JPS587364U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS587364U
JPS587364U JP1981100817U JP10081781U JPS587364U JP S587364 U JPS587364 U JP S587364U JP 1981100817 U JP1981100817 U JP 1981100817U JP 10081781 U JP10081781 U JP 10081781U JP S587364 U JPS587364 U JP S587364U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode lamp
lead frame
reflective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981100817U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234469Y2 (zh
Inventor
中矢 富夫
進 武田
俊一 石川
酒井 弘生
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1981100817U priority Critical patent/JPS587364U/ja
Publication of JPS587364U publication Critical patent/JPS587364U/ja
Application granted granted Critical
Publication of JPS6234469Y2 publication Critical patent/JPS6234469Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
JP1981100817U 1981-07-07 1981-07-07 発光ダイオ−ドランプ Granted JPS587364U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981100817U JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981100817U JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Publications (2)

Publication Number Publication Date
JPS587364U true JPS587364U (ja) 1983-01-18
JPS6234469Y2 JPS6234469Y2 (zh) 1987-09-02

Family

ID=29895497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981100817U Granted JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS587364U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186412U (ja) * 1984-05-23 1985-12-10 沖電線株式会社 強化被覆光フアイバ
JPH0367461U (zh) * 1989-10-31 1991-07-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164772U (zh) * 1977-05-31 1978-12-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164772U (zh) * 1977-05-31 1978-12-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186412U (ja) * 1984-05-23 1985-12-10 沖電線株式会社 強化被覆光フアイバ
JPH046003Y2 (zh) * 1984-05-23 1992-02-19
JPH0367461U (zh) * 1989-10-31 1991-07-01

Also Published As

Publication number Publication date
JPS6234469Y2 (zh) 1987-09-02

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