JPS588152B2 - ダイオ−ド ト ソノセイゾウホウ - Google Patents
ダイオ−ド ト ソノセイゾウホウInfo
- Publication number
- JPS588152B2 JPS588152B2 JP49036981A JP3698174A JPS588152B2 JP S588152 B2 JPS588152 B2 JP S588152B2 JP 49036981 A JP49036981 A JP 49036981A JP 3698174 A JP3698174 A JP 3698174A JP S588152 B2 JPS588152 B2 JP S588152B2
- Authority
- JP
- Japan
- Prior art keywords
- glass layer
- glass
- slurry
- wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49036981A JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49036981A JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50131473A JPS50131473A (US07655688-20100202-C00086.png) | 1975-10-17 |
JPS588152B2 true JPS588152B2 (ja) | 1983-02-14 |
Family
ID=12484917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49036981A Expired JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS588152B2 (US07655688-20100202-C00086.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6189556A (ja) * | 1984-10-08 | 1986-05-07 | Toshiba Corp | 血球分析装置 |
US11890787B2 (en) | 2018-09-25 | 2024-02-06 | Honda Motor Co., Ltd. | Delivery device, mold using same, and delivery method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3632434A (en) * | 1969-01-21 | 1972-01-04 | Jerald L Hutson | Process for glass passivating silicon semiconductor junctions |
US3669731A (en) * | 1969-06-18 | 1972-06-13 | Gen Electric | Silicon device having a lead-silicate thereon and method of forming the same |
JPS499263A (US07655688-20100202-C00086.png) * | 1972-05-15 | 1974-01-26 |
-
1974
- 1974-04-03 JP JP49036981A patent/JPS588152B2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3632434A (en) * | 1969-01-21 | 1972-01-04 | Jerald L Hutson | Process for glass passivating silicon semiconductor junctions |
US3669731A (en) * | 1969-06-18 | 1972-06-13 | Gen Electric | Silicon device having a lead-silicate thereon and method of forming the same |
JPS499263A (US07655688-20100202-C00086.png) * | 1972-05-15 | 1974-01-26 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6189556A (ja) * | 1984-10-08 | 1986-05-07 | Toshiba Corp | 血球分析装置 |
US11890787B2 (en) | 2018-09-25 | 2024-02-06 | Honda Motor Co., Ltd. | Delivery device, mold using same, and delivery method |
Also Published As
Publication number | Publication date |
---|---|
JPS50131473A (US07655688-20100202-C00086.png) | 1975-10-17 |
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