JPS5977249U - 横方向出力発光ダイオ−ド装置 - Google Patents

横方向出力発光ダイオ−ド装置

Info

Publication number
JPS5977249U
JPS5977249U JP1982173061U JP17306182U JPS5977249U JP S5977249 U JPS5977249 U JP S5977249U JP 1982173061 U JP1982173061 U JP 1982173061U JP 17306182 U JP17306182 U JP 17306182U JP S5977249 U JPS5977249 U JP S5977249U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode device
output light
lateral output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982173061U
Other languages
English (en)
Inventor
金子　成一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982173061U priority Critical patent/JPS5977249U/ja
Publication of JPS5977249U publication Critical patent/JPS5977249U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来方式による横方向出力ＬＥＤ略図、第２図
、第３図は本考案による横方向出力ＬＥＤの一例略図、
第４図は第３図の断面略図。 １・・・・・・横方向専用リードフレーム、１′・・・
・・・従来タイプのリードフレーム、２・・・・・・ボ
ンディング線、３・・・・・・ＬＥＤチップ、４・・・
・・・モールド樹脂、５・・・・・・光反射物、６・・
・・・・光通路側。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光ダイオードより放射された光が反射面により横方向
    出力として得られるように構成した発光ダイオード装置
    。
JP1982173061U 1982-11-16 1982-11-16 横方向出力発光ダイオ−ド装置 Pending JPS5977249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982173061U JPS5977249U (ja) 1982-11-16 1982-11-16 横方向出力発光ダイオ−ド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982173061U JPS5977249U (ja) 1982-11-16 1982-11-16 横方向出力発光ダイオ−ド装置

Publications (1)

Publication Number Publication Date
JPS5977249U true JPS5977249U (ja) 1984-05-25

Family

ID=30377094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982173061U Pending JPS5977249U (ja) 1982-11-16 1982-11-16 横方向出力発光ダイオ−ド装置

Country Status (1)

Country Link
JP (1) JPS5977249U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251785A (ja) * 2005-02-03 2010-11-04 Samsung Electro-Mechanics Co Ltd 側面放出型発光ダイオードパッケージ
JP2012231023A (ja) * 2011-04-26 2012-11-22 Enplas Corp 光束制御部材、この光束制御部材を備えた発光装置およびこの発光装置を備えた面光源装置。
WO2018066418A1 (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置
JP2018061024A (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251785A (ja) * 2005-02-03 2010-11-04 Samsung Electro-Mechanics Co Ltd 側面放出型発光ダイオードパッケージ
JP2012231023A (ja) * 2011-04-26 2012-11-22 Enplas Corp 光束制御部材、この光束制御部材を備えた発光装置およびこの発光装置を備えた面光源装置。
WO2018066418A1 (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置
JP2018061024A (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置

Similar Documents

Publication Publication Date Title
JPS5977249U (ja) 横方向出力発光ダイオ−ド装置
JPS5950455U (ja) 発光ダイオ−ド装置
JPS6045453U (ja) 表示用発光ダイオ−ド
JPS587364U (ja) 発光ダイオ−ドランプ
JPH0651001Y2 (ja) 光結合素子
JPH01266771A (ja) 発光ダイオードランプ
JPS60153538U (ja) 半導体素子
JPS6240854U (ja)
JPS6035555U (ja) シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド
JPS5872859U (ja) 低損失光散乱発光ダイオ−ド
JPS5916163U (ja) デユアル・インライン・パツケ−ジ型平面発光ダイオ−ド
JPS6088571U (ja) 発光ダイオ−ドランプ
JPS611860U (ja) 発光ダイオ−ドランプ
JPS6045564U (ja) 発光ダイオ−ド整列光源
JPS592171U (ja) 発光ダイオ−ドランプ
JPS6025163U (ja) 発光ダイオ−ド
JPS61106059U (ja)
JPS6418766U (ja)
JPS5911459U (ja) 発光ダイオ−ド
JPS5981051U (ja) 指向性発光ダイオ−ド
JPS58155855U (ja) フアイバ−用発光ダイオ−ドの光源
JPS6079756U (ja) 光半導体装置
JPS58159763U (ja) 発光ダイオ−ド素子
JPS58190690U (ja) 発光装置
JPS6073262U (ja) 光結合器