JPS5882555A - ２つ以上の集積回路を収納するボツクスの製造方法 - Google Patents

２つ以上の集積回路を収納するボツクスの製造方法

Info

Publication number
JPS5882555A
JPS5882555A JP57187633A JP18763382A JPS5882555A JP S5882555 A JPS5882555 A JP S5882555A JP 57187633 A JP57187633 A JP 57187633A JP 18763382 A JP18763382 A JP 18763382A JP S5882555 A JPS5882555 A JP S5882555A
Authority
JP
Japan
Prior art keywords
integrated circuit
manufacturing
integrated circuits
connecting piece
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57187633A
Other languages
English (en)
Japanese (ja)
Inventor
ピエリツク・デエスクレ
ジエ−ン−フイリツプ・レボウル
ジエ−ン・フラレオウ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPS5882555A publication Critical patent/JPS5882555A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H10W70/05—
    • H10W70/698—
    • H10W90/00—
    • H10W70/093—
    • H10W70/60—
    • H10W72/5522—
    • H10W90/20—
    • H10W90/22—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP57187633A 1981-10-27 1982-10-27 ２つ以上の集積回路を収納するボツクスの製造方法 Pending JPS5882555A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8120164 1981-10-27
FR8120164A FR2515428A1 (fr) 1981-10-27 1981-10-27 Boitier comportant au moins deux circuits integres

Publications (1)

Publication Number Publication Date
JPS5882555A true JPS5882555A (ja) 1983-05-18

Family

ID=9263433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57187633A Pending JPS5882555A (ja) 1981-10-27 1982-10-27 ２つ以上の集積回路を収納するボツクスの製造方法

Country Status (3)

Country Link
EP (1) EP0078194A1 (en:Method)
JP (1) JPS5882555A (en:Method)
FR (1) FR2515428A1 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327519A (ja) * 2006-06-06 2007-12-20 Honda Motor Co Ltd テンショナ装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2153144A (en) * 1984-01-13 1985-08-14 Standard Telephones Cables Ltd Circuit packaging
FR2572849B1 (fr) * 1984-11-06 1987-06-19 Thomson Csf Module monolithique haute densite comportant des composants electroniques interconnectes et son procede de fabrication
DE3786314D1 (de) * 1986-09-23 1993-07-29 Siemens Ag Halbleiterbauelemente mit leistungs-mosfet und steuerschaltung.
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
US5079835A (en) * 1990-10-12 1992-01-14 Atmel Corporation Method of forming a carrierless surface mounted integrated circuit die

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591501A1 (de) * 1967-06-06 1970-02-26 Siemens Ag Integrierter Halbleiterschaltkreis
GB1250248A (en:Method) * 1969-06-12 1971-10-20
GB2047466B (en) * 1979-02-24 1983-03-30 Int Computers Ltd Multi-level connection networks
DE2930460C2 (de) * 1979-07-27 1986-07-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Herstellen hochspannungsfester Mesadioden

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327519A (ja) * 2006-06-06 2007-12-20 Honda Motor Co Ltd テンショナ装置

Also Published As

Publication number Publication date
FR2515428B1 (en:Method) 1985-01-18
EP0078194A1 (fr) 1983-05-04
FR2515428A1 (fr) 1983-04-29

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