104...Flux application means 105...Preheating means 106...Soldering means 107...Cooling means 108...Controlling means

Continuing from the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location // B23K 101:42

Claims (1)

[Scope of utility model registration request] Claim 1: Four carriers (1011, 1012, 1013, 1014) that are normally located at four home positions for loading and transporting printed circuit boards.
and the carrier (1011, 1012, 1013, 10
14) to change the direction of the rectangular housing (10
The first and second rotary actuators (1021, 1022) at first and fourth home positions installed at two adjacent corners of the housing (1021, 1022),
0) along the first side of the four carriers (1011,
1012, 1013, 1014) at the first home position of the first rotary actuator (102
a first carrier moving means (1031) whose terminal end is a second home position;
a second carrier moving means arranged at right angles to the carrier moving means (1031) and moving the four carriers (1011, 1012, 1013, 1014) along the second side of the housing (100); (1032) and the four carriers (1011, 1012, 1013, 1014) arranged perpendicularly to the second carrier moving means (1032) and along the third side of the housing (100). a third carrier moving means (1033) whose terminal end is a third home position; and a housing (100) arranged at right angles to the third carrier moving means (1032).
The four carriers (1011, 10
12, 1013, 1014) from the second rotary actuator (1022) to the first rotary actuator (1021); and the first carrier moving means (103).
1) and the four carriers (1011, 1) are installed at the bottom of the
012, 1013, 1014) for applying flux to a predetermined position on the lower surface of the printed circuit board, and the second carrier moving means (104).
The four carriers (1011, 101) are installed at the bottom of the carrier (101) and move together with the carrier (101).
2, 1013, 1014), and a preheating means (105) for preheating the lower surface of the printed circuit board mounted on the four carriers (1011, 1012, 1013, soldering means (106) for bringing molten solder into contact with the lower surface of the printed circuit board mounted on the third carrier moving means (1033); (1011, 1012, 1013,
a cooling means (107) for cooling the lower surface of the printed circuit board mounted on the board (1014); and operation timings of the first and second rotary actuators (1021, 1022);
an automatic soldering apparatus comprising: a control means (108) for controlling carrier movement speeds of the first, second, third and fourth carrier movement means (1031, 1032, 1033, 1034);