GB2047466B - Multi-level connection networks - Google Patents

Multi-level connection networks

Info

Publication number
GB2047466B
GB2047466B GB8005728A GB8005728A GB2047466B GB 2047466 B GB2047466 B GB 2047466B GB 8005728 A GB8005728 A GB 8005728A GB 8005728 A GB8005728 A GB 8005728A GB 2047466 B GB2047466 B GB 2047466B
Authority
GB
United Kingdom
Prior art keywords
level connection
connection networks
networks
level
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8005728A
Other versions
GB2047466A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB8005728A priority Critical patent/GB2047466B/en
Publication of GB2047466A publication Critical patent/GB2047466A/en
Application granted granted Critical
Publication of GB2047466B publication Critical patent/GB2047466B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147Semiconductor insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB8005728A 1979-02-24 1980-02-20 Multi-level connection networks Expired GB2047466B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8005728A GB2047466B (en) 1979-02-24 1980-02-20 Multi-level connection networks

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB7906622 1979-02-24
GB8005728A GB2047466B (en) 1979-02-24 1980-02-20 Multi-level connection networks

Publications (2)

Publication Number Publication Date
GB2047466A GB2047466A (en) 1980-11-26
GB2047466B true GB2047466B (en) 1983-03-30

Family

ID=26270694

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8005728A Expired GB2047466B (en) 1979-02-24 1980-02-20 Multi-level connection networks

Country Status (1)

Country Link
GB (1) GB2047466B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2515428A1 (en) * 1981-10-27 1983-04-29 Thomson Csf CASE WITH AT LEAST TWO INTEGRATED CIRCUITS
FR2516311B1 (en) * 1981-11-06 1985-10-11 Thomson Csf BASE FOR MOUNTING A SEMICONDUCTOR PELLET ON THE BASE OF AN ENCAPSULATION BOX, AND METHOD FOR PRODUCING THE BASE
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices
EP0154431B1 (en) * 1984-02-17 1989-08-16 AT&T Corp. Integrated circuit chip assembly
US4713682A (en) * 1984-04-25 1987-12-15 Honeywell Inc. Dielectric barrier material
JP3332456B2 (en) * 1992-03-24 2002-10-07 株式会社東芝 Semiconductor device manufacturing method and semiconductor device

Also Published As

Publication number Publication date
GB2047466A (en) 1980-11-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950220