JPS5873790A - 部分メツキ方法 - Google Patents

部分メツキ方法

Info

Publication number
JPS5873790A
JPS5873790A JP17171381A JP17171381A JPS5873790A JP S5873790 A JPS5873790 A JP S5873790A JP 17171381 A JP17171381 A JP 17171381A JP 17171381 A JP17171381 A JP 17171381A JP S5873790 A JPS5873790 A JP S5873790A
Authority
JP
Japan
Prior art keywords
plating
pipe
partial
plating solution
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17171381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Toshihiko Fujimori
藤森 敏彦
Masao Okamura
正夫 岡村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP17171381A priority Critical patent/JPS5873790A/ja
Publication of JPS5873790A publication Critical patent/JPS5873790A/ja
Publication of JPS6131197B2 publication Critical patent/JPS6131197B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP17171381A 1981-10-27 1981-10-27 部分メツキ方法 Granted JPS5873790A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17171381A JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17171381A JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Publications (2)

Publication Number Publication Date
JPS5873790A true JPS5873790A (ja) 1983-05-04
JPS6131197B2 JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-18

Family

ID=15928292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17171381A Granted JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Country Status (1)

Country Link
JP (1) JPS5873790A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-18

Similar Documents

Publication Publication Date Title
US2429222A (en) Method of making contact wires
KR890005858A (ko) 반도체장치의 제조방법 및 그 제조장치
EP0171129A2 (en) Method of electro-coating a semiconductor device
JPS584984A (ja) 太陽電池の性能を改善する方法
JPS5873790A (ja) 部分メツキ方法
DK0764334T3 (da) Fremgangsmåde til fremstilling af komponenter på metalfilmbasis
US3798141A (en) Technique for electroetching thin film metallization
GB753131A (en) Improvements in or relating to low resistance connections to germanium
JPH031392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5970789A (ja) 部分メッキ法
JP2952939B2 (ja) 半導体装置の金属配線形成方法
JPS5970790A (ja) 部分メツキ装置
JPS6128037B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61204397A (ja) めつき装置
JPH02243800A (ja) リード端子の製造方法
JPS5974292A (ja) 部分メツキ装置
JPS58217693A (ja) 微小部分銀メツキ処理物及びそのメツキ方法
CN111270283A (zh) 一种无上电极水平电镀方法
JPH07157892A (ja) 電気めっき方法
JPS59123784A (ja) 選択的電気メツキ方法
JP2902728B2 (ja) 片面めっき方法
TW544475B (en) Device and method for continuous electroplating treatment
JPH0536698A (ja) ウエーハメツキ用治具
SE8503833L (sv) Forfarande for tillverkning av solceller
JPH0350733A (ja) 半導体装置の製造方法