JPS6035555U - シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド - Google Patents

シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド

Info

Publication number
JPS6035555U
JPS6035555U JP12715683U JP12715683U JPS6035555U JP S6035555 U JPS6035555 U JP S6035555U JP 12715683 U JP12715683 U JP 12715683U JP 12715683 U JP12715683 U JP 12715683U JP S6035555 U JPS6035555 U JP S6035555U
Authority
JP
Japan
Prior art keywords
emitting diode
line package
light emitting
planar light
package planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12715683U
Other languages
English (en)
Inventor
黒羽　正之
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12715683U priority Critical patent/JPS6035555U/ja
Publication of JPS6035555U publication Critical patent/JPS6035555U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す斜視図。 １・・・光散乱形樹脂、２．　４．　６・・・可視発光
ダイ　　　−オードチップ、３，５．７・・・ボンディ
ング線、８．１０．１２・・・アノードリード、９，１
０．１３・・・カソード−リード。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光散乱形樹脂を用いてシングル・イン・ラインパッケー
    ジ形状に樹脂成形し、広い平面を発光させることを特徴
    とするシングル・イン・ラインパッケージ形可視発光ダ
    イオード。
JP12715683U 1983-08-17 1983-08-17 シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド Pending JPS6035555U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12715683U JPS6035555U (ja) 1983-08-17 1983-08-17 シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12715683U JPS6035555U (ja) 1983-08-17 1983-08-17 シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド

Publications (1)

Publication Number Publication Date
JPS6035555U true JPS6035555U (ja) 1985-03-11

Family

ID=30288897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12715683U Pending JPS6035555U (ja) 1983-08-17 1983-08-17 シングル・イン・ラインパッケ−ジ形平面発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS6035555U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317723U (ja) * 1986-07-19 1988-02-05
JP2006173359A (ja) * 2004-12-16 2006-06-29 Nichia Chem Ind Ltd 発光装置
JP2006269785A (ja) * 2005-03-24 2006-10-05 Nichia Chem Ind Ltd 発光素子及び発光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317723U (ja) * 1986-07-19 1988-02-05
JP2006173359A (ja) * 2004-12-16 2006-06-29 Nichia Chem Ind Ltd 発光装置
JP2006269785A (ja) * 2005-03-24 2006-10-05 Nichia Chem Ind Ltd 発光素子及び発光装置
JP4542453B2 (ja) * 2005-03-24 2010-09-15 日亜化学工業株式会社 発光装置

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