JPS59101447U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59101447U JPS59101447U JP1982197776U JP19777682U JPS59101447U JP S59101447 U JPS59101447 U JP S59101447U JP 1982197776 U JP1982197776 U JP 1982197776U JP 19777682 U JP19777682 U JP 19777682U JP S59101447 U JPS59101447 U JP S59101447U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor
- semiconductor device
- metal wire
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は出力部をシングルエンドプッシュプル接続した
音声増巾装置の回路例、第２図は半導体集積回路装置の
一部透視平面図、第３図は第２図半導体装置に用いられ
る半導体ペレットの一部平面図、第４図は本考案による
半導体装置に用いられる半導体ベレットを形成したウェ
ハの一部平面図、第５図は第４図ペレットの出力′部を
示す−・一部４・回路図、第６図は第４図ウニ／＞の検
査法を示す接続図、第７図は本考案による半導体装置の
−１一部透視平面図、第８図は本考案の他の実施例を示
す要部平面図である。
１９ ａ −−−−−−外部リード、２０ａ、２０ｂ、
２０′・・・・・・金属細線、２４・・・・・・ベレッ
ト、Ｑ？’ ＋ ＱＩＯ′・・・・・・半導体素子、Ｅ
、 Ｃ・・・・・・出力電極。Figure 1 is a circuit example of an audio amplification device in which the output section is connected in a single-end push-pull manner, Figure 2 is a partially transparent plan view of a semiconductor integrated circuit device, and Figure 3 is a semiconductor pellet used in the semiconductor device shown in Figure 2. FIG. 4 is a partial plan view of a wafer on which a semiconductor pellet used in a semiconductor device according to the present invention is formed, and FIG. 6 is a connection diagram showing the inspection method of FIG. 4, FIG. 7 is a partially transparent plan view of the semiconductor device according to the present invention, and FIG. 8 is another embodiment of the present invention. FIG. 19a -------External lead, 20a, 20b,
20'...Thin metal wire, 24...Bellet, Q? ' + QIO'... Semiconductor element, E
, C...Output electrode.
Claims (1)
対の半導体素子の各出力電極と外部リードとをそれぞれ
金属細線にて接続しシングルエン ・ドブツシュプル接
続したことを特徴とする半導体装置。A semiconductor device characterized in that each output electrode of a pair of semiconductor elements formed in the same pellet and having independent output electrodes and an external lead is connected by a thin metal wire to form a single-end dobutsu pull connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982197776U JPS59101447U (en) | 1982-12-24 | 1982-12-24 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982197776U JPS59101447U (en) | 1982-12-24 | 1982-12-24 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101447U true JPS59101447U (en) | 1984-07-09 |
Family
ID=30423272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982197776U Pending JPS59101447U (en) | 1982-12-24 | 1982-12-24 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101447U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344643A (en) * | 2005-06-07 | 2006-12-21 | Sanyo Electric Co Ltd | Battery pack |
-
1982
- 1982-12-24 JP JP1982197776U patent/JPS59101447U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344643A (en) * | 2005-06-07 | 2006-12-21 | Sanyo Electric Co Ltd | Battery pack |
| JP4716795B2 (en) * | 2005-06-07 | 2011-07-06 | 三洋電機株式会社 | Pack battery |
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