JPS6035555U - シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド - Google Patents
シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ドInfo
- Publication number
- JPS6035555U JPS6035555U JP12715683U JP12715683U JPS6035555U JP S6035555 U JPS6035555 U JP S6035555U JP 12715683 U JP12715683 U JP 12715683U JP 12715683 U JP12715683 U JP 12715683U JP S6035555 U JPS6035555 U JP S6035555U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- line package
- light emitting
- planar light
- package planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は本考案の一実施例を示す斜視図。
1・・・光散乱形樹脂、2. 4. 6・・・可視発光
ダイ −オードチップ、3,5.7・・・ボンディ
ング線、8.10.12・・・アノードリード、9,1
0.13・・・カソード−リード。
ダイ −オードチップ、3,5.7・・・ボンディ
ング線、8.10.12・・・アノードリード、9,1
0.13・・・カソード−リード。
Claims (1)
- 光散乱形樹脂を用いてシングル・イン・ラインパッケー
ジ形状に樹脂成形し、広い平面を発光させることを特徴
とするシングル・イン・ラインパッケージ形可視発光ダ
イオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12715683U JPS6035555U (ja) | 1983-08-17 | 1983-08-17 | シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12715683U JPS6035555U (ja) | 1983-08-17 | 1983-08-17 | シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6035555U true JPS6035555U (ja) | 1985-03-11 |
Family
ID=30288897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12715683U Pending JPS6035555U (ja) | 1983-08-17 | 1983-08-17 | シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6035555U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6317723U (ja) * | 1986-07-19 | 1988-02-05 | ||
JP2006173359A (ja) * | 2004-12-16 | 2006-06-29 | Nichia Chem Ind Ltd | 発光装置 |
JP2006269785A (ja) * | 2005-03-24 | 2006-10-05 | Nichia Chem Ind Ltd | 発光素子及び発光装置 |
-
1983
- 1983-08-17 JP JP12715683U patent/JPS6035555U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6317723U (ja) * | 1986-07-19 | 1988-02-05 | ||
JP2006173359A (ja) * | 2004-12-16 | 2006-06-29 | Nichia Chem Ind Ltd | 発光装置 |
JP2006269785A (ja) * | 2005-03-24 | 2006-10-05 | Nichia Chem Ind Ltd | 発光素子及び発光装置 |
JP4542453B2 (ja) * | 2005-03-24 | 2010-09-15 | 日亜化学工業株式会社 | 発光装置 |
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