JPS6131197B2 - - Google Patents

Info

Publication number
JPS6131197B2
JPS6131197B2 JP17171381A JP17171381A JPS6131197B2 JP S6131197 B2 JPS6131197 B2 JP S6131197B2 JP 17171381 A JP17171381 A JP 17171381A JP 17171381 A JP17171381 A JP 17171381A JP S6131197 B2 JPS6131197 B2 JP S6131197B2
Authority
JP
Japan
Prior art keywords
plating
pipe
plating liquid
plated
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17171381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5873790A (ja
Inventor
Toshihiko Fujimori
Masao Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP17171381A priority Critical patent/JPS5873790A/ja
Publication of JPS5873790A publication Critical patent/JPS5873790A/ja
Publication of JPS6131197B2 publication Critical patent/JPS6131197B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP17171381A 1981-10-27 1981-10-27 部分メツキ方法 Granted JPS5873790A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17171381A JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17171381A JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Publications (2)

Publication Number Publication Date
JPS5873790A JPS5873790A (ja) 1983-05-04
JPS6131197B2 true JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-18

Family

ID=15928292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17171381A Granted JPS5873790A (ja) 1981-10-27 1981-10-27 部分メツキ方法

Country Status (1)

Country Link
JP (1) JPS5873790A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS5873790A (ja) 1983-05-04

Similar Documents

Publication Publication Date Title
US9347147B2 (en) Method and apparatus for controlling and monitoring the potential
Christie et al. Gold electrodeposition within the electronics industry
US7025862B2 (en) Plating uniformity control by contact ring shaping
US2429222A (en) Method of making contact wires
CN105483795B (zh) 一种采用欠电位沉积技术制备复合铜纳米线的方法
US5234572A (en) Metal ion replenishment to plating bath
JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US20180040744A1 (en) Method for structuring layers of oxidizable materials by means of oxidation and substrate having a structured coating
JPH031392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN102055099A (zh) 电连接器端子及其电镀方法
US4384939A (en) Gold recovery system
JPS624472B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN111411378B (zh) 打印笔和打印设备
JPS5970789A (ja) 部分メッキ法
JPS6128037B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5974292A (ja) 部分メツキ装置
TW200305943A (en) Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
CN111270283A (zh) 一种无上电极水平电镀方法
EP0063925A1 (en) Electro-plating process and products therefrom
JPH07157892A (ja) 電気めっき方法
CN113652719B (zh) 用于铜线镀锡的电镀液及铜线电镀锡的方法
JPH0153503B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN114264708B (zh) 一种用于化学沉积中电势影响快速分析的方法
CN212451678U (zh) 一种金属材料镀膜装置
JPH10237688A (ja) 長尺金属条ストライプめっき方法