JPS588152B2 - ダイオ−ド ト ソノセイゾウホウ - Google Patents

ダイオ−ド ト ソノセイゾウホウ

Info

Publication number
JPS588152B2
JPS588152B2 JP49036981A JP3698174A JPS588152B2 JP S588152 B2 JPS588152 B2 JP S588152B2 JP 49036981 A JP49036981 A JP 49036981A JP 3698174 A JP3698174 A JP 3698174A JP S588152 B2 JPS588152 B2 JP S588152B2
Authority
JP
Japan
Prior art keywords
glass layer
glass
slurry
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49036981A
Other languages
English (en)
Japanese (ja)
Other versions
JPS50131473A (enExample
Inventor
寺門肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49036981A priority Critical patent/JPS588152B2/ja
Publication of JPS50131473A publication Critical patent/JPS50131473A/ja
Publication of JPS588152B2 publication Critical patent/JPS588152B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Formation Of Insulating Films (AREA)
JP49036981A 1974-04-03 1974-04-03 ダイオ−ド ト ソノセイゾウホウ Expired JPS588152B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49036981A JPS588152B2 (ja) 1974-04-03 1974-04-03 ダイオ−ド ト ソノセイゾウホウ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49036981A JPS588152B2 (ja) 1974-04-03 1974-04-03 ダイオ−ド ト ソノセイゾウホウ

Publications (2)

Publication Number Publication Date
JPS50131473A JPS50131473A (enExample) 1975-10-17
JPS588152B2 true JPS588152B2 (ja) 1983-02-14

Family

ID=12484917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49036981A Expired JPS588152B2 (ja) 1974-04-03 1974-04-03 ダイオ−ド ト ソノセイゾウホウ

Country Status (1)

Country Link
JP (1) JPS588152B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189556A (ja) * 1984-10-08 1986-05-07 Toshiba Corp 血球分析装置
US11890787B2 (en) 2018-09-25 2024-02-06 Honda Motor Co., Ltd. Delivery device, mold using same, and delivery method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632434A (en) * 1969-01-21 1972-01-04 Jerald L Hutson Process for glass passivating silicon semiconductor junctions
US3783119A (en) * 1969-06-18 1974-01-01 Ibm Method for passivating semiconductor material and field effect transistor formed thereby
JPS499263A (enExample) * 1972-05-15 1974-01-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189556A (ja) * 1984-10-08 1986-05-07 Toshiba Corp 血球分析装置
US11890787B2 (en) 2018-09-25 2024-02-06 Honda Motor Co., Ltd. Delivery device, mold using same, and delivery method

Also Published As

Publication number Publication date
JPS50131473A (enExample) 1975-10-17

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