JPS5849455U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS5849455U
JPS5849455U JP14481481U JP14481481U JPS5849455U JP S5849455 U JPS5849455 U JP S5849455U JP 14481481 U JP14481481 U JP 14481481U JP 14481481 U JP14481481 U JP 14481481U JP S5849455 U JPS5849455 U JP S5849455U
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
diode lamp
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14481481U
Other languages
English (en)
Inventor
藤田　貞三
Original Assignee
和泉電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 和泉電気株式会社 filed Critical 和泉電気株式会社
Priority to JP14481481U priority Critical patent/JPS5849455U/ja
Publication of JPS5849455U publication Critical patent/JPS5849455U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
柴　　　第１図は、この考案に係る発光ダイオードラン
Ｌ　　プの正面図、第２図は同じく縦断正面図、第３図
こ　　は従来の発光ダイオードランプの正面図テする。 ）　　　１・・・・・・発光ダイオード、２・・・・・
・透光性樹脂、３゜＝３′・・・・・・リード端子、４
・・・・・・抵抗、５・・・・・・スワン式電球口金、
６・・・・・・絶縁ブロック、７・・・・・・接触子、
２０・・・・・・凹凸部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光ダイオードと抵抗とをリード線を介してお続して、
    透光性樹脂にて二律的にモールドし、ｆつ外形をスワン
    式電球口金と同一形状に構成し７発光ダイオードランプ
    の発光ダイオード前面部σ樹脂表面に光拡散用の凹凸部
    を形成してなるこ２を特徴とする発光ダイオードランプ
    。
JP14481481U 1981-09-28 1981-09-28 発光ダイオ−ドランプ Pending JPS5849455U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14481481U JPS5849455U (ja) 1981-09-28 1981-09-28 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14481481U JPS5849455U (ja) 1981-09-28 1981-09-28 発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS5849455U true JPS5849455U (ja) 1983-04-04

Family

ID=29937765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14481481U Pending JPS5849455U (ja) 1981-09-28 1981-09-28 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS5849455U (ja)

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