JPS5849455U - 発光ダイオ−ドランプ - Google Patents
発光ダイオ−ドランプInfo
- Publication number
- JPS5849455U JPS5849455U JP14481481U JP14481481U JPS5849455U JP S5849455 U JPS5849455 U JP S5849455U JP 14481481 U JP14481481 U JP 14481481U JP 14481481 U JP14481481 U JP 14481481U JP S5849455 U JPS5849455 U JP S5849455U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- light emitting
- diode lamp
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
柴 第1図は、この考案に係る発光ダイオードラン
L プの正面図、第2図は同じく縦断正面図、第3図
こ は従来の発光ダイオードランプの正面図テする。 ) 1・・・・・・発光ダイオード、2・・・・・
・透光性樹脂、3゜=3′・・・・・・リード端子、4
・・・・・・抵抗、5・・・・・・スワン式電球口金、
6・・・・・・絶縁ブロック、7・・・・・・接触子、
20・・・・・・凹凸部。
L プの正面図、第2図は同じく縦断正面図、第3図
こ は従来の発光ダイオードランプの正面図テする。 ) 1・・・・・・発光ダイオード、2・・・・・
・透光性樹脂、3゜=3′・・・・・・リード端子、4
・・・・・・抵抗、5・・・・・・スワン式電球口金、
6・・・・・・絶縁ブロック、7・・・・・・接触子、
20・・・・・・凹凸部。
Claims (1)
- 発光ダイオードと抵抗とをリード線を介してお続して、
透光性樹脂にて二律的にモールドし、fつ外形をスワン
式電球口金と同一形状に構成し7発光ダイオードランプ
の発光ダイオード前面部σ樹脂表面に光拡散用の凹凸部
を形成してなるこ2を特徴とする発光ダイオードランプ
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14481481U JPS5849455U (ja) | 1981-09-28 | 1981-09-28 | 発光ダイオ−ドランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14481481U JPS5849455U (ja) | 1981-09-28 | 1981-09-28 | 発光ダイオ−ドランプ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5849455U true JPS5849455U (ja) | 1983-04-04 |
Family
ID=29937765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14481481U Pending JPS5849455U (ja) | 1981-09-28 | 1981-09-28 | 発光ダイオ−ドランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5849455U (ja) |
-
1981
- 1981-09-28 JP JP14481481U patent/JPS5849455U/ja active Pending
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