GB2047466B - Multi-level connection networks - Google Patents
Multi-level connection networksInfo
- Publication number
- GB2047466B GB2047466B GB8005728A GB8005728A GB2047466B GB 2047466 B GB2047466 B GB 2047466B GB 8005728 A GB8005728 A GB 8005728A GB 8005728 A GB8005728 A GB 8005728A GB 2047466 B GB2047466 B GB 2047466B
- Authority
- GB
- United Kingdom
- Prior art keywords
- level connection
- connection networks
- networks
- level
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8005728A GB2047466B (en) | 1979-02-24 | 1980-02-20 | Multi-level connection networks |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7906622 | 1979-02-24 | ||
GB8005728A GB2047466B (en) | 1979-02-24 | 1980-02-20 | Multi-level connection networks |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2047466A GB2047466A (en) | 1980-11-26 |
GB2047466B true GB2047466B (en) | 1983-03-30 |
Family
ID=26270694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8005728A Expired GB2047466B (en) | 1979-02-24 | 1980-02-20 | Multi-level connection networks |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2047466B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2515428A1 (en) * | 1981-10-27 | 1983-04-29 | Thomson Csf | CASE WITH AT LEAST TWO INTEGRATED CIRCUITS |
FR2516311B1 (en) * | 1981-11-06 | 1985-10-11 | Thomson Csf | BASE FOR MOUNTING A SEMICONDUCTOR PELLET ON THE BASE OF AN ENCAPSULATION BOX, AND METHOD FOR PRODUCING THE BASE |
GB2144907A (en) * | 1983-08-09 | 1985-03-13 | Standard Telephones Cables Ltd | Mounting integrated circuit devices |
EP0154431B1 (en) * | 1984-02-17 | 1989-08-16 | AT&T Corp. | Integrated circuit chip assembly |
US4713682A (en) * | 1984-04-25 | 1987-12-15 | Honeywell Inc. | Dielectric barrier material |
JP3332456B2 (en) * | 1992-03-24 | 2002-10-07 | 株式会社東芝 | Semiconductor device manufacturing method and semiconductor device |
-
1980
- 1980-02-20 GB GB8005728A patent/GB2047466B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2047466A (en) | 1980-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19950220 |