JPS59164258U - 発光ダイオ−ド - Google Patents
発光ダイオ−ドInfo
- Publication number
- JPS59164258U JPS59164258U JP5882483U JP5882483U JPS59164258U JP S59164258 U JPS59164258 U JP S59164258U JP 5882483 U JP5882483 U JP 5882483U JP 5882483 U JP5882483 U JP 5882483U JP S59164258 U JPS59164258 U JP S59164258U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- resin
- metal base
- visible light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案の一実施例を示す断面図。
１・・・・・・光散乱形または透明形樹脂、２・・・・
・・ボンディング線、３・・・・・・可視発光ダイオー
ドチップ、４・・・・・・金属ベース、５・・・・・・
ガラス、６・・・・・・アノードリード、７・・・・・
・カソードリード。
・・ボンディング線、３・・・・・・可視発光ダイオー
ドチップ、４・・・・・・金属ベース、５・・・・・・
ガラス、６・・・・・・アノードリード、７・・・・・
・カソードリード。
Claims (1)
- 樹脂封止形可視発光ダイオードにおいて、放物面状反射
板を有する金属ベースを用いて、ドーム形状に金属ベー
ス全体を包む様に樹脂成形したことを特徴とする発光ダ
イオード。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882483U JPS59164258U (ja) | 1983-04-20 | 1983-04-20 | 発光ダイオ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882483U JPS59164258U (ja) | 1983-04-20 | 1983-04-20 | 発光ダイオ−ド |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59164258U true JPS59164258U (ja) | 1984-11-02 |
Family
ID=30189093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5882483U Pending JPS59164258U (ja) | 1983-04-20 | 1983-04-20 | 発光ダイオ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59164258U (ja) |
-
1983
- 1983-04-20 JP JP5882483U patent/JPS59164258U/ja active Pending
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